IP Library › Granted Patent US 12,131,774
Granted Patent B2
US 12,131,774 · App. 17/968,082 · Granted Oct 29, 2024

Vertical memory device with a double word line structure

Inventors: Seung-Hwan Kim (Seoul, KR); Su-Ock Chung (Seoul, KR); Seon-Yong Cha (Chungcheongbuk-do, KR)
Assignee: SK hynix Inc.
G11C11/4097G11C7/18G11C11/401H10B12/30
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Quick Facts
Patent No.
US 12,131,774
App. No.
17/968,082
Granted
Oct 29, 2024
Kind
B2
Abstract

A memory device includes: a substrate; a bit line which is vertically oriented from the substrate; a plate line which is vertically oriented from the substrate; and a memory cell provided with a transistor and a capacitor that are positioned in a lateral arrangement between the bit line and the plate line, wherein the transistor includes: an active layer which is laterally oriented to be parallel to the substrate between the bit line and the capacitor; and a line-shaped lower word line and a line-shaped upper word line vertically stacked with the active layer therebetween and oriented to intersect with the active layer.

Claims (24)

1. A memory device comprising:

a substrate;

a vertical conductive line oriented vertically over the substrate;

an active layer oriented laterally from the vertical conductive line;

a pair of line-shaped conductive lines disposed over the active layer;

a first node electrically connected to the active layer;

a second node over the first node; and

a dielectric material disposed between the first node and the second node,

wherein the pair of line-shaped conductive lines comprises:

a line-shaped lower conductive line disposed over a lower surface of the active layer; and

a line-shaped upper conductive line disposed over an upper surface of the active layer,

wherein the active layer includes:

a first source/drain region coupled to the vertical conductive line;

a second source/drain region coupled to the first node; and

a channel between the first source/drain region and a second source/drain region, and

the first source/drain region, the channel, and the second source/drain region are positioned in a lateral arrangement parallel to the substrate.

2. The memory device of claim 1 , wherein the pair of line-shaped conductive lines are vertically stacked with the channel therebetween.

3. The memory device of claim 1 , further comprising:

a gate dielectric layer which is formed between the pair of line-shaped conductive lines and the channel.

4. The memory device of claim 1 , wherein the lower and upper line-shaped conductive lines are set to the same potential and are electrically connected to each other.

5. The memory device of claim 1 , wherein the first node has a lateral cylindrical shape, and

the second node includes:

an inner second node extending into a cylindrical shape of the first node; and

a plurality of outer second nodes surrounding an outside of the cylindrical shape of the first node.

Priority Claims (1)
KR 10-2019-0024083 · Feb 28, 2019 · national
Continuity (2)
Continuation 16728174 · Dec 27, 2019
Related Publication 20230045324A1 · Feb 9, 2023
Cited By (1)
US 12,733,155