Electronic device module and method of manufacturing the same
An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.
1. An electronic device module comprising:
a substrate;
a sealing portion comprising a first sealing portion and a second sealing portion disposed on a surface of the substrate, wherein the first sealing portion and the second sealing portion are separated by a shielding portion and in direct contact with the shielding portion; and
an antenna disposed below the surface on a layer in the substrate,
wherein an electronic component mounted on the substrate is embedded in the second sealing portion, and the shielding portion is disposed on a surface of the second sealing portion, and
wherein the antenna comprises:
a dipole antenna disposed in an area overlapping the first sealing portion, in a view perpendicular to the surface of the substrate, or
a patch antenna disposed in an area overlapping an area in which the second sealing portion is disposed, in a view perpendicular to the surface of the substrate.
2. The electronic device module of claim 1 , wherein a circuit pattern disposed on the substrate forms the antenna.
3. The electronic device module of claim 1 , further comprising a connector disposed outside of the second sealing portion and mounted on the substrate.
4. The electronic device module of claim 1 , wherein at least one side surface of the second sealing portion is formed as a sloping surface.
5. The electronic device module of claim 1 , wherein the shielding portion is connected to a ground of the substrate.
6. The electronic device module of claim 5 , wherein the shielding portion is connected to a ground electrode disposed on the substrate through a groove formed between the first sealing portion and the second sealing portion.
7. The electronic device module of claim 1 , wherein the first sealing portion is spaced apart from the second sealing portion.
8. The electronic device module of claim 1 , wherein the first sealing portion has a thickness less than that of the second sealing portion.
9. An electronic device module comprising:
a sealing portion comprising a first sealing portion and a second sealing portion disposed on a surface of the substrate, wherein the first sealing portion and the second sealing portion are separated by a shielding portion and in direct contact with the shielding portion;
an electronic component embedded in the second sealing portion; and
an antenna disposed below the surface on a layer in the substrate,
wherein the antenna overlaps the first sealing portion or the second sealing portion in a view perpendicular to the surface.
10. The electronic device module of claim 9 , wherein the shielding portion is disposed on the second sealing portion and electrically connected to a ground electrode on the substrate,
wherein the first sealing portion is spaced apart from the second sealing portion by the shielding portion.
11. The electronic device module of claim 9 , wherein the antenna comprises a dipole antenna or a patch antenna.
12. The electronic device module of claim 9 , wherein the antenna comprises a dipole antenna disposed to overlap the first sealing portion in a view perpendicular to the surface, or
wherein the antenna comprises a patch antenna disposed to overlap the second sealing portion in a view perpendicular to the surface.
13. An electronic device module comprising:
a sealing portion comprising a first sealing portion and a second sealing portion disposed on a surface of the substrate, wherein the first sealing portion and the second sealing portion are separated by a shielding portion and in direct contact with the shielding portion;
an electronic component embedded in the second sealing portion; and
an antenna disposed below the surface on a layer in the substrate,
wherein the antenna is a dipole antenna and overlaps the first sealing portion or a patch antenna and overlaps the second sealing portion in a view perpendicular to the surface of the substrate.
14. The electronic device module of claim 13 , wherein the shielding portion is disposed on the second sealing portion and electrically connected to a ground electrode on the substrate.
15. The electronic device module of claim 14 , wherein the first sealing portion is spaced apart from the second sealing portion by the shielding portion.
16. The electronic device module of claim 13 , wherein the first sealing portion is disposed along an edge of the substrate.
17. The electronic device module of claim 16 , wherein the first sealing portion is disposed along two consecutive edges of the substrate.