IP Library › Granted Patent US 12,225,338
Granted Patent B2
US 12,225,338 · App. 18/103,171 · Granted Feb 11, 2025

Home appliance having speech recognition function

Inventors: Hwa-Sung Kim (Yongin-si, KR); Dong Hyun Sohn (Hwaseong-si, KR); Ji-Eun Lee (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H04R1/04G10L15/26G10L15/28H01L25/0753H01L33/60H01L33/62H04R1/025
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,225,338
App. No.
18/103,171
Granted
Feb 11, 2025
Kind
B2
Abstract

A home appliance includes an electrical equipment compartment disposed in an upper portion of the home appliance, and including an upper side that is open, an electrical equipment compartment cover to cover the open upper side of the electrical equipment compartment, and including a speaker hole, a microphone accommodating portion which protrudes upward from an upper side of the electrical equipment compartment cover and including an accommodating space and a front portion that includes microphone holes laterally spaced apart from each other and which face toward a front of the home appliance, a microphone unit including a printed circuit board (PCB) disposed in the accommodation space behind the microphone holes and including microphone chips mounted on the PCB, and a speaker unit disposed in the electrical equipment compartment to correspond to the speaker hole.

Claims (28)

1. A home appliance comprising:

an electrical equipment compartment recessed downward from a top surface of the home appliance;

an electrical equipment compartment cover covering the electrical equipment compartment;

a microphone accommodating portion protruding upward from the electrical equipment compartment cover to form a space inside the microphone accommodating portion, and having a forward facing portion that includes a first microphone hole and a second microphone hole; and

a printed circuit board (PCB) accommodated in the space inside the microphone accommodating portion, and equipped with a first microphone chip having a sensing portion and a second microphone chip having a sensing portion,

wherein the first microphone chip and the second microphone chip are laterally spaced apart from each other, the first microphone chip is aligned with the first microphone hole so that speech transmitted from outside of the home appliance through the first microphone hole is detectable via the sensing portion of the first microphone chip, and the second microphone chip is aligned with the second microphone hole so that speech transmitted from outside of the home appliance through the second microphone hole is detectable via the sensing portion of the second microphone chip.

2. The home appliance of claim 1 , wherein the electrical equipment compartment cover is detachably coupled to the top surface of the home appliance.

3. The home appliance of claim 1 , wherein the PCB further includes:

a connector disposed between the first microphone chip and the second microphone chip, and

a terminal connected to the connector for speech signals received via the first microphone chip and the second microphone chip to be transmitted from the PCB.

4. The home appliance of claim 1 , wherein the sensing portion of the first microphone chip is aligned with the first microphone hole, and the sensing portion of the second microphone chip is aligned with the second microphone hole.

5. The home appliance of claim 1 , wherein

the forward facing portion of the microphone accommodating portion includes an inner surface located inside the microphone accommodating portion, and

the PCB is attached to the inner surface via a double-sided tape.

6. The home appliance of claim 1 , wherein the first microphone chip and the second microphone chip are spaced apart from each other by a distance greater than or equal to 30 mm and less than or equal to 100 mm.

7. The home appliance of claim 1 , wherein

the sensing portion of the first microphone chip and the sensing portion of the second microphone chip face forward,

the forward facing portion includes an inner surface located inside the microphone accommodating portion, and

the PCB is fixed to the inner surface.

8. The home appliance of claim 1 , wherein

the electrical equipment compartment cover includes a speaker hole, and

the home appliance further comprises a speaker accommodated in a space in the electrical equipment compartment so that sound from the speaker is transmittable through the speaker hole to outside of the home appliance.

9. The home appliance of claim 1 , further comprising:

a speaker, accommodated in the home appliance, to transmit sound outside of the home appliance.

10. The home appliance of claim 1 , wherein

the forward facing portion includes an inner surface located inside the microphone accommodating portion,

the PCB includes a first side fixed to the inner surface of the forward facing portion, and a second side opposite the first side,

wherein the first microphone chip and the second microphone chips are on the second side.

Priority Claims (1)
KR 10-2017-0111460 · Aug 31, 2017 · national
Continuity (3)
Continuation 17669633 · Feb 11, 2022
Continuation 16643214
Related Publication 20230178703A1 · Jun 8, 2023
References Cited (119)
US 8189818B2 · Takahashi et al. · 2012 [cited by applicant]
US 9134952B2 · Yi et al. · 2015 [cited by applicant]
US 9223540B2 · Park · 2015 [cited by applicant]
US 9525926B2 · Kim · 2016 [cited by examiner]
US 9739004B2 · Ha · 2017 [cited by applicant]
US 9819915B2 · Ku · 2017 [cited by applicant]
US 9863077B2 · Jung · 2018 [cited by applicant]
US 9866662B2 · Lee · 2018 [cited by applicant]
US 10351416B2 · Rombach · 2019 [cited by applicant]
US 11118294B2 · An et al. · 2021 [cited by applicant]
US 11259103B2 · Kim · 2022 [cited by applicant]
US 11606634B2 · Kim · 2023 [cited by examiner]
US 20050168910A1 · Won · 2005 [cited by applicant]
US 20060002576A1 · Akino · 2006 [cited by applicant]
US 20100189914A1 · Coulson · 2010 [cited by applicant]
US 20100259403A1 · Cho · 2010 [cited by examiner]
US 20130089218A1 · Kishinami · 2013 [cited by applicant]
US 20130222192A1 · Seo · 2013 [cited by applicant]
US 20130255327A1 · Park · 2013 [cited by applicant]
US 20140004904A1 · Rao et al. · 2014 [cited by applicant]
US 20140149118A1 · Lee et al. · 2014 [cited by applicant]
US 20140294217A1 · Yamaguchi · 2014 [cited by applicant]
US 20140367808A1 · Kuratani · 2014 [cited by applicant]
US 20150078565A1 · Tu et al. · 2015 [cited by applicant]
US 20150345065A1 · Yang · 2015 [cited by applicant]
US 20150379992A1 · Lee · 2015 [cited by applicant]
US 20160066083A1 · Son · 2016 [cited by applicant]
US 20160115632A1 · Jung · 2016 [cited by applicant]
US 20160215430A1 · Ha · 2016 [cited by applicant]
US 20160219359A1 · Kim · 2016 [cited by applicant]
US 20160345113A1 · Lee · 2016 [cited by applicant]
US 20160379642A1 · Ko · 2016 [cited by applicant]
US 20170055353A1 · Park · 2017 [cited by applicant]
US 20170069324A1 · Gardner et al. · 2017 [cited by applicant]
US 20170079482A1 · Tsibulevskiy · 2017 [cited by applicant]
US 20170149942A1 · Lee · 2017 [cited by applicant]
US 20170206900A1 · Lee · 2017 [cited by applicant]
US 20170211222A1 · Kim · 2017 [cited by applicant]
US 20170245360A1 · Jung · 2017 [cited by applicant]
US 20170251186A1 · Ku · 2017 [cited by applicant]
US 20170278477A1 · Jeong · 2017 [cited by applicant]
US 20170293272A1 · Jeong · 2017 [cited by applicant]
US 20170340106A1 · Choi · 2017 [cited by applicant]
US 20180002856A1 · Hombroek · 2018 [cited by applicant]
US 20180002857A1 · Hombroek · 2018 [cited by applicant]
US 20180002858A1 · Hombroek · 2018 [cited by applicant]
US 20180002859A1 · Hombroek · 2018 [cited by applicant]
US 20180063981A1 · Park · 2018 [cited by applicant]
US 20180080162A1 · Hoppe · 2018 [cited by applicant]
US 20180080164A1 · Hoppe · 2018 [cited by applicant]
US 20180171534A1 · Chae · 2018 [cited by applicant]
US 20190186064A1 · Kim · 2019 [cited by applicant]
US 20190214011A1 · Shin · 2019 [cited by applicant]
US 20200095818A1 · Lee · 2020 [cited by examiner]
US 20200213700A1 · Kim · 2020 [cited by examiner]
CN 1604010A · 2005 [cited by applicant]
CN 202709615U · 2013 [cited by applicant]
CN 103024625A · 2013 [cited by applicant]
CN 105122361A · 2015 [cited by applicant]
CN 205211412U · 2016 [cited by applicant]
CN 106162475A · 2016 [cited by applicant]
CN 106356061A · 2017 [cited by applicant]
CN 206117701U · 2017 [cited by applicant]
CN 106679326A · 2017 [cited by applicant]
CN 106839590A · 2017 [cited by applicant]
CN 206225001U · 2017 [cited by applicant]
DE 3503141A1 · 1986 [cited by applicant]
EP 2031121A1 · 2009 [cited by applicant]
JP 2006342996 · 2006 [cited by applicant]
JP 200892183 · 2008 [cited by applicant]
JP 2013239854 · 2013 [cited by applicant]
JP 201531498 · 2015 [cited by applicant]
JP 2016183786 · 2016 [cited by applicant]
JP 201769835 · 2017 [cited by applicant]
JP 2017133818 · 2017 [cited by applicant]
JP 6449073 · 2019 [cited by applicant]
KR 1020010073929A · 2001 [cited by applicant]
KR 102004016244 · 2004 [cited by applicant]
KR 1020060097455A · 2006 [cited by applicant]
KR 1020130109356A · 2013 [cited by applicant]
KR 1020140054960 · 2014 [cited by applicant]
KR 1020140095779A · 2014 [cited by applicant]
KR 1020140131197 · 2014 [cited by applicant]
KR 1020160003211 · 2016 [cited by applicant]
KR 1020160100731 · 2016 [cited by applicant]
KR 1020160137240A · 2016 [cited by applicant]
KR 1020170001406A · 2017 [cited by applicant]
KR 1020170017204 · 2017 [cited by applicant]
KR 1020170093629A · 2017 [cited by applicant]
KR 1020190084853 · 2019 [cited by applicant]
WO WO9927668 · 1999 [cited by applicant]
WO WO2014084413A1 · 2014 [cited by applicant]
WO 2015055239A1 · 2015 [cited by applicant]
ISA/KR, International Search Report and Written Opinion of the International Search Authority, International Application No. PCT/KR2018/007375, Oct. 19, 2018, 17 pages. [cited by applicant]
Supplementary European Search Report dated Jul. 10, 2020 in connection with European Patent Application No. 18 85 0288, 6 pages. [cited by applicant]
Non-Final Office Action dated May 12, 2021 in U.S. Appl. No. 16/643,214. [cited by applicant]
Notice of Allowance dated Oct. 6, 2021 in U.S. Appl. No. 16/643,214. [cited by applicant]
Communication pursuant to Article 94(3) EPC dated Dec. 8, 2021, in connection with European Application No. 18850288.4, 4 pages. [cited by applicant]
Notice of Preliminary Rejection dated Sep. 27, 2021, in connection with Korean Application No. 10-2017-0111460, 14 pages. [cited by applicant]
Supplemental Notice of Allowability dated Jan. 5, 2022 in U.S. Appl. No. 16/643,214. [cited by applicant]
Supplemental Notice of Allowability dated Jan. 12, 2022 in U.S. Appl. No. 16/643,214. [cited by applicant]
European Search Report dated Nov. 18, 2022, in European Application No. EP 22 18 7067. [cited by applicant]
Office Action dated Jan. 18, 2023, in Korean Application No. 10-2022-0057705. [cited by applicant]
Non-Final Office Action dated Apr. 14, 2022 in U.S. Appl. No. 17/669,633. [cited by applicant]
Notice of Allowance dated Jul. 7, 2022 in U.S. Appl. No. 17/669,633. [cited by applicant]
Notice of Allowance dated Oct. 31, 2022 in U.S. Appl. No. 17/669,633. [cited by applicant]
Corrected Notice of Allowability dated Dec. 2, 2022 in U.S. Appl. No. 17/669,633. [cited by applicant]
Corrected Notice of Allowability dated Feb. 10, 2023, in U.S. Appl. No. 17/669,633. [cited by applicant]
U.S. Appl. No. 17/669,663, filed Feb. 11, 2020, Hwa-Sung Kim, Samsung Electronics Co., Ltd. [cited by applicant]
U.S. Appl. No. 16/643,214 (U.S. Pat. No. 11,259,103), filed Feb. 28, 2020, Hwa-Sung Kim, Samsung Electronics Co., Ltd. [cited by applicant]
Office Action dated Sep. 7, 2023, in Chinese Application No. 201880054809.9. [cited by applicant]
Office Action dated Oct. 12, 2023, in European Application No. 18 850 288.4. [cited by applicant]
Office Action dated Jun. 12, 2023, in European Application No. 22 187 067.8. [cited by applicant]
Office Action dated Aug. 30, 2023, in Korean Application No. 10-2022-0057705. [cited by applicant]
Office Action dated Feb. 3, 2023 issued in Chinese Application No. 201880054809.9. [cited by applicant]
Office Action dated Apr. 26, 2023 issued in Korean Application No. 10-2022-0057705. [cited by applicant]
Office Action dated Jan. 3, 2024, in European Application No. 22 187 067.8. [cited by applicant]
European Search Report dated Jul. 15, 2024 issued in European Application No. EP 24 16 7858.0. [cited by applicant]
Communication under Rule 71(3) EPC, dated Nov. 18, 2024, in European Application No. 24 167 858.0. [cited by applicant]