Semiconductor device and substrate
A semiconductor device according to an embodiment includes a substrate and a semiconductor chip. The semiconductor chip is provided over the substrate. The substrate includes a wire layer and an insulating layer. The wire layer includes a wire electrically connected to the semiconductor chip. The insulating layer is provided in contact with the wire layer and includes a glass woven fabric containing a resin. The glass woven fabric includes a plurality of glass fibers that are provided along two or more directions parallel with the glass woven fabric and are woven. The glass fibers differ in at least one of the material, number, and thickness depending on the directions parallel with the glass woven fabric.
1. A semiconductor device comprising:
a substrate;
a semiconductor chip provided over the substrate; and
a sealing resin which is provided over the substrate and seals the semiconductor chip,
wherein:
the substrate includes
a wire layer including a wire electrically connected to the semiconductor chip, and
an insulating layer provided in contact with the wire layer and including a glass woven fabric containing a resin,
the glass woven fabric includes a plurality of glass fibers that are provided along two or more directions parallel with the glass woven fabric and are woven,
the glass fibers differ in at least one of a material, a number, and a thickness depending on the directions parallel with the glass woven fabric,
the glass woven fabric includes the glass fibers provided along a first direction and the glass fibers provided along a second direction different from the first direction,
the glass fibers provided along the first direction have a lower coefficient of thermal expansion than the glass fibers provided along the second direction,
a shape of an outer edge of the semiconductor chip as seen in a direction of a normal to a substrate surface of the substrate is substantially rectangular,
the first direction is a direction along long sides of the semiconductor chip,
the second direction is a direction along short sides of the semiconductor chip, and
the resin accounts for a larger part of a cross-sectional area along the short sides than a cross-sectional area along the long sides.
2. The semiconductor device according to claim 1 , wherein the glass fibers have different coefficients of thermal expansion depending on the directions parallel with the glass woven fabric.
3. The semiconductor device according to claim 1 , wherein proportions of materials of the glass fibers differ depending on the directions parallel with the glass woven fabric.
4. A semiconductor device comprising:
a substrate; and
a semiconductor chip provided over the substrate,
wherein:
the substrate includes
a plurality of wire layers each including a wire electrically connected to the semiconductor chip, and
a plurality of insulating layers provided to be alternately stacked with the plurality of wire layers, each of the insulating layers including a glass woven fabric containing a resin,
the glass woven fabric includes a plurality of glass fibers that are woven,
the glass fibers differ in at least one of a material, a number, and a thickness depending on the insulating layers,
glass fibers in a sixth insulating layer in contact with one of the wire layers including a high-speed signal wire that is configured to transmit a signal with a faster speed than other wires have a lower dielectric constant than glass fibers in a seventh insulating layer, the seventh insulating layer being located further from the one of the wire layers including the high-speed signal wire than is the sixth insulating layer,
the glass woven fabric includes the plurality of glass fibers that are provided along two or more directions parallel with the glass woven fabric and are woven, and
among the glass fibers in the sixth insulating layer, glass fibers provided along a signal transmission direction of the high-speed signal wire have a lower dielectric constant than glass fibers provided along a direction different from the signal transmission direction.
5. The semiconductor device according to claim 4 , wherein the glass fibers differ in at least one of a coefficient of thermal expansion and a dielectric constant depending on the insulating layers.
6. The semiconductor device according to claim 5 ,
wherein:
among the glass fibers in the plurality of insulating layers, glass fibers in a first insulating layer have a lower coefficient of thermal expansion than glass fibers in a second insulating layer, the second insulating layer being located closer to the semiconductor chip than is the first insulating layer.
7. The semiconductor device according to claim 5 , wherein among the glass fibers in the plurality of insulating layers, glass fibers in a first insulating layer have a lower coefficient of thermal expansion than glass fibers in a third insulating layer, the third insulating layer being located further from the semiconductor chip than is the first insulating layer.
8. The semiconductor device according to claim 7 ,
wherein:
the glass woven fabric includes the plurality of glass fibers that are provided along two or more directions parallel with the glass woven fabric and are woven, and
the glass fibers in at least one of the first insulating layer and the third insulating layer have different coefficients of thermal expansion depending on the directions parallel with the glass woven fabric.
9. The semiconductor device according to claim 5 , further comprising a metal bump on a second face of the substrate on a side opposite to a first face over which the semiconductor chip is provided,
wherein:
glass fibers in a fourth insulating layer in contact with one of the wire layers connected to the metal bump have a lower dielectric constant than glass fibers in a fifth insulating layer, the fifth insulating layer being located further from the one of the wire layers connected to the metal bump than is the fourth insulating layer.
10. The semiconductor device according to claim 4 ,
wherein:
the semiconductor chip includes
a memory chip, and
a controller chip configured to control the memory chip, and
the high-speed signal wire is electrically connected to the controller chip.
11. The semiconductor device according to claim 4 , wherein the signal transmission direction is a direction in which the high-speed signal wire is arranged longest as seen in a direction of a normal to a substrate surface of the substrate.
12. The semiconductor device according to claim 4 , wherein proportions of materials of the glass fibers differ depending on the insulating layers.