Heat dissipation device
A heat dissipation device is adapted for dissipating heat from a heat source, and includes a vaper chamber, a heat pipe set and a heat dissipation fin set. The vapor chamber is adapted for thermal coupling to the heat source. The heat pipe set is adapted for thermal coupling to the heat source, the heat from the heat source is synchronously conducted to the vapor chamber and the heat pipe set. The vapor chamber is thermally coupled to the heat dissipation fin set, and the heat pipe set penetrates through the heat dissipation fin set.
1 . A heat dissipation device, adapted to dissipate heat of a heat source, and comprising:
a vapor chamber, adapted for thermal coupling to the heat source;
a heat pipe set including a compressed portion adapted for thermal coupling to the heat source;
a heat dissipation fin set, wherein the vapor chamber is thermally coupled to the heat dissipation fin set, and the heat pipe set penetrates through the heat dissipation fin set; and
a heat conduction structure including a body,
wherein the vapor chamber and the heat pipe set are in direct contact with the body such that heat from the heat source is synchronously conducted to the vapor chamber and the heat pipe set through the body,
wherein the heat dissipation fin set directly contacts a top surface of the vapor chamber,
wherein the vapor chamber directly contacts a top surface of the body and the compressed portion,
wherein the compressed portion directly contacts the heat source and a side surface of the body, and
wherein a bottom surface of the body directly contacts the heat source.
2 . The heat dissipation device as claimed in claim 1 , wherein the heat dissipation fin set comprises an upper half and a lower half, the lower half is located between the upper half and the vapor chamber, the heat pipe set comprises a round tube portion, and the round tube portion penetrates through the upper half of the heat dissipation fin set.