Plasma processing apparatus and plasma processing method
There is a plasma processing apparatus comprising: a chamber; a substrate support provided in the chamber, the substrate support including a bias electrode; a plasma generator configured to generate plasma from a gas in the chamber; and a bias power supply electrically connected to the bias electrode and configured to generate a sequence of a plurality of voltage pulses applied to the bias electrode, wherein each of the plurality of voltage pulses has a leading edge period in which the voltage pulse transitions from a reference voltage level to a pulse voltage level and a trailing edge period in which the voltage pulse transitions from the pulse voltage level to the reference voltage level, and at least one of a time length of the leading edge period and a time length of the trailing edge period is greater than 0 seconds and less than or equal to 0.5 microseconds.
1. A plasma processing apparatus comprising:
a chamber;
a substrate support provided in the chamber, the substrate support including a bias electrode;
a plasma generator configured to generate plasma from a gas in the chamber; and
a bias power supply electrically connected to the bias electrode and configured to generate a sequence of a plurality of voltage pulses applied to the bias electrode,
wherein each of the plurality of voltage pulses has a leading edge period in which the voltage pulse transitions from a reference voltage level to a pulse voltage level and a trailing edge period in which the voltage pulse transitions from the pulse voltage level to the reference voltage level, and
at least one of a time length of the leading edge period and a time length of the trailing edge period is greater than 0 seconds and less than or equal to 0.5 microseconds.
2. The plasma processing apparatus of claim 1 , wherein the at least one of the time length of the leading edge period and the time length of the trailing edge period is greater than 0 seconds and less than or equal to 0.25 microseconds.
3. The plasma processing apparatus of claim 1 , wherein the at least one of the time length of the leading edge period and the time length of the trailing edge period is greater than or equal to 0.05 microseconds.
4. The plasma processing apparatus of claim 1 , wherein each of the plurality of voltage pulses transitions to at least one different voltage level between the reference voltage level and the pulse voltage level during at least one of the leading edge period and the trailing edge period.
5. The plasma processing apparatus of claim 1 , wherein each of the plurality of voltage pulses is a negative voltage pulse.
6. The plasma processing apparatus of claim 5 , wherein the pulse voltage level is greater than or equal to −20 kV and less than or equal to −0.5 kV.
7. The plasma processing apparatus of claim 5 , wherein the reference voltage level is 0 V.
8. The plasma processing apparatus of claim 1 , wherein the bias power supply is configured to periodically apply the plurality of voltage pulses to the bias electrode.
9. The plasma processing apparatus of claim 1 , wherein the bias power supply includes:
a direct current (DC) power supply; and
a pulse unit provided between the DC power supply and the bias electrode, and
wherein the pulse unit includes:
a first switching element and a second switching element connected in series between a positive electrode and a negative electrode of the DC power supply; and
an impedance circuit connected between the bias electrode and a node between the first switching element and the second switching element.
10. The plasma processing apparatus of claim 9 , further comprising a pulse controller configured to control the pulse unit,
wherein the pulse controller is configured to alternately perform a first control that closes the first switching element and opens the second switching element and a second control that opens the first switching element and closes the second switching element.
11. The plasma processing apparatus of claim 9 , wherein the impedance circuit includes an inductor and a resistor element connected in series between the node and the bias electrode.
12. The plasma processing apparatus of claim 1 , wherein the plasma generator includes a high-frequency power supply.
13. A plasma processing method comprising:
providing a substrate on a substrate support in a chamber of a plasma processing apparatus;
generating plasma in the chamber; and
applying a sequence of a plurality of voltage pulses to the substrate support in a state in which the plasma is generated in the chamber,
wherein each of the plurality of voltage pulses has a leading edge period in which the voltage pulse transitions from a reference voltage level to a pulse voltage level and a trailing edge period in which the voltage pulse transitions from the pulse voltage level to the reference voltage level, and
at least one of a time length of the leading edge period and a time length of the trailing edge period is greater than 0 seconds and less than or equal to 0.5 microseconds.
14. A plasma processing apparatus comprising:
a chamber;
a substrate support provided in the chamber, the substrate support including a bias electrode;
a plasma generator configured to generate plasma from a gas in the chamber; and
a bias power supply electrically connected to the bias electrode and configured to generate a sequence of a plurality of voltage pulses applied to the bias electrode, wherein the bias power supply includes a direct current (DC) power supply and a pulse unit provided between the DC power supply and the bias electrode, and
the pulse unit includes a first switching element and a second switching element connected in series between a positive electrode and a negative electrode of the DC power supply, and an impedance circuit connected between the bias electrode and a node between the first switching element and the second switching element.
15. The plasma processing apparatus of claim 14 , further comprising a pulse controller configured to control the pulse unit,
wherein the pulse controller is configured to alternately perform a first control that closes the first switching element and opens the second switching element and a second control that opens the first switching element and closes the second switching element.
16. The plasma processing apparatus of claim 14 , wherein the impedance circuit includes an inductor and a resistor element connected in series between the node and the bias electrode.