Package structure and manufacturing method thereof
A package structure includes a carrier substrate, a die, and an encapsulant. The carrier substrate includes through carrier vias (TCV). The die is disposed over the carrier substrate. The die includes a semiconductor substrate and conductive posts disposed over the semiconductor substrate. The conductive posts face away from the carrier substrate. The encapsulant laterally encapsulates the die.
1. A package structure, comprising:
a carrier substrate comprising through carrier vias (TCV);
a die disposed over the carrier substrate, wherein the die comprises a semiconductor substrate and conductive posts disposed over the semiconductor substrate, and the conductive posts face away from the carrier substrate; and
an encapsulant laterally encapsulating the die.
2. The package structure of claim 1 , further comprising a redistribution structure disposed on the carrier substrate opposite to the die.
3. The package structure of claim 1 , wherein the carrier substrate further comprises an insulating body at least partially surrounds the TCVs.
4. The package structure of claim 3 , wherein the insulating body has a cavity, and the die and the encapsulant are located within the cavity.
5. The package structure of claim 3 , wherein each TCV comprises a seed layer and a conductive layer disposed on the seed layer, and the seed layer is in physical contact with the insulating body.
6. The package structure of claim 3 , wherein the carrier substrate further comprises filling patterns sandwiched between each TCV and the insulating body.
7. The package structure of claim 6 , wherein each filling pattern has an inner sidewall contacting the corresponding TCV and an outer sidewall contacting the insulating body, the inner sidewall of each filling pattern is substantially straight, and the outer sidewall of each filling pattern is slanted.
8. The package structure of claim 1 , further comprising through insulating vias (TIV) disposed adjacent to the die, wherein the TIVs penetrate through the encapsulant.
9. The package structure of claim 1 , wherein each TCV has a slanted sidewall.
10. The package structure of claim 1 , wherein each TCV has a substantially straight sidewall.
11. A package structure, comprising:
a carrier substrate comprising an insulating body and through carrier vias (TCV) protruding out from the insulating body, wherein a height of each TCV is larger than a thickness of the insulating body;
a die disposed over the carrier substrate, wherein the die has an active surface facing away from the insulating body, and the die has conductive posts formed on the active surface; and
a redistribution structure disposed on at least one side of the carrier substrate.
12. The package structure of claim 11 , wherein the carrier substrate further comprises filling patterns sandwiched between each TCV and the insulating body.
13. The package structure of claim 11 , wherein each TCV has a substantially straight sidewall.
14. The package structure of claim 11 , further comprising an encapsulant laterally encapsulating the die.
15. The package structure of claim 14 , wherein the encapsulant further encapsulates a protruding portion of each TCV.
16. A manufacturing method of a package structure, comprising:
providing a carrier substrate, comprising:
providing an insulating body having openings therein; and
forming through carrier vias (TCV) in the openings;
placing a die over the carrier substrate, wherein the die comprises a semiconductor substrate and conductive posts disposed over the semiconductor substrate, the conductive posts face away from the carrier substrate, and the semiconductor substrate is located between the conductive posts and at least a portion of the insulating body;
forming an encapsulant laterally encapsulating the die; and
forming a redistribution structure on the carrier substrate opposite to the die.
17. The method of claim 16 , wherein forming the TCVs in the openings comprises:
forming a seed material layer over the insulating body and within the openings, wherein the seed material layer is in physical contact with the insulating body;
forming a conductive material layer over the seed material layer; and
removing a portion of the conductive material layer and a portion of the seed material layer until the insulating body is exposed to form a seed layer and a conductive layer within the openings.
18. The method of claim 16 , wherein forming the TCVs in the openings comprises:
placing pre-fabricated TCVs into the openings of the insulating body.
19. The method of claim 18 , wherein providing the carrier substrate further comprises forming filling patterns in the openings of the insulating body, wherein the filling patterns are sandwiched between each TCV and the insulating body.
20. The method of claim 16 , further comprising:
forming a cavity in the insulating body, wherein a depth of the cavity is smaller than a depth of each opening, and the die and the encapsulant are formed within the cavity.