Electronic device and method for manufacturing the same
An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.
1 . An electronic device comprising:
a substrate;
an encapsulant disposed over the substrate, and having a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface, wherein a roughness of the first lateral surface is less than or equal to a roughness of the second top surface; and
an electronic component disposed over the second top surface of the encapsulant and electrically connected to the substrate through a reflowable material, wherein the encapsulant surrounds and contacts the reflowable material, wherein a portion of the reflowable material is disposed over the second top surface of the second portion of the encapsulant.
2 . The electronic device of claim 1 , wherein the encapsulant includes:
a first portion having the first top surface; and
a second portion having the second top surface, wherein the first portion is continuously extended to the second portion.
3 . The electronic device of claim 2 , further comprising a shielding layer, wherein the second portion of the encapsulant further has a third top surface level-distinct from the second top surface, and the shielding layer disposed over the second top surface.
4 . The electronic device of claim 1 , wherein the encapsulant includes:
a first portion having the first top surface; and
a second portion having the second top surface and a third top surface level-distinct from the second top surface, wherein the roughness of the second top surface is less than a roughness of the third top surface.
5 . The electronic device of claim 1 , wherein an encapsulant further has a second lateral surface, and the first lateral surface and the second lateral surface collectively define an accommodating space for accommodating the electronic component.
6 . An electronic device comprising:
a substrate;
an encapsulant disposed over the substrate, and including a first portion and a second portion connected to the first portion;
an electronic component disposed over the second portion; and
a shielding layer disposed on a lateral surface of the second portion, and being distant from the first portion in a cross-sectional view, wherein the second portion defines a recess portion to expose a portion of a reflowable element connecting the substrate and the electronic component.
7 . The electronic device of claim 6 , wherein the second portion is disposed between the shielding layer and the first portion.
8 . The electronic device of claim 6 , wherein the shielding layer extends to a lateral surface of the substrate.
9 . The electronic device of claim 8 , wherein the lateral surface of the substrate is substantially aligned with the lateral surface of the second portion.
10 . The electronic device of claim 6 , wherein the shielding layer is disposed on a top surface of the second portion, and is spaced apart from the reflowable element.
11 . The electronic device of claim 1 , wherein the electronic component is a connector that is configured to connect the substrate to an external device.
12 . The electronic device of claim 2 , wherein the second portion of the encapsulant defines an opening to expose an electrical contact of the substrate.
13 . The electronic device of claim 12 , wherein the second portion of the encapsulant defines a recess portion recessed from the second top surface of the second portion of the encapsulant, wherein the recess portion is communicated with the opening.
14 . The electronic device of claim 1 , wherein in a cross section, the reflowable material has a substantially hourglass shape.
15 . The electronic device of claim 6 , wherein the shielding layer covers a portion of a second top surface of the second portion of the encapsulant.
16 . An electronic device comprising:
a substrate;
an encapsulant disposed over the substrate, and including a first portion and a second portion connected to the first portion;
an electronic component disposed over the second portion; and
a shielding layer disposed on a lateral surface of the second portion, and being distant from the first portion in a cross-sectional view, wherein a bottom end surface of a first portion of the shielding layer is embedded in the first portion of the encapsulant.
17 . The electronic device of claim 16 , wherein the second portion has a second top surface and a third top surface level-distinct from the second top surface, wherein the shielding layer is further disposed over the second top surface except for the third top surface.
18 . The electronic device of claim 16 , wherein the second portion of the encapsulant defines a recess portion recessed from a second top surface of the second portion of the encapsulant, wherein the recess portion has a bottom surface extending to connect a lateral surface of the second portion of the encapsulant.