Integrated antenna-in-package structure
A semiconductor device includes a first substrate. An electrical component is disposed over the first substrate. A board-to-board connector is disposed over the first substrate. An encapsulant is deposited over the first substrate and electrical component to form a subpackage. The board-to-board connector remains exposed from the encapsulant. A contact pad is formed on a side surface of the subpackage. The subpackage is mounted to an antenna through the contact pad.
1. A semiconductor device, comprising:
a first substrate;
an electrical component disposed over the first substrate;
a board-to-board connector disposed over the first substrate;
an encapsulant deposited over the first substrate and electrical component to form a subpackage, wherein the board-to-board connector remains exposed from the encapsulant;
a contact pad formed on a side surface of the subpackage; and
an antenna mounted to the subpackage by a solder bump extending from the contact pad to the antenna.
2. The semiconductor device of claim 1 , further including an adhesive disposed between the subpackage and antenna.
3. The semiconductor device of claim 1 , wherein the antenna includes a second substrate, and wherein the antenna is mounted to the subpackage with the first substrate oriented perpendicular to the second substrate.
4. The semiconductor device of claim 1 , wherein the electrical component is disposed over a first surface of the first substrate and the board-to-board connector is disposed over a second surface of the first substrate opposite the first surface.
5. The semiconductor device of claim 1 , wherein the contact pad is embedded in the encapsulant.
6. The semiconductor device of claim 1 , wherein the contact pad is embedded in the substrate.
7. A semiconductor device, comprising:
a first substrate including a board-to-board connector mounted to the first substrate;
an antenna including a second substrate mounted to the first substrate; and
a solder bump extending from the first substrate to the second substrate.
8. The semiconductor device of claim 7 , further including an adhesive disposed between the first substrate and second substrate.
9. The semiconductor device of claim 7 , wherein the first substrate is oriented perpendicular to the second substrate.
10. The semiconductor device of claim 7 , further including a mobile device comprising a main board, wherein the first substrate is connected to the main board through the board-to-board connector.
11. The semiconductor device of claim 7 , further including a contact pad formed on a side surface of the first substrate, wherein the second substrate is connected to the first substrate through the contact pad.
12. The semiconductor device of claim 7 , further including a contact pad disposed over a surface of the first substrate, wherein the second substrate is connected to the first substrate through the contact pad.
13. A method of making a semiconductor device, comprising:
providing a first substrate;
disposing an electrical component over the first substrate;
disposing a board-to-board connector over the first substrate;
depositing an encapsulant over the first substrate and electrical component to form a subpackage, wherein the board-to-board connector remains exposed from the encapsulant;
forming a contact pad on a side surface of the subpackage;
providing an antenna; and
mounting the subpackage to the antenna through a solder bump reflowed between the contact pad and antenna.
14. The method of claim 13 , further including disposing an adhesive between the subpackage and antenna.
15. The method of claim 13 , wherein the antenna includes a second substrate, and wherein the subpackage is mounted to the antenna with the first substrate oriented perpendicular to the second substrate.
16. The method of claim 13 , further including:
disposing the electrical component over a first surface of the first substrate; and
disposing the board-to-board connector over a second surface of the first substrate opposite the first surface.
17. The method of claim 13 , further including forming the contact pad by:
disposing a metal bar over the first substrate; and
singulating through the metal bar and first substrate.
18. The method of claim 13 , further including forming the contact pad by:
forming a conductive via in the first substrate; and
singulating the substrate through the conductive via.
19. A method of making a semiconductor device, comprising:
providing a first substrate including a board-to-board connector mounted to the first substrate;
providing an antenna including a second substrate; and
mounting the first substrate to the second substrate by reflowing a solder bump between the first substrate and second substrate.
20. The method of claim 19 , further including disposing an adhesive between the first substrate and second substrate.
21. The method of claim 19 , further including mounting the first substrate to the second substrate with the first substrate oriented perpendicular to the second substrate.
22. The method of claim 19 , further including mounting the first substrate to a main board of a mobile device using the board-to-board connector.
23. The method of claim 19 , further including forming a contact pad on a side surface of the first substrate by:
forming a conductive via in the first substrate; and
singulating the substrate through the conductive via.
24. The method of claim 19 , further including forming a contact pad by:
disposing a metal bar over the first substrate; and
singulating the first substrate and metal bar.
25. The method of claim 19 , further including disposing an electrical component over the substrate opposite the board-to-board connector.