Memory device having vertical structure
A memory device includes a cell wafer including a memory cell array; and a peripheral wafer including a row control circuit, a column control circuit and a peripheral circuit which control the memory cell array, and stacked on and bonded to the cell wafer in a first direction. The peripheral wafer includes a first substrate having a first surface and a second surface which face away from each other in the first direction; a first logic structure disposed on the first surface of the first substrate, and including the row control circuit and the column control circuit; and a second logic structure disposed on the second surface of the first substrate, and including the peripheral circuit.
1. A memory device comprising:
a cell wafer including a memory cell array;
a first peripheral wafer, including a row control circuit and a column control circuit; and
a second peripheral wafer, including a peripheral circuit,
wherein the first peripheral wafer and the second peripheral wafer are stacked on the cell wafer in a first direction, and
the row control circuit, the column control circuit and the peripheral circuit control the memory cell array,
wherein the peripheral circuit generates a row address and a page buffer control signal in response to a command signal, an address signal and a control signal from a memory controller,
wherein the peripheral circuit provides the row address to the row control circuit and provides the page buffer control signal to the column control circuit.
2. The memory device according to claim 1 , wherein the first peripheral wafer is closer to the cell wafer in the first direction than the second peripheral wafer.
3. The memory device according to claim 2 ,
wherein the first peripheral wafer further includes, on one surface thereof bonded to the second peripheral wafer, a plurality of first bonding pads that are coupled to the row control circuit or the column control circuit, and
wherein the second peripheral wafer further includes, on the second surface, a plurality of second bonding pads that are coupled to the peripheral circuit and are bonded to the plurality of first bonding pads.
4. The memory device according to claim 2 ,
wherein the first peripheral wafer further includes, on one surface thereof bonded to the cell wafer, a plurality of first bonding pads, each coupled to the row control circuit or the column control circuit, and
wherein the cell wafer further includes, on one surface thereof bonded to the first peripheral wafer, a plurality of second bonding pads that are coupled to the memory cell array and are bonded respectively to the plurality of first bonding pads.
5. The memory device according to claim 1 , wherein the memory cell array comprises:
a plurality of word lines and a plurality of interlayer dielectric layers alternately stacked on a substrate; and
a plurality of vertical channels passing through the plurality of word lines and the plurality of interlayer dielectric layers.