Semiconductor devices and methods of manufacturing
Packaged devices and methods of manufacturing the devices are described herein. The packaged devices may be fabricated using heterogeneous devices and asymmetric dual-side molding on a multi-layered redistribution layer (RDL) structure. The packaged devices may be formed with a heterogeneous three-dimensional (3D) Fan-Out System-in-Package (SiP) structure having small profiles and can be formed using a single carrier substrate.
1. A semiconductor device, comprising:
a system on chip device;
an integrated circuit device; and
a redistribution structure physically separating and electrically coupling the integrated circuit device and the system on chip device, wherein the redistribution structure comprises a first metal trace having a concave surface, the concave surface facing the integrated circuit device, the concave surface of the first metal trace forming a concave shape interface with the integrated circuit device and a second metal trace having a flat interface with the system on chip device, wherein the concave shape interface has a first width and the flat interface has a second width, the second width being smaller than the first width.
2. The semiconductor device of claim 1 , wherein a ratio of the first width to the second width is between 3 and 7, inclusive.
3. The semiconductor device of claim 1 , further comprising a first through interconnect via, wherein the redistribution structure further comprises a third metal trace having a second flat interface with the first through interconnect via.
4. The semiconductor device of claim 3 , further comprising an integrated passive device adjacent to the system on chip device, the integrated passive device electrically connected to the redistribution structure and in physical contact with a dam on an opposite side of the integrated passive device from the redistribution structure.
5. The semiconductor device of claim 1 , further comprising:
a first molding compound encapsulating the system on chip device, the first molding compound having a first height; and
a second molding compound encapsulating the integrated circuit device, the second molding compound having a second height, wherein a ratio of the second height to the first height is between 0 and 6, inclusive.
6. A semiconductor device comprising:
a first molding compound encapsulating a first device;
an interconnect structure over the first device, wherein a first interface between the interconnect structure and the first device has a flat surface;
a second device over the interconnect structure, the interconnect structure electrically coupling the second device to the first device, wherein a second interface between the interconnect structure and the second device has a concave shape, wherein the concave shape has a first width and the flat surface has a second width and a ratio of the first width to the second width is between 3 and 7, inclusive; and
a second molding compound encapsulating the second device over the interconnect structure.
7. The semiconductor device of claim 6 , wherein a coefficient of thermal expansion of the second molding compound is different from a coefficient of thermal expansion of the first molding compound.
8. The semiconductor device of claim 7 , wherein the coefficient of thermal expansion of the first molding compound is a first coefficient of thermal expansion below a glass transition temperature of the first molding compound and the coefficient of thermal expansion of the second molding compound is a second coefficient of thermal expansion below a glass transition temperature of the second molding compound and a ratio of the second coefficient of thermal expansion to the first coefficient of thermal expansion is between 0.8 and 0.99, inclusive.
9. The semiconductor device of claim 8 , wherein the coefficient of thermal expansion of the first molding compound is a third coefficient of thermal expansion above the glass transition temperature of the first molding compound and the coefficient of thermal expansion of the second molding compound is a fourth coefficient of thermal expansion above the glass transition temperature of the second molding compound and a ratio of the fourth coefficient of thermal expansion to the third coefficient of thermal expansion is between 0.1 and 0.7, inclusive.
10. The semiconductor device of claim 6 , further comprising the first device attached to an adhesive, the adhesive attached to a first dielectric layer, and an integrated passive device attached to a silicon dam, the silicon dam attached to the adhesive, the adhesive attached to the first dielectric layer.
11. The semiconductor device of claim 10 , wherein the integrated passive device and the first device are leveled to a same height from the first dielectric layer.
12. The semiconductor device of claim 10 , further comprising through vias over the first dielectric layer.
13. The semiconductor device of claim 6 , wherein the first molding compound has a first thickness, and the second molding compound has a second thickness, the second thickness being greater than the first thickness.
14. A semiconductor device comprising:
a first dielectric layer over a system on chip device;
a first metallization pattern over the first dielectric layer, a first portion of the first metallization pattern extending through the first dielectric layer to a first die connector of the system on chip device and a second portion of the first metallization pattern extending through the first dielectric layer to a through via;
a first flat contact area interface between the first metallization pattern and the first die connector, wherein the first flat contact area interface has a first width;
a second dielectric layer over the first metallization pattern;
a second metallization pattern over the second dielectric layer and extending through the second dielectric layer;
an integrated circuit device over the second metallization pattern; and
a contact area of the integrated circuit device to a surface of the second metallization pattern, wherein the surface of the second metallization pattern is concave, wherein the contact area has a second width, the first width being less than the second width.
15. The semiconductor device of claim 14 , further comprising:
a first molding compound encapsulating the system on chip device; and
a second molding compound encapsulating the integrated circuit device.
16. The semiconductor device of claim 15 , wherein a ratio between a second height of the second molding compound and a first height of the first molding compound is at most 6.
17. The semiconductor device of claim 15 , wherein the first molding compound has a first coefficient of thermal expansion, and the second molding compound has a second coefficient of thermal expansion, the first coefficient of thermal expansion being different from the second coefficient of thermal expansion.
18. The semiconductor device of claim 14 , wherein the system on chip device is located adjacent to the through via.
19. The semiconductor device of claim 14 , further comprising:
a first external connector to the through via opposite the first metallization pattern; and
a second external connector adjacent to the first external connector, a pitch between the first external connector and the second external connector being between 80 μm and 250 μm, inclusive.
20. The semiconductor device of claim 14 , wherein the surface of the second metallization pattern has a first width and the first flat contact area interface has a second width, a ratio of the first width to the second width is between 3 and 7, inclusive.