Fin-based semiconductor device structure including self-aligned contacts and method for forming the same
A semiconductor device structure is provided. The semiconductor device structure includes a fin structure formed over a substrate, and a gate structure formed over the fin structure. The gate structure includes a gate dielectric layer, a first conductive layer over the first conductive layer. The gate structure includes a fill layer over the first conductive layer. The semiconductor device structure includes a protection layer formed over the fill layer, and a top surface of the gate dielectric layer is lower than a top surface of the protection layer and higher than a top surface of the first conductive layer.
1. A semiconductor device structure, comprising:
a fin structure formed over a substrate;
a gate structure formed over the fin structure, wherein the gate structure comprises:
a gate dielectric layer;
a first conductive layer over the gate dielectric layer; and
a fill layer over the first conductive layer;
a protection layer formed over the fill layer, wherein a top surface of the gate dielectric layer is lower than a top surface of the protection layer and higher than a top surface of the first conductive layer;
a gate spacer layer formed adjacent to the gate structure; and
an insulating layer formed over the protection layer, wherein the protection layer is separated from the gate spacer layer by the insulating layer, and a top surface of the gate spacer layer is higher than a top surface of the protection layer.
2. The semiconductor device structure as claimed in claim 1 , further comprising:
a gate contact structure formed over the protection layer, wherein the gate contact structure is electrically connected to the gate structure by the protection layer.
3. The semiconductor device structure as claimed in claim 1 , wherein a sidewall of the protection layer is aligned with a sidewall of the gate dielectric layer.
4. The semiconductor device structure as claimed in claim 1 , further comprising:
a second conductive layer between the first conductive layer and the fill layer, wherein the second conductive layer has a step-shaped structure.
5. The semiconductor device structure as claimed in claim 1 , further comprising:
a second conductive layer below the first conductive layer, wherein a top surface of the first conductive layer is leveled with a top surface of the second conductive layer.
6. The semiconductor device structure as claimed in claim 1 , wherein the fill layer is separated from the gate dielectric layer by the first conducive layer.
7. The semiconductor device structure as claimed in claim 1 , wherein a sidewall of the protection layer is aligned with a sidewall of the fill layer.
8. The semiconductor device structure as claimed in claim 1 , wherein the insulating layer comprises a protruding portion in direct contact with the gate dielectric layer.
9. The semiconductor device structure as claimed in claim 1 , wherein the top surface of the gate dielectric layer is lower than a top surface of the gate spacer layer.
10. A semiconductor device structure, comprising:
a fin structure formed over a substrate, wherein the fin structure comprises a plurality of nanostructures;
a gate structure formed over the nanostructures, wherein the gate structure comprises:
a gate dielectric layer formed over the nanostructures;
a first conductive layer formed over the gate dielectric layer, wherein a topmost surface of the first conductive layer is lower than a top surface of the gate dielectric layer;
a fill layer formed over the first conductive layer; and
a protection layer formed over the fill layer, wherein the protection layer is a conductive layer; and
a gate spacer layer formed adjacent to the gate structure, wherein an outer sidewall surface of the gate spacer layer extends beyond a sidewall surface of the protection layer.
11. The semiconductor device structure as claimed in claim 10 ,
wherein the top surface of the gate dielectric layer is lower than a top surface of the gate spacer layer.
12. The semiconductor device structure as claimed in claim 10 , wherein the protection layer is not in direct contact with the first conductive layer.
13. The semiconductor device structure as claimed in claim 10 , further comprising:
a second conductive layer between the first conductive layer and the fill layer, wherein the fill layer has a surface in direct contact with a top surface of the first conductive layer and a top surface of the second conductive layer.
14. The semiconductor device structure as claimed in claim 10 , wherein a portion of the fill layer is lower than the topmost surface of the first conductive layer.
15. The semiconductor device structure as claimed in claim 10 , wherein a sidewall of the protection layer is aligned with a sidewall of the gate dielectric layer.
16. The semiconductor device structure as claimed in claim 10 , further comprising:
a second conductive layer formed over the first conductive layer, wherein a portion of the fill layer is embedded in the second conductive layer.
17. A method for forming a semiconductor device structure, comprising:
forming a fin structure over a substrate;
forming a dummy gate structure over the fin structure;
forming a dielectric layer over the dummy gate structure;
forming a gate spacer layer adjacent to the dummy gate structure;
removing the dummy gate structure to form a trench in the dielectric layer;
forming a gate dielectric layer in the trench;
forming a first layer over the gate dielectric layer, wherein a top surface of the first layer is lower than a top surface of the gate spacer layer;
forming a fill layer over the first layer;
forming a protection layer over the fill layer; and
forming an insulating layer on the protection layer, wherein a top surface and sidewall surfaces of the protection layer are covered by the insulating layer, and a portion of the insulating layer is in direct contact with the gate spacer layer.
18. The method for forming the semiconductor device structure as claimed in claim 17 , further comprising:
removing a top portion of the fill layer, such that a top surface of the fill layer is leveled with a top surface of the gate dielectric layer.
19. The method for forming the semiconductor device structure as claimed in claim 18 , further comprising:
forming a gate contact structure over the protection layer, wherein a bottom surface of the gate contact structure is lower than a top surface of the gate spacer layer.
20. The method for forming the semiconductor device structure as claimed in claim 17 , further comprising:
forming a second layer between the first layer and the fill layer, wherein the first layer and the second layer are made of different materials.