Printed circuit board

1. A circuit board comprising:

a base insulating layer;

an upper insulating layer disposed on the base insulating layer and including a cavity;

a circuit layer embedded in the upper insulating layer;

an electronic device disposed in the cavity of the upper insulating layer, and

wherein the upper insulating layer includes an inner wall surface forming the cavity,

wherein the inner wall surface includes:

a first surface having a first inclination angle with respect to an upper surface of the base insulating layer;

a second surface disposed on the first surface and having a second inclination angle different from the first inclination angle with respect to the upper surface of the base insulating layer; and

a contact portion that the first surface and the second surface directly contact to each other,

wherein the circuit layer includes a via electrode overlapped with the first surface of the cavity in a horizontal direction, and a circuit pattern disposed on the via electrode and not overlapping with the first surface along the horizontal direction while overlapping with the second surface along the horizontal direction; and

wherein the electronic device overlaps the via electrode, the circuit pattern, and the contact portion along the horizontal direction.

2. The circuit board of claim 1 , further comprising:

a protective insulating layer disposed on the upper insulating layer.

3. The circuit board of claim 2 , further comprising

a base circuit layer embedded in the base insulating layer,

wherein the base circuit layer includes a base via electrode passing through at least portion of the base insulating layer, and a base circuit pattern connected to the base via electrode, and

wherein a thickness in a vertical direction of the circuit pattern is equal to a thickness in the vertical direction of the base circuit pattern.

4. The circuit board of claim 2 , wherein the protective insulating layer includes a through hole, and

wherein the through hole of the protective insulating layer overlaps the cavity along a vertical direction.

5. The circuit board of claim 3 , wherein the first circuit layer further includes an upper via electrode disposed on the via electrode, and

wherein the upper via electrode does not overlap with the first surface along the horizontal direction and does overlap with the second surface along the horizontal direction.

6. The circuit board of claim 3 , wherein a thickness in a direction of the electronic device is greater than a thickness in a vertical direction of the via electrode.

7. The circuit board of claim 5 , wherein the electronic device is spaced apart from the first surface and the second surface along the horizontal direction.

8. The circuit board of claim 5 , wherein the upper via electrode and the via electrode gradually decrease in width toward the base insulating laver.

9. The circuit board of claim 7 , wherein the circuit layer overlaps the contact portion in the horizontal direction.

10. The circuit board of claim 9 , wherein the via electrode is disposed closer to the base insulating layer than the contact portion.

11. The circuit board of claim 1 , wherein the first inclination angle has an inclination angle of between 60° and 80%, and

wherein the second inclination angle has an inclination angle between 50° and 60°.

12. The circuit board of claim 1 , wherein the base insulating layer and the upper insulating layer are made of a same material.

13. A circuit board comprising

a base insulating layer;

an upper insulating layer disposed on the base insulating layer and including a cavity;

a circuit layer embedded in the upper insulating layer;

an electronic device disposed in the cavity of the upper insulating layer; and

a protective insulating layer disposed on the upper insulating layer,

wherein the upper insulating layer includes an inner wall surface forming the cavity;

wherein the inner wall surface includes:

a first surface having a first inclination angle with respect to an upper surface of the base insulating laver;

a second surface disposed on the first surface and having a second inclination angle smaller than the first inclination angle with respect to the upper surface of the base insulating layer; and

a contact portion that the first surface and the second surface directly contact to each other,

wherein the circuit layer includes a via electrode overlapped with the first surface of the cavity in a horizontal direction, and a circuit pattern disposed on the via electrode and not overlapping with the first surface along the horizontal direction while overlapping with the second surface along the horizontal direction, and

wherein the electronic device overlaps the via electrode the circuit pattern the first surface, the second surface and the contact portion along the horizontal direction.

14. The circuit board of claim 13 , wherein the contact portion overlaps the circuit layer in the horizontal direction.

15. The circuit board of claim 14 ,

wherein a thickness in a vertical direction of the electronic device is er than a thickness in a vertical direction of the via electrode.

16. The circuit board of claim 14 , wherein the via electrode is disposed closer to the base insulating layer than the contact portion.

17. The circuit board of claim 13 , wherein the first inclination angle has an inclination angle of between 60° and 80°, and

wherein the second inclination angle is smaller than the first inclination angle and has an inclination angle of between 50° and 60°.

18. The circuit board of claim 13 , further comprising:

a circuit layer embedded in the base insulating layer,

wherein the circuit layer includes a base via electrode passing through at least a portion of the base insulating laver, and a base wiring layer connected to the base via electrode, and

wherein a thickness in a vertical direction of the wiring portion is equal to a thickness in the vertical direction of the base wiring layer.

19. The circuit board of claim 18 , wherein the circuit layer further includes an upper via electrode disposed on the via electrode, and

wherein the upper via electrode does not overlap with the first surface along the horizontal direction and does overlap with the second surface along the horizontal direction.

20. The circuit board of claim 13 , wherein the protective insulating layer includes a through hole, and

wherein the through hole of the protective insulating layer overlaps the cavity along a vertical direction.