Substrate processing apparatus and substrate processing method
A substrate processing apparatus includes a holder, a nozzle arm and a position adjusting device. The holder is configured to hold a substrate. The nozzle arm has a nozzle configured to supply a processing liquid to a peripheral portion of the substrate. The position adjusting device is provided at the nozzle arm and is configured to adjust a position of the substrate to a given position on the holder.
1. A substrate processing apparatus, comprising:
a holder configured to hold a substrate;
a nozzle arm comprising a nozzle configured to supply a processing liquid to a peripheral portion of the substrate; and
a position adjusting device supported by the nozzle arm and configured to adjust a position of the substrate to a given position on the holder,
wherein the nozzle and the position adjusting device are provided at the same nozzle arm, and
the nozzle is disposed to extend from a processing liquid supply, which is located next to the position adjusting device, to a position between the position adjusting device and the substrate.
2. The substrate processing apparatus of claim 1 ,
wherein the nozzle arm includes a pair of nozzle arms, and
each of the pair of nozzle arms comprises the position adjusting device, and the pair of nozzle arms are placed to face each other with the holder therebetween.
3. The substrate processing apparatus of claim 2 ,
wherein the position adjusting device is disposed higher than the nozzle.
4. The substrate processing apparatus of claim 2 ,
wherein a discharge position of the processing liquid discharged to the substrate from a discharge opening of the nozzle is located between a center of the substrate and the position adjusting device, when viewed from a top.
5. The substrate processing apparatus of claim 2 ,
wherein the nozzle comprises:
a curved part provided between a connection part to the nozzle arm and a discharge opening through which the processing liquid is discharged; and
an extension part extending from the curved part to the discharge opening.
6. The substrate processing apparatus of claim 2 , further comprising:
a controller configured to control the holder, the nozzle arm and the position adjusting device,
wherein when the holder is placed at a raised position, the controller moves the nozzle arm in a horizontal direction to perform a position adjustment of the substrate placed on the holder, and
when the holder is placed at a lowered position, the controller moves the nozzle arm to a processing position to perform a liquid processing on the substrate placed on the holder.
7. The substrate processing apparatus of claim 2 , further comprising:
a controller configured to control the holder, the nozzle arm and the position adjusting device,
wherein when the nozzle arm is placed at a lowered position, the controller moves the nozzle arm in a horizontal direction to perform a position adjustment of the substrate placed on the holder, and
when the nozzle arm is placed at a raised position, the controller moves the nozzle arm to a processing position to perform a liquid processing on the substrate placed on the holder.
8. The substrate processing apparatus of claim 1 ,
wherein the position adjusting device is disposed higher than the nozzle.
9. The substrate processing apparatus of claim 8 ,
wherein a discharge position of the processing liquid discharged to the substrate from a discharge opening of the nozzle is located between a center of the substrate and the position adjusting device, when viewed from a top.
10. The substrate processing apparatus of claim 8 ,
wherein the nozzle comprises:
a curved part provided between a connection part to the nozzle arm and a discharge opening through which the processing liquid is discharged; and
an extension part extending from the curved part to the discharge opening.
11. The substrate processing apparatus of claim 1 ,
wherein a discharge position of the processing liquid discharged to the substrate from a discharge opening of the nozzle is located between a center of the substrate and the position adjusting device, when viewed from a top.
12. The substrate processing apparatus of claim 11 ,
wherein the nozzle comprises:
a curved part provided between a connection part to the nozzle arm and the discharge opening through which the processing liquid is discharged; and
an extension part extending from the curved part to the discharge opening.
13. The substrate processing apparatus of claim 1 ,
wherein the nozzle comprises:
a curved part provided between a connection part to the nozzle arm and a discharge opening through which the processing liquid is discharged; and
an extension part extending from the curved part to the discharge opening.
14. The substrate processing apparatus of claim 13 ,
wherein the nozzle comprises a discharge opening member configured to be attached to/detached from the extension part.
15. The substrate processing apparatus of claim 14 ,
wherein a path formed in the discharge opening member is thinner than a path formed in a part of the nozzle other than the discharge opening member.
16. The substrate processing apparatus of claim 1 , further comprising:
a controller configured to control the holder, the nozzle arm and the position adjusting device,
wherein when the holder is placed at a raised position, the controller moves the nozzle arm in a horizontal direction to perform a position adjustment of the substrate placed on the holder, and
when the holder is placed at a lowered position, the controller moves the nozzle arm to a processing position to perform a liquid processing on the substrate placed on the holder.
17. The substrate processing apparatus of claim 1 , further comprising:
a controller configured to control the holder, the nozzle arm and the position adjusting device,
wherein when the nozzle arm is placed at a lowered position, the controller moves the nozzle arm in a horizontal direction to perform a position adjustment of the substrate placed on the holder, and
when the nozzle arm is placed at a raised position, the controller moves the nozzle arm to a processing position to perform a liquid processing on the substrate placed on the holder.
18. The substrate processing apparatus of claim 1 , wherein the position adjusting device has direct contact with the substrate.
19. A substrate processing method, comprising:
placing a substrate on a holder;
adjusting a position of the substrate to a given position on the holder by using a position adjusting device supported by a nozzle arm;
holding the substrate by the holder; and
processing a peripheral portion of the substrate with a processing liquid supplied from a nozzle which is provided at the nozzle arm,
wherein the nozzle and the position adjusting device are provided at the same nozzle arm, and
the nozzle is disposed to extend from a processing liquid supply, which is located next to the position adjusting device, to a position between the position adjusting device and the substrate.
20. The substrate processing method of claim 19 , further comprising:
moving the holder to a raised position before the adjusting of the position of the substrate to the given position; and
moving the holder to a lowered position after the adjusting of the position of the substrate to the given position.
21. The substrate processing method of claim 19 , further comprising:
moving the nozzle arm to a lowered position before the adjusting of the position of the substrate to the given position; and
moving the nozzle arm to a raised position after the adjusting of the position of the substrate to the given position.