IP Library › Granted Patent US 12,181,224
Granted Patent B2
US 12,181,224 · App. 17/958,429 · Granted Dec 31, 2024

Heat dissipation device

Inventors: Jung-Kai Chang (Taipei, TW); Chi-Yeh Chen (Taipei, TW)
Assignee: ASUSTeK COMPUTER INC.
F28D15/0275F28D2021/0029
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,181,224
App. No.
17/958,429
Granted
Dec 31, 2024
Kind
B2
Abstract

A heat dissipation device including a heat dissipation fin group, a plurality of heat pipes, and a vapor chamber is provided. The heat dissipation fin group includes a plurality of fins arranged along an extension direction and is divided into a first fin group, a second fin group, and a third fin group. The third fin group is disposed between the first fin group and the second fin group. Each fin of the first fin group and the second group includes a plurality of through holes. Each fin of the third fin group includes a plurality of notches. The heat pipes are disposed through the first fin group and the second fin group by the through holes. The vapor chamber is correspondingly disposed on the third fin group and includes a plurality of grooves. The vapor chamber is in contact with the heat pipes exposed from the notches.

Claims (10)

1. A heat dissipation device, comprising:

a heat dissipation fin group, having a plurality of fins, the fins are arranged along an extension direction and are divided into a first fin group, a second fin group, and a third fin group, the third fin group is disposed between the first fin group and the second fin group, wherein each fin of the first fin group and the second group includes a plurality of through holes, and each fin of the third fin group includes a plurality of notches;

a plurality of heat pipes, which are cylindrical structure, the heat pipes are disposed through the first fin group and the second fin group by the through holes, and a part of the heat pipes corresponding to the third fin group is in contact with the notches, and another part is exposed to the outside, wherein the plurality of heat pipes are extended along the extension direction; and

a vapor chamber, correspondingly disposed on the third fin group, and having a plurality of grooves, the vapor chamber is in contact with the heat pipes exposed from the grooves, wherein the grooves extend along the extension direction and have a shape associated with the cylindrical structure,

wherein the notches are arranged along the extension direction to form a plurality of positioning grooves, and each of the grooves and each of the positioning grooves respectively cover the lower and upper halves of the heat pipes,

wherein the whole body of each of the heat pipes has a straight heat pipe structure that is parallel to the vapor chamber and the heat dissipation group.

2. The heat dissipation device according to claim 1 , wherein the position of each of the heat pipes corresponding to the third fin group is a heat absorption portion, and the position of each of the heat pipes corresponding to the first fin group and the second fin group are two heat dissipation portions.

3. The heat dissipation device according to claim 1 , wherein each of the heat pipes has an inner cavity and a heat conduction medium, and the heat conduction medium is disposed in the inner cavity.

4. The heat dissipation device according to claim 1 , wherein the vapor chamber has a plurality of thermally conductive sheets disposed on the surface of the vapor chamber facing away from the groove.

5. The heat dissipation device according to claim 1 , wherein the heat dissipation fin group, the heat pipes, and the vapor chamber are welded to each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2022
From: CHANG, JUNG-KAI; CHEN, CHI-YEH
To: ASUSTEK COMPUTER INC.
Reel/Frame 061342/0159 →
Priority Claims (1)
TW 111200468 · Jan 13, 2022 · national
Continuity (1)
Related Publication 20230221078A1 · Jul 13, 2023
Cited By (2)
US 12,331,999 US 12,593,424