Semiconductor transistor device structure including nanostructure and gate structure with protection layer and fill layer and method for forming the same
A semiconductor device structure is provided. The semiconductor device structure includes a gate structure formed over nanostructures. The gate structure includes a gate dielectric layer, and a fill layer over the gate dielectric layer. The semiconductor device structure includes a protection layer formed over the fill layer, and a gate spacer layer formed adjacent to the gate structure. The semiconductor device structure includes an insulating layer formed over the protection layer, and the insulating layer is in direct contact with the gate spacer layer.
1 . A semiconductor device structure, comprising:
a gate structure formed over nanostructures, wherein the gate structure comprises:
a gate dielectric layer; and
a metal layer over the gate dielectric layer;
a protection layer formed over the metal layer;
a gate spacer layer formed adjacent to the gate structure; and
an insulating layer formed over the protection layer, wherein a portion of the insulating layer is between the protection layer and the gate spacer layer.
2 . The semiconductor device structure as claimed in claim 1 , further comprising:
a gate contact structure formed over the protection layer, wherein a bottom surface of the gate contact structure is lower than a top surface of the gate spacer layer.
3 . The semiconductor device structure as claimed in claim 1 , wherein the portion of the insulating layer is lower than a top surface of the protection layer.
4 . The semiconductor device structure as claimed in claim 1 , wherein a sidewall surface of one of the nanostructures extends beyond a sidewall surface of the gate spacer layer.
5 . The semiconductor device structure as claimed in claim 1 , further comprising:
an S/D structure formed adjacent to the gate structure, wherein a sidewall surface of the S/D structure is in direct contact with the gate spacer layer.
6 . The semiconductor device structure as claimed in claim 5 , further comprising:
an inner spacer layer between the gate structure and the S/D structure, wherein a sidewall surface of one of the nanostructures extends beyond a sidewall surface of the inner spacer layer.
7 . The semiconductor device structure as claimed in claim 1 , wherein the gate structure wraps around the nanostructures.
8 . A semiconductor device structure, comprising:
a plurality of nanostructures;
a gate structure formed over the nanostructures, wherein the gate structure comprises:
a gate dielectric layer formed over the nanostructures;
a metal layer formed on the gate dielectric layer;
a gate spacer layer formed adjacent to the gate structure; and
a protection layer formed over the metal layer, wherein a top surface of the protection layer is higher than a top surface of the gate dielectric layer and lower than a top surface of the gate spacer layer.
9 . The semiconductor device structure as claimed in claim 8 , wherein an outer sidewall surface of the protection layer is aligned with an outer sidewall surface of the metal layer.
10 . The semiconductor device structure as claimed in claim 8 , further comprising:
a gate contact structure formed over the protection layer, wherein the gate contact structure is electrically connected to the gate structure by the protection layer.
11 . The semiconductor device structure as claimed in claim 10 ,
wherein a bottom surface of the gate contact structure is lower than a top surface of the gate spacer layer.
12 . The semiconductor device structure as claimed in claim 11 , wherein a top surface of the protection layer is lower than a top surface of the gate spacer layer.
13 . The semiconductor device structure as claimed in claim 11 , wherein a sidewall surface of one of the nanostructures extends beyond a sidewall surface of the gate spacer layer.
14 . The semiconductor device structure as claimed in claim 8 , further comprising:
an S/D structure formed adjacent to the gate structure, wherein the S/D structure comprises a plurality of portions, and each of the portions are surrounded by the nanostructures.
15 . The semiconductor device structure as claimed in claim 14 , further comprising:
an inner spacer layer between the gate structure and the S/D structure, wherein a sidewall surface of one of the nanostructures extends beyond a sidewall surface of the inner spacer layer.
16 . A method for forming a semiconductor device structure, comprising:
forming a fin structure over a substrate;
forming a dummy gate structure over the fin structure;
forming a gate spacer layer adjacent to the dummy gate structure;
forming a dielectric layer over the dummy gate structure;
removing the dummy gate structure to form a trench in the dielectric layer;
forming a gate dielectric layer in the trench;
forming a fill layer over the gate dielectric layer;
forming a protection layer over the fill layer;
forming an insulating layer on the protection layer, wherein a portion of the insulating layer is lower than a top surface of the protection layer;
removing a portion of the insulating layer to form an opening and to expose the protection layer; and
forming a gate contact structure in the opening, wherein a bottom surface of the gate contact structure is lower than a top surface of the gate spacer layer.
17 . The method for forming the semiconductor device structure as claimed in claim 16 , further comprising:
forming a first layer over the gate dielectric layer;
forming a second layer over the first layer; and
forming the fill layer over the second layer, wherein the fill layer is separate from the first layer by the second layer.
18 . The method for forming the semiconductor device structure as claimed in claim 16 , wherein the fin structure comprises a plurality of first semiconductor material layers and a plurality of second semiconductor material layers alternatively stacked, and the method comprises: removing a portion of the first semiconductor material layers to form a plurality of S/D trenches.
19 . The method for forming the semiconductor device structure as claimed in claim 18 , further comprising:
forming an S/D structure in the S/D trenches, wherein the S/D structure comprises a plurality of portions which are surrounded by the second semiconductor material layers.
20 . The method for forming the semiconductor device structure as claimed in claim 16 , further comprising:
forming an etching stop layer on the insulating layer;
forming a dielectric layer on the etching stop layer; and
removing a portion of the dielectric layer and a portion of the etching stop layer to form the opening.