Embedded metal insulator metal structure

1. A method, comprising:

forming an interconnect structure on a substrate;

forming a through interposer via (TIV) structure on the interconnect structure;

attaching a die to the substrate and adjacent to the TIV structure;

forming a dielectric layer on a top surface of the TIV structure;

forming a metal layer on a top surface of the dielectric layer;

patterning the metal layer to form a side surface of the metal layer coplanar with a side surface of the TIV structure; and

forming a redistribution layer (RDL) on the die and the metal layer.

2. The method of claim 1 , wherein the substrate comprises a protective layer comprising a polyimide (PI), a polybenzoxazole (PBO), and combinations thereof, and wherein forming the interconnect structure comprises forming metal lines on the protective layer.

3. The method of claim 1 , wherein forming the TIV structure comprises:

forming a TIV structure opening in a photoresist layer;

depositing a seed layer in the TIV structure opening;

forming a metal fill layer on the seed layer; and

removing the photoresist layer.

4. The method of claim 1 , further comprising forming an other TIV structure with an area different from an area of the TIV structure.

5. The method of claim 4 , further comprising:

forming an other dielectric layer on a top surface of the other TIV structure; and

forming an other metal layer on a top surface of the other dielectric layer.

6. The method of claim 1 , wherein the die comprises a radio frequency communications functionality, and wherein attaching the die to the substrate comprises forming a die attach film (DAF) between the substrate and the die.

7. The method of claim 1 , further comprising filling a space between the die and the TIV structure with a molding compound.

8. The method of claim 1 , wherein forming the dielectric layer comprises forming a high-k dielectric layer with a dielectric constant greater than about 3.9.

9. The method of claim 1 , wherein forming the RDL comprises:

forming a polymer layer on the die and the metal layer; and

forming metal lines on the polymer layer.

10. The method of claim 1 , further comprising:

forming one or more other RDLs on the RDL;

forming under bump metallization (UBM) contacts on the one or more other RDLs; and

forming solder bumps on the UBM contacts.

11. A method, comprising:

forming a metal line on a protective layer;

forming a first through interposer via (TIV) structure with a first area and a second TIV structure with a second area, different from the first area, on the metal line;

attaching a die to the protective layer and adjacent to the first and second TIV structures with a die attach film (DAF);

forming a first dielectric layer above the first TIV structure and a second dielectric layer above the second TIV structure, wherein a width of the first dielectric layer is the same as a width of the first TIV structure;

forming a first metal layer above the first dielectric layer and a second metal layer above the second dielectric layer; and

forming a redistribution layer (RDL) on the die and the first and second metal layers.

12. The method of claim 11 , wherein forming the first and second TIV structures comprises:

forming a first TIV structure opening and a second TIV structure opening in a photoresist layer;

depositing seed layers in the first and second TIV structure openings;

forming metal fill layers on the seed layers; and

removing the photoresist layer.

13. The method of claim 11 , wherein forming the first and second dielectric layers comprises:

depositing a high-k dielectric layer with a dielectric constant greater than about 3.9 on the die and the first and second TIV structures; and

removing portions of the high-k dielectric layer.

14. The method of claim 11 , wherein forming the first and second metal layers comprises:

forming a conductive metal layer on the first and second dielectric layers; and

removing portions of the conductive metal layer.

15. The method of claim 11 , wherein forming the first and second metal layers comprises:

depositing a titanium (Ti) bottom layer;

depositing a copper (Cu) seed layer; and

electroplating a Cu top layer.

16. The method of claim 11 , further comprising filling a space between the die and the first TIV structure and between the first and second TIV structures with a molding compound.

17. A method, comprising:

forming an interconnect structure on a substrate;

forming a through interposer via (TIV) structure, comprising:

forming a TIV structure opening in a photoresist layer spin coated on the interconnect structure;

depositing a seed layer in the TIV structure opening;

forming a metal fill layer on the seed layer; and

removing the photoresist layer;

attaching a die to the substrate and adjacent to the TIV structure;

forming a dielectric layer on a top surface of the TIV structure;

forming a metal layer on a top surface of the dielectric layer; and

patterning the dielectric layer and the metal layer to align edges of the dielectric layer and the metal layer with side surfaces of the TIV structure.

18. The method of claim 17 , further comprising:

forming an other TIV structure with an area different from an area of the TIV structure;

forming an other dielectric layer on a top surface of the other TIV structure; and

forming an other metal layer on a top surface of the other dielectric layer.

19. The method of claim 17 , wherein forming the dielectric layer and the metal layer comprises:

depositing a high-k dielectric layer with a dielectric constant greater than about 3.9 on the die and the TIV structure;

forming a conductive metal layer on the high-k dielectric layer; and

removing portions of the high-k dielectric layer and portions of the conductive metal layer.

20. The method of claim 17 , further comprising:

forming one or more redistribution layers (RDLs) on the die and the metal layer;

forming under bump metallization (UBM) contacts on the one or more RDLs; and

forming solder bumps on the UBM contacts.