Bank design with differential bulk bias in eFuse array
View Patent ↗A memory circuit includes a first memory cell including a first resistor; and a first transistor coupled to the first resistor, wherein a first bulk port of the first transistor is biased at a first voltage level; a second memory cell coupled to the first memory cell, the second memory cell including a second resistor; and a second transistor coupled to the second memory cell, wherein a second bulk port of the second transistor is biased at a second voltage level, wherein the second voltage level is less than the first voltage level.
1. A memory circuit comprising:
a plurality of memory cells, each of the plurality of memory cells including a resistor and a transistor coupled to each other in series; and
a sensing circuit including a read access transistor coupled to each of the plurality of memory cells, wherein respective bulk ports of the transistors of at least a first memory cell and a second memory cell of the plurality of memory cells are biased at different voltage levels, wherein, in response to the read access transistor receiving a read bit line voltage, the sensing circuit is configured to sense at least one of the first memory cell or the second memory cell.
2. The memory circuit of claim 1 , wherein the first memory cell o comprises a first electronic fuse (eFuse).
3. The memory circuit of claim 2 , wherein the second memory cell comprises a second eFuse.
4. The memory circuit of claim 2 , wherein in response to the sensing circuit sensing the first eFuse, the first eFuse provides a signal having a voltage level of zero volts.
5. The memory circuit of claim 1 , wherein a first bulk port of the transistor of the first memory cell is biased at a first voltage level.
6. The memory circuit of claim 5 , wherein a second bulk port of the transistor of the second memory cell is biased at a second voltage level that is less than the first voltage level.
7. The memory circuit of claim 1 , wherein the transistor of the first memory cell is a deep n-well (DNW) transistor and the transistor of the second memory cell is a bulk transistor.
8. The memory circuit of claim 1 , wherein the transistor of the first memory cell and the transistor of the second memory cell are each deep n-well (DNW) transistors.
9. The memory circuit of claim 1 , further comprising a write access transistor coupled to each of the first memory cell and the second memory cell.
10. The memory circuit of claim 1 , wherein, in response to the write access transistor receiving a write bit line voltage, a voltage source coupled to the write access transistor programs at least one of the first memory cell or the second memory cell.
11. The memory circuit of claim 1 , wherein the first memory cell and the second memory cell are each in series with a second resistor.
12. A memory circuit comprising:
a plurality of memory cells, each of the plurality of memory cells including a resistor and a transistor coupled to each other in series; and
a write access transistor coupled to each of the plurality of memory cells, wherein respective bulk ports of the transistors of at least a first memory cell and a second memory cell of the plurality of memory cells are biased at different voltage levels, wherein, in response to the write access transistor receiving a write bit line voltage, a voltage source coupled to the write access transistor programs at least one of the first memory cell or the second memory cell.
13. The memory circuit of claim 12 , wherein the first memory cell is a first electronic fuse (eFuse) and the second memory cell is a second eFuse.
14. The memory circuit of claim 13 , wherein the first eFuse is not programmed and the second eFuse is programmed.
15. The memory circuit of claim 13 , further comprising a sensing circuit coupled to the first eFuse, wherein, in response to the sensing circuit sensing the first eFuse, the first eFuse provides a signal having a voltage level of zero volts.
16. The memory circuit of claim 12 , wherein the resistor of the first memory cell is coupled to first routing having a first resistance and the resistor of the second memory cell is coupled to second routing having a second resistance greater than the first resistance.
17. The memory circuit of claim 12 , wherein the transistor of the first memory cell is a deep n-well (DNW) transistor and the transistor of the second memory cell is a bulk transistor.
18. The memory circuit of claim 12 , wherein the transistor of the first memory cell and the transistor of the second memory cell are each deep n-well (DNW) transistors.
19. A memory device comprising:
a substrate including a first portion and a second portion disposed over the first portion;
a first bulk electrode of a first word line (WL) transistor disposed over the second portion of the substrate;
a deep n-well disposed over the first portion of the substrate;
a pair of n-wells disposed over the deep n-well;
a p-well disposed over the deep n-well and in between the pair of n-wells;
a second bulk electrode of a second word line (WL) transistor disposed over the p-well; and
a write access transistor coupled to each of the first bulk electrode and the second bulk electrode, wherein, in response to the write access transistor receiving a write bit line voltage, a voltage source coupled to the write access transistor provides a voltage signal to the first bulk electrode and the second bulk electrode.
20. The memory device of claim 19 , further comprising a third bulk electrode of the second WL transistor disposed over a third portion of the substrate.