Granted Patent B2

US 12,208,469 · App. 16/756,958 · Granted Jan 28, 2025

Inventors: Masayuki Shiraishi (Kumagaya, JP); Yosuke Tatsuzaki (Kumagaya, JP)

Assignee: NIKON CORPORATION

B23K26/142B23K26/082

Abstract

Claims (50)

1. A processing apparatus comprising:

a light irradiation apparatus that includes: (i) a deflection optical member that is disposed on an optical path of a processing light and that changes an emission angle of the processing light from a first emission angle to a second emission angle different from the first emission angle; and (ii) a condensing optical system for condensing the processing light received from the deflection optical member, and that irradiates a surface of an object with the processing light from the condensing optical system;

a partition member that surrounds a space including an optical path between the surface of the object and an optical member that is disposed at a most object side in the condensing optical system; and

a driver configured to move both the condensing optical system and the deflection optical member in the space surrounded by the partition member along a direction intersecting a propagating direction of the processing light output from the condensing optical system.

2. The processing apparatus according to claim 1 , wherein

the partition member forms a sealed space in cooperation with the surface of the object.

3. The processing apparatus according to claim 1 , wherein

the partition member is opaque to a light having a wavelength of the processing light.

4. The processing apparatus according to claim 1 , wherein

the partition member forms a sealed space in cooperation with the surface of the object when the object is irradiated with the processing light.

5. The processing apparatus according to claim 1 , wherein

the partition member does not contact with the surface of the object.

6. The processing apparatus according to claim 1 , further comprising a suction member that sucks a substance generated by an irradiation of the processing light.

7. The processing apparatus according to claim 6 , wherein

the suction member sucks the substance from the space.

8. The processing apparatus according to claim 6 , further comprising a detector that detects the substance in the space.

9. The processing apparatus according to claim 6 , further comprising

a filter that allows the gas to pass therethrough and that sorbs the substance.

10. The processing apparatus according to claim 1 , further comprising a gas supply apparatus that supplies gas to the space.

11. The processing apparatus according to claim 10 , wherein

the gas supply apparatus supplies the gas to an optical surface at a space side of the optical member.

12. The processing apparatus according to claim 10 , further comprising a suction member that sucks a substance generated by an irradiation of the processing light, wherein

the suction member sucks the substance with the gas supplied to the space.

13. The processing apparatus according to claim 1 , wherein

the partition member is provided with a contact part that is allowed to contact with the surface of the object, and

a shape of the contact part is complimentary to a shape of the surface of the object.

14. The processing apparatus according to claim 13 , further comprising a detector that detects a substance generated by an irradiation of the processing light, wherein

the contact part is not away from the surface of the object when the substance exists in the space.

15. The processing apparatus according to claim 1 , wherein

the partition member is provided with a contact part that is allowed to contact with the surface of the object, and

a shape of the contact part is deformed in accordance with a shape of the object.

16. The processing apparatus according to claim 1 , wherein

the partition member is provided with a contact part that is allowed to contact with the surface of the object,

the partition member is relatively movable relative to the object, and

the contact part is away from the surface of the object in a period when the partition member relatively moves relative to the object.

17. The processing apparatus according to claim 16 , wherein

the period is a first period, and

the contact part contacts with the surface of the object in a second period when the light irradiation apparatus emits the processing light.

18. The processing apparatus according to claim 17 , wherein

the light irradiation apparatus stops emitting the processing light when the contact part is away from the surface of the object in the second period.

19. The processing apparatus according to claim 1 , wherein

the driver is configured to move both the condensing optical system and the deflection optical member relative to the partition member.

20. The processing apparatus according to claim 1 , wherein

the processing light from the deflection optical member enters the condensing optical system.

21. A processing method comprising:

irradiating a surface of an object with a processing light through (i) a deflection optical member that is positioned on an optical path of the processing light and that changes an emission angle of the processing light from a first emission angle to a second emission angle different from the first emission angle, and (ii) a condensing optical system that condenses the processing light received from the deflection optical member;

surrounding, by a partition member, a space including an optical path between the surface of the object and an optical member that is disposed at a most object side in the condensing optical system; and

moving both the condensing optical system and the deflection optical member in the space surrounded by the partition member along a direction intersecting a propagating direction of the processing light output from the condensing optical system.

22. The processing method according to claim 21 , wherein

the moving includes moving both the condensing optical system and the deflection optical member relative to the partition member.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (55)