Ground electrode formed in an electrostatic chuck for a plasma processing chamber
Disclosed herein is a substrate support assembly having a ground electrode mesh disposed therein along a side surface of the substrate support assembly. The substrate support assembly has a body. The body has an outer top surface, an outer side surface and an outer bottom surface enclosing an interior of the body. The body has a ground electrode mesh disposed in the interior of the body and adjacent the outer side surface, wherein the ground electrode does not extend through to the outer top surface or the outer side surface.
1. A method for forming an electrostatic cuck (ESC), the method comprising:
sintering an aluminum nitride (AlN) body having an high voltage (HV) ESC electrode and a radio frequency (RF) mesh disposed therein;
disposing a cylindrical ground electrode along one or more outer surfaces of the sintered AlN body and coupling the cylindrical ground electrode to the RF mesh;
encasing the cylindrical ground electrode and the sintered body with a dielectric material to form an ESC body; and
joining the dielectric material with the ESC body to form the ESC.
2. The method of claim 1 , wherein the cylindrical ground electrode is continuous along a radius of the ESC body and a coax ground return is additionally provided to the RF mesh.
3. The method of claim 1 , wherein the cylindrical ground electrode is a vertical cage shape disposed in the ESC body.
4. The method of claim 1 further comprising:
attaching a metal ground tube to the cylindrical ground electrode, wherein the metal ground tube is disposed in a stem attached to the ESC body.