Bonded structure
A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.
1. A bonded structure comprising:
a first bonded member having a first bonding surface;
a second bonded member having a second bonding surface; and
a bonding layer that bonds the first bonding surface and the second bonding surface, wherein
the bonding layer includes:
a stress relaxation layer containing a chain polymer;
a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface; and
a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface,
a first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule,
a second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule, and
a third linear expansion coefficient of the first bonded member differs from a fourth linear expansion coefficient of the second bonded member by one or more orders of magnitude.
2. The bonded structure according to claim 1 , wherein
a bond between the first bonded molecule and the first bonding surface and a bond between the second bonded molecule and the second bonding surface are chemical bonds.
3. The bonded structure according to claim 1 , wherein
the bonding layer has anisotropic thermal expansion in a lamination direction, and
a first linear expansion coefficient of the bonding layer in the lamination direction is larger than a second linear expansion coefficient of the bonding layer in a direction perpendicular to the lamination direction.
4. The bonded structure according to claim 1 , wherein
the bonding layer has a thickness of 1 μm or more and 100 μm or less.
5. The bonded structure according to claim 1 , wherein
the bonding layer has an area of 400 mm 2 or more and 60,000 mm 2 or less.
6. The bonded structure according to claim 1 , wherein
the bonding layer has a Young's modulus of 0.005 MPa or more and 1 MPa or less.
7. The bonded structure according to claim 1 , wherein
the bonding layer has an elongation of 1 μm/μm or more and 100 μm/μm or less.
8. The bonded structure according to claim 1 , wherein
the bonding layer has a molecular weight of the chain polymer of 5,000 or more and 150,000 or less.
9. A bonded structure comprising:
a first bonded member having a first bonding surface;
a second bonded member having a second bonding surface; and
a bonding layer that bonds the first bonding surface and the second bonding surface, wherein
the bonding layer includes:
a stress relaxation layer containing a chain polymer;
a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface; and
a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface,
a first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule,
a second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule, and
the bonding layer has a Young's modulus of 0.005 MPa or more and 1 MPa or less.
10. A bonded structure comprising:
a first bonded member having a first bonding surface;
a second bonded member having a second bonding surface; and
a bonding layer that bonds the first bonding surface and the second bonding surface, wherein
the bonding layer includes:
a stress relaxation layer containing a chain polymer;
a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface; and
a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface,
a first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule,
a second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule, and
the bonding layer has an elongation of 1 μm/μm or more and 100 μm/μm or less.