Polishing apparatus and polishing method
A current detection section detects a current value of a swing shaft motor 14 and generates a first output. A first processing section obtains a contact pressure corresponding to the first output from the first output using first data indicating a correspondence relationship between a contact pressure applied to a semiconductor wafer by a top ring and the first output. A second processing section obtains a second output corresponding to a contact pressure obtained by the first processing section using second data indicating a correspondence relationship between the contact pressure obtained by the first processing section and the second output.
1. A polishing apparatus for polishing a polishable object, the polishing apparatus comprising:
a polishing table that can hold a polishing pad;
a first electric motor that can drive to rotate the polishing table;
a holding section that can hold the polishable object and press the polishable object against the polishing pad;
a second electric motor that can drive to rotate the holding section;
a swing arm for holding the holding section;
a third electric motor that can swing the swing arm around a swing center of the swing arm;
detection circuitry configured to detect at least one of an electric current value of one electric motor of the first, second, or third electric motors, a torque command value of the one electric motor, a position command of the one electric motor, and a speed command of the one electric motor and generate a first output;
first processing circuitry configured to obtain a contact pressure corresponding to the first output from the first output using first data indicating a correspondence relationship between the contact pressure and the first output; and
second processing circuitry configured to obtain a second output corresponding to the contact pressure obtained by the first processing circuitry using second data indicating a correspondence relationship between the contact pressure obtained by the first processing circuitry and the second output,
wherein the second output is at least one of a corrected electric current value of the one electric motor, a corrected torque command value of the one electric motor, a corrected position command of the one electric motor, or a corrected speed command of the one electric motor, and
wherein the same second data can be used in a second polishing apparatus to obtain substantially the same second output for the same contact pressure using the same second data in the second polishing apparatus.
2. The polishing apparatus according to claim 1 , wherein the first data is a first relational expression expressing a correspondence relationship between the contact pressure applied to the polishable object by the holding section and the first output and/or the second data is a second relational expression expressing a correspondence relationship between the contact pressure applied to the polishable object by the holding section and the second output.
3. The polishing apparatus according to claim 2 , wherein the first relational expression is an expression expressing the first output using a polynomial of degree N regarding the contact pressure and the second relational expression is an expression expressing the second output using a polynomial of degree N regarding the contact pressure, where N is an integer equal to or greater than 2.
4. The polishing apparatus according to claim 1 , wherein the one electric motor is provided with a three-phase winding, and
the detection circuitry can detect current values in three phases of the one electric motor and generate the first output.
5. The polishing apparatus according to claim 4 , wherein the detection circuitry can generate a sum of absolute values of the current values in three phases of the one electric motor as the first output.
6. The polishing apparatus according to claim 4 , wherein the detection circuitry can generate a sum of squares of absolute values of the current values in three phases of the one electric motor as the first output.
7. The polishing apparatus according to claim 1 , further comprising end point detection circuitry that can detect a polishing end point indicating an end of polishing based on the second output.
8. A polishing system comprising a plurality of the polishing apparatuses according to claim 1 , wherein the second data is data common to the plurality of polishing apparatuses.
9. A substrate processing apparatus comprising a plurality of the polishing apparatuses according to claim 1 , wherein the second data is data common to the plurality of polishing apparatuses and the substrate processing apparatus comprises a cleaning apparatus that can clean a plurality of polishable objects polished by the plurality of polishing apparatuses and a housing for housing the plurality of polishing apparatuses and the cleaning apparatus.