IP Library › Granted Patent US 12,211,768
Granted Patent B2
US 12,211,768 · App. 18/590,568 · Granted Jan 28, 2025

Heat sink

Inventors: Yutaka Suzuki (Niigata, JP); Takashi Saito (Niigata, JP); Shingo Ikarashi (Niigata, JP)
Assignee: WELCON Inc.
H01L23/4735F28F3/12F28F13/06
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Quick Facts
Patent No.
US 12,211,768
App. No.
18/590,568
Granted
Jan 28, 2025
Kind
B2
Abstract

A heat sink is a multilayer cooler for cooling a contacting heat-generating element by flowing a coolant from a fluid inlet to a fluid outlet, and includes a heat-receiving plate, a channel plate, an orifice plate, a header plate, and a bottom plate stacked in this order from the top surface and bonded by diffusion bonding. The channel plate has many cooling micropaths arranged in a matrix. The orifice plate has jet orifices for jetting a coolant into the cooling micropaths and drain orifices for draining the coolant from the cooling micropaths. The header plate includes a baffle that separates the fluid inlet from the fluid outlet. The baffle includes a plurality of parallel plates and first end plates and second end plates that alternately close openings at an end and at the opposite end of the parallel plate. The baffle and the peripheral wall define a supply channel.

Claims (19)

1. A multilayer heat sink that cools an object in contact with the heat sink by flowing a fluid from a fluid inlet to a fluid outlet, the heat sink comprising:

a heat-receiving layer having a top surface in contact with the object to receive heat;

a channel layer provided on a bottom surface of the heat-receiving layer, the channel layer including cooling micropaths extending and directing the fluid in a direction orthogonal to a stacking direction;

an orifice layer provided on a bottom surface of the channel layer, the orifice layer including:

jet orifices configured to jet the fluid into the cooling micropaths from a header layer; and

drain orifices configured to drain the fluid from the cooling micropaths toward the header layer;

the header layer provided on a bottom surface of the orifice layer, the header layer including:

a peripheral wall; and

a baffle provided in a region surrounded by the peripheral wall, the baffle being configured to separate the fluid inlet from the fluid outlet; and

a bottom layer provided on a bottom surface of the header layer, wherein

the baffle includes:

parallel plates disposed parallel to each other; and

end plates configured to alternately close an opening at an end and an opening at an opposite end of the parallel plates,

the orifice layer, the bottom layer, the baffle, and the peripheral wall define a supply channel to guide the fluid from the fluid inlet to the jet orifices and a drain channel to guide the fluid from the drain orifices to the fluid outlet,

the channel layer includes a plurality of channel layers between which an intermediate layer is interposed, and

the intermediate layer includes:

intermediate jet orifices disposed at positions overlapping the jet orifices when seen in the stacking direction; and

intermediate drain orifices disposed at positions overlapping the drain orifices when seen in the stacking direction.

2. The heat sink according to claim 1 , wherein the intermediate jet orifices and the intermediate drain orifices connect the cooling micropaths at a top layer of the plurality of channel layers with the cooling micropaths at a bottom layer of the plurality of channel layers.

Continuity (2)
Division 16642747
Related Publication 20240203828A1 · Jun 20, 2024
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