IP Library Granted Patent US 12,191,391
Granted Patent B2
US 12,191,391 · App. 18/244,892 · Granted Jan 7, 2025

Semiconductor device and method for fabricating the same

Inventors: Shou-Wan Huang (Hsinchu, TW); Chun-Hsien Lin (Tainan, TW)
Assignee: UNITED MICROELECTRONICS CORP.
H01L29/785H01L27/0688H01L27/0886H01L29/0649H01L29/66795
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,191,391
App. No.
18/244,892
Granted
Jan 7, 2025
Kind
B2
Abstract

A semiconductor device includes a substrate having a first region and a second region, a first fin-shaped structure extending along a first direction on the first region, a double diffusion break (DDB) structure extending along a second direction to divide the first fin-shaped structure into a first portion and a second portion, and a first gate structure and a second gate structure extending along the second direction on the DDB structure.

Claims (16)

1. A semiconductor device, comprising:

a substrate having a first region and a second region;

a first fin-shaped structure extending along a first direction on the first region;

a double diffusion break (DDB) structure extending along a second direction to divide the first fin-shaped structure into a first portion and a second portion;

a first gate structure and a second gate structure extending along the second direction on the DDB structure; and

a protrusion on the DDB structure and between the first gate structure and the second gate structure, wherein the protrusion and the DDB structure are made of same material.

2. The semiconductor device of claim 1 , wherein the first gate structure overlaps the first portion and the DDB structure.

3. The semiconductor device of claim 1 , wherein the second gate structure overlaps the second portion and the DDB structure.

4. The semiconductor device of claim 1 , further comprising:

a second fin-shaped structure on the second region;

a single diffusion break (SDB) structure in the second fin-shaped structure to divide the second fin-shaped structure into a third portion and a fourth portion; and

a third gate structure on the SDB structure.

5. The semiconductor device of claim 4 , wherein the third gate structure overlaps the third portion, the fourth portion, and the SDB structure.

6. The semiconductor device of claim 4 , wherein a width of the first gate structure is equal to a width of the third gate structure.

7. The semiconductor device of claim 4 , wherein a width of the first gate structure is equal to a width of the second gate structure.

8. The semiconductor device of claim 1 , wherein the first region comprises a NMOS region and the second region comprises a PMOS region.

Priority Claims (1)
CN 202011411105.8 · Dec 4, 2020 · national
Continuity (3)
Continuation 17706553 · Mar 28, 2022
Continuation 17140157 · Jan 4, 2021
Related Publication 20230420564A1 · Dec 28, 2023
References Cited (7)
US 9865704B2 · Xie et al. · 2018 [cited by applicant]
US 10115722B2 · Oh · 2018 [cited by examiner]
US 10622479B1 · Yang · 2020 [cited by applicant]
US 11355639B1 · Huang · 2022 [cited by applicant]
US 11791412B2 · Huang · 2023 [cited by examiner]
US 20190355719A1 · Maeda · 2019 [cited by applicant]
US 20200058652A1 · Park · 2020 [cited by applicant]