Semiconductor device and method of fabricating the same
The present disclosure provides a semiconductor device and a fabricating method thereof, and which includes a substrate, bit lines, bit line contacts, a gate structure, a first oxidized interface layer, and a second oxidized interface layer. The bit lines are disposed on the substrate, and the bit line contacts are disposed below the bit lines. The gate structure is disposed on the substrate, wherein each bit line and the gate structure respectively include a semiconductor layer, a conductive layer, and a covering layer stacked from bottom to top. The first oxidized interface layer is disposed between each bit line contact and the semiconductor layer of each bit line. The second oxidized interface layer is disposed within the semiconductor layer of the gate structure, wherein a topmost surface of the first oxidized interface layer is higher than a topmost surface of the second oxidized interface layer.
1. A semiconductor device, comprising:
a substrate;
a plurality of bit lines disposed on the substrate;
a plurality of bit line contacts disposed in the substrate and under a portion of the plurality of bit lines;
a gate structure disposed on the substrate, wherein the plurality of bit lines and the gate structure each comprise a semiconductor layer, a conductive layer and a covering layer stacked in sequence;
a first oxidized interface layer disposed between a bottom surface of the semiconductor layer of one of the plurality of bit lines and a top surface of a corresponding one of the plurality of bit line contacts under the one of the plurality of bit lines; and
a second oxidized interface layer disposed in the semiconductor layer of the gate structure.
2. The semiconductor device according to claim 1 , wherein the second oxidized interface layer is disposed at a level higher than a level of the first oxidized interface layer in a vertical direction.
3. The semiconductor device according to claim 1 , wherein the semiconductor layer of the gate structure comprises a first semiconductor layer and a second semiconductor layer stacked in sequence, and the second oxidized interface layer is disposed between the first semiconductor layer and the second semiconductor layer.
4. The semiconductor device according to claim 3 , wherein the first semiconductor layer and the second semiconductor layer comprise a same material.
5. The semiconductor device according to claim 3 , wherein the substrate comprises a memory cell region and a periphery region,
the gate structure and the second oxidized interface layer are formed within the periphery region, and
the plurality of bit lines, the plurality of bit line contacts, and the first oxidized interface layer are formed within the memory cell region.
6. The semiconductor device according to claim 1 , wherein each of the plurality of bit line contacts comprises a plurality of voids, and the semiconductor layer of each of the plurality of bit lines is filled up the plurality of voids.
7. The semiconductor device according to claim 6 , wherein the first oxidized interface layer comprises a non-planar top surface.
8. The semiconductor device according to claim 1 , wherein the covering layer of the gate structure and the covering layer of each of the plurality of bit lines comprise a same material, and a top surface of the covering layer of the gate structure and a top surface of the covering layer of each of the plurality of bit lines are not in a same level.
9. A semiconductor device, comprising:
a substrate;
a plurality of bit lines disposed on the substrate;
a plurality of bit line contacts disposed in the substrate and under a portion of the plurality of bit lines;
a gate structure disposed on the substrate, wherein the plurality of bit lines and the gate structure each comprise a semiconductor layer, a conductive layer and a covering layer stacked from bottom to top; and
an oxidized interface layer disposed between a bottom surface of the semiconductor layer of one of the plurality of bit lines and a top surface of a corresponding one of the plurality of bit line contacts under the one of the plurality of bit lines.
10. The semiconductor device according to claim 9 , wherein the plurality of bit line contacts, the semiconductor layer of the gate structure and the semiconductor layer of each of the plurality of bit lines comprise a same material.
11. The semiconductor device according to claim 9 , wherein the substrate comprises a memory cell region and a periphery region,
the gate structure is disposed within the periphery region, and
the plurality of bit lines, the plurality of bit line contacts, and the oxidized interface layer are disposed within the memory cell region.
12. The semiconductor device according to claim 9 , wherein the covering layer of the gate structure and the covering layer of each of the plurality of bit lines comprise a same material, and
a top surface of the covering layer of the gate structure and a top surface of the covering layer of each of the plurality of bit lines are in a same height.
13. A semiconductor device, comprising:
a substrate;
a plurality of bit lines disposed on the substrate;
a plurality of bit line contacts disposed in the substrate and under a portion of the plurality of bit lines;
a gate structure disposed on the substrate, wherein the plurality of bit lines and the gate structure each comprise a semiconductor layer, a conductive layer and a covering layer stacked from bottom to top;
a first oxidized interface layer disposed between a bottom surface of the semiconductor layer of one of the plurality of bit lines and a top surface of a corresponding one of the plurality of bit line contacts under the one of the plurality of bit lines, wherein the first oxidized interface layer comprises a non-planar top surface; and
a second oxidized interface layer disposed in the semiconductor layer of the gate structure.
14. A method of fabricating a semiconductor device, comprising:
providing a substrate;
forming a plurality of bit line contacts in the substrate;
forming a plurality of bit lines on the substrate and the plurality of bit line contacts;
forming a gate structure on the substrate, wherein the plurality of bit lines and the gate structure each comprise a semiconductor layer, a conductive layer and a covering layer stacked from bottom to top;
forming a first oxidized interface layer between a top surface of the semiconductor layer of one of the plurality of bit line contacts and a bottom surface of the semiconductor layer of a corresponding one of the plurality of bit lines above the one of the plurality of bit line contacts; and
forming a second oxidized interface layer in the semiconductor layer of the gate structure, wherein a topmost surface of the second oxidized interface layer is higher than a topmost surface of the first oxidized interface layer.
15. The method of fabricating the semiconductor device according to claim 14 , further comprising:
forming a plurality of buried gate structures in the substrate;
forming a first semiconductor layer on the substrate;
forming a plurality of contact openings extending from the first semiconductor layer to portions of the substrate between any two adjacent ones of the plurality of buried gate structures;
forming a plurality of contacts by filling the plurality of contact openings with a conductive material; and
performing an etching process to form the plurality of bit line contacts by removing a portion of the first semiconductor layer and a portion of each of the plurality of contacts.
16. The method of fabricating the semiconductor device according to claim 15 , further comprising:
after performing the etching process, forming a second semiconductor layer on the substrate and a remaining portion of the first semiconductor layer;
wherein the semiconductor layer of the gate structure comprises the first semiconductor layer and the second semiconductor layer stacked from bottom to top.
17. The method of fabricating the semiconductor device according to claim 16 , wherein the first oxidized interface layer and the second oxidized interface layer are formed before forming the second semiconductor layer.
18. The method of fabricating the semiconductor device according to claim 16 , wherein a top surface of each of the bit line contacts comprises a plurality of voids.
19. The method of fabricating the semiconductor device according to claim 18 , wherein the second semiconductor layer is filled up the plurality of voids.
20. The method of fabricating the semiconductor device according to claim 14 , wherein the substrate comprises a memory cell region and a periphery region,
the gate structure and the second oxidized interface layer are formed within the periphery region, and
the plurality of bit lines, the plurality of bit line contacts, and the first oxidized interface layer are formed within the memory cell region.