IP Library Granted Patent US 12,216,404
Granted Patent B2
US 12,216,404 · App. 17/106,170 · Granted Feb 4, 2025

Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device

Inventors: Masafumi Kojima (Shizuoka, JP); Minoru Uemura (Shizuoka, JP); Takashi Kawashima (Shizuoka, JP); Akiyoshi Goto (Shizuoka, JP); Kei Yamamoto (Shizuoka, JP); Kazuhiro Marumo (Shizuoka, JP); Keiyu Ou (Shizuoka, JP)
Assignee: FUJIFILM Corporation
G03F7/0392C08L33/10G03F7/0382G03F7/32G03F7/20
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Quick Facts
Patent No.
US 12,216,404
App. No.
17/106,170
Granted
Feb 4, 2025
Kind
B2
Abstract

An actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator A that generates an acid represented by General Formula (I), the acid having a pKa of −1.00 or more; one or more selected from the group consisting of a photoacid generator B that generates an acid having a pKa larger than that of an acid generated from the photoacid generator A by 1.00 or more, and a nitrogen-containing compound C having a pKa of a conjugate acid thereof larger than that of the acid generated from the photoacid generator A by 1.00 or more; and an acid-decomposable resin, in which in a case where the actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator D that generates an acid having a pKa of less than −1.00, a ratio of the number of moles of the photoacid generator A to the number of moles of the photoacid generator D in the composition, is 1.0 or more.

Claims (15)

1. An actinic ray-sensitive or radiation-sensitive resin composition comprising:

a photoacid generator A that generates an acid having a pKa of −1.00 or more;

one or more selected from the group consisting of a photoacid generator B that generates an acid having a pKa larger than that of an acid generated from the photoacid generator A by 1.00 or more, and a nitrogen-containing compound C having a pKa of a conjugate acid thereof larger than that of the acid generated from the photoacid generator A by 1.00 or more; and

an acid-decomposable resin,

wherein the actinic ray-sensitive or radiation-sensitive resin composition may further include a photoacid generator D that is a compound different from the nitrogen-containing compound C and generates an acid having a pKa of less than −1.00, and

in a case where the actinic ray-sensitive or radiation-sensitive resin composition includes the photoacid generator D, a ratio of the number of moles of the photoacid generator A to the number of moles of the photoacid generator D in the actinic ray-sensitive or radiation-sensitive resin composition, is 1.0 or more,

wherein, the photoacid generator A is any one selected from the group consisting of PAG-4, PAG-6, PAG-11, PAG-14 to PAG-16, PAG-18 and PAG-20,

2. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ,

wherein the acid-decomposable resin is a methacrylic ester-based resin.

3. A resist film formed from the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 .

4. A pattern forming method comprising:

forming a resist film using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 on a support;

exposing the resist film; and

developing the exposed resist film using a developer.

5. A method for manufacturing an electronic device, comprising the pattern forming method according to claim 4 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 2, 2020
From: KOJIMA, MASAFUMI; UEMURA, MINORU; KAWASHIMA, TAKASHI; GOTO, AKIYOSHI; YAMAMOTO, KEI; MARUMO, KAZUHIRO; OU, KEIYU
To: FUJIFILM CORPORATION
Reel/Frame 054522/0626 →
Priority Claims (2)
JP 2018-160287 · Aug 29, 2018 · national
JP 2019-072107 · Apr 4, 2019 · national
Continuity (2)
Continuation PCTJP2019026029 · Jul 1, 2019
Related Publication 20210088905A1 · Mar 25, 2021
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