Circuit board and semiconductor package comprising same
A circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and having a width narrower than that of the first insulating layer; wherein an upper surface of the first insulating layer includes a first region vertically overlapping with the second insulating layer, and a second region excluding the first region, wherein the first circuit pattern includes an extension portion extending from the first region to the second region; and wherein a width of the extension portion in the second region is greater than a width of at least a part of the extension portion in the first region.
1 . A circuit board comprising:
an insulating layer;
a circuit pattern disposed on the insulating layer; and
a protective layer disposed on the insulating layer and having a width narrower than that of the insulating layer;
wherein an upper surface of the insulating layer includes a first region vertically overlapping with the protective layer, and a second region excluding the first region;
wherein the circuit pattern includes an extension portion extending from the first region to the second region; and
wherein a width of the extension portion in the second region is greater than a width of at least a part of the extension portion in the first region.
2 . The circuit board of claim 1 , wherein the extension portion includes a step portion having a width varying in a portion adjacent to the second region.
3 . The circuit board of claim 1 , wherein the circuit pattern includes a pad portion disposed in the first region;
wherein the extension portion includes:
a first portion positioned adjacent to the pad portion; and
a second portion disposed closer to the second region than the first portion; and
wherein a width of the first portion is different from a width of the second portion.
4 . The circuit board of claim 3 , wherein the width of the second portion of the extension portion is wider than the width of the first portion of the extension portion.
5 . The circuit board of claim 1 , wherein the second region includes an edge region of the upper surface of the insulating layer adjacent to an outermost end of the insulating layer.
6 . The circuit board of claim 3 , wherein the protective layer includes:
a first opening vertically overlapping with at least a part of an upper surface of the pad portion; and
a second opening vertically overlapping with the second region of the insulating layer; and
wherein the extension portion extends from the pad portion toward the second opening.
7 . The circuit board of claim 6 , further comprising:
a first surface treatment layer disposed on the upper surface of the pad portion vertically overlapping with the first opening.
8 . The circuit board of claim 4 , wherein the second region of the upper surface of the insulating layer is provided with a recess concave toward a lower surface of the insulating layer.
9 . The circuit board of claim 8 , wherein the recess is connected to one end of the second portion of the extension portion and an outermost end of the insulating layer.
10 . The circuit board of claim 9 , wherein a width of the recess is equal to the width of the second portion of the extension portion.
11 . The circuit board of claim 9 , wherein a lower surface of the recess is positioned on the same plane as a lower surface of the extension portion.
12 . A circuit board comprising:
an insulating layer; and
a circuit pattern disposed on the insulating layer;
wherein the circuit pattern includes:
a pad portion; and
an extension portion extending from the pad portion toward an outermost end of the insulating layer; and
wherein the extension portion includes a step portion having a width varying in a portion adjacent to the outermost end portion.
13 . The circuit board of claim 12 , further comprising:
a protective layer disposed on the insulating layer;
wherein the extension portion includes:
a first portion positioned adjacent to the pad portion and vertically overlapping the protective layer; and
a second portion disposed between the first portion and the outermost end of the insulating layer and vertically overlapping the insulating layer; and
wherein a width of the second portion is greater than a width of the first portion.
14 . The circuit board of claim 12 , further comprising:
a protective layer disposed on the insulating layer;
wherein an upper surface of the insulating layer includes:
a first region vertically overlapping with the protective layer; and
a second region excluding the first region;
wherein the extension portion includes:
a first portion positioned adjacent to the pad portion; and
a second portion disposed closer to the second region than the first portion; and
wherein a width of the second portion is greater than a width of the first portion.
15 . The circuit board of claim 14 , wherein the protective layer includes an opening vertically overlapping with the second region of the insulating layer;
wherein a recess provided in the second region of the upper surface of the insulating layer; and
wherein the recess vertically overlaps with the opening of the protective layer and is concave toward a lower surface of the insulating layer.
16 . A circuit board comprising:
an insulating layer;
a circuit pattern disposed on the insulating layer; and
a protective layer disposed on the insulating layer;
wherein an upper surface of the insulating layer includes:
a first region vertically overlapping with the protective layer; and
a second region excluding the first region;
wherein the circuit pattern includes:
a pad portion; and
an extension portion extending from the pad portion toward the second region;
wherein a recess is provided in the second region of the upper surface of the insulating layer; and
wherein the recess is concave toward a lower surface of the insulating layer, has a different width than the extension portion, and is connected to the extension portion.
17 . The circuit board of claim 16 , wherein the recess has a width wider than a width of the extension portion, and is connected to an outermost end of the insulating layer.
18 . A circuit board comprising:
an insulating layer;
a circuit pattern disposed on the insulating layer; and
a protective layer disposed on the insulating layer;
wherein an upper surface of the insulating layer includes:
a first region vertically overlapping with the protective layer, and
a second region excluding the first region;
wherein the circuit pattern includes:
a pad portion; and
an extension portion extending from the pad portion toward the second region; and
wherein the second region of the upper surface of the insulating layer includes a recess concave toward a lower surface of the insulating layer and including a step portion having a width varying in a portion adjacent to the second region.
19 . The circuit board of claim 18 , wherein the recess includes:
a first recess adjacent the extension portion; and
a second recess adjacent to an outermost end of the insulating layer; and
wherein a width of the first recess is different from a width of the second recess.
20 . The circuit board of claim 19 , wherein the width of the first recess is equal to a width of the extension portion; and
wherein the width of the second recess is greater than a width of the extension portion and a width of the first recess.