IP Library › Granted Patent US 12,230,518
Granted Patent B2
US 12,230,518 · App. 17/516,212 · Granted Feb 18, 2025

Light irradiation type heat treatment apparatus

Inventor: Nobuhiko Nishide (Kyoto, JP)
Assignee: SCREEN HOLDINGS CO., LTD.
H01L21/67115G02B5/0215H01L21/67248H01L21/6875H05B3/0047
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Quick Facts
Patent No.
US 12,230,518
App. No.
17/516,212
Granted
Feb 18, 2025
Kind
B2
Abstract

A light diffusion plate made of quartz and provided with a plurality of recessed spherical surfaces is placed on an upper chamber window so as to be in opposed relation to a central portion of a semiconductor wafer. Flashes of light emitted from flash lamps and passing by the side of the light diffusion plate impinge upon a peripheral portion of the semiconductor wafer. On the other hand, flashes of light emitted from the flash lamps and entering the light diffusion plate are diverged by the recessed spherical surfaces. Part of the light entering the light diffusion plate is diffused toward the peripheral portion of the semiconductor wafer. As a result, this increases the amount of light impinging upon the peripheral portion of the semiconductor wafer, and decreases the amount of light impinging upon the central portion of the semiconductor wafer.

Claims (19)

1. A heat treatment apparatus for heating a substrate by irradiating the substrate with light, comprising:

a chamber for receiving a substrate therein;

a holder for holding said substrate in said chamber;

a light irradiation part provided on one side of said chamber and for irradiating said substrate held by said holder with a flash of light; and

a light diffusion plate provided on an upper surface of a chamber window between said holder and said light irradiation part and having a size smaller than that of said substrate as seen in plan view, wherein

said light irradiation part includes a plurality of flash lamps arranged in a plane,

said plurality of flash lamps are disposed in a region larger than an area of said substrate as seen in plan view,

said light diffusion plate is disposed so that a central axis of said light diffusion plate coincides with a central axis of said substrate held by said holder,

said light diffusion plate is provided with a plurality of recessed or protruding spherical surfaces having the same radius of curvature,

said flashes of light emitted from said plurality of flash lamps and passing by the side of said light diffusion plate are transmitted through said chamber window to impinge upon a peripheral portion of said substrate, and

part of said flashes of light emitted from said plurality of flash lamps entering said light diffusion plate is diffused toward the peripheral portion of said substrate.

2. The heat treatment apparatus according to claim 1 , wherein

said light irradiation part irradiates said substrate with said flash of light through said chamber window, an irradiation time period of said flash of light is ranging from 0.1 to 100 milliseconds.

3. The heat treatment apparatus according to claim 1 , wherein

said plurality of flash lamps are arranged in a plane so that the longitudinal directions of the flash lamps are in parallel with each other along a main surface of said substrate held by said holder.

4. The heat treatment apparatus according to claim 1 , wherein

said plurality of recessed or protruding spherical surfaces are formed at a uniform density in said light diffusion plate.

5. The heat treatment apparatus according to claim 1 , wherein

said light diffusion plate is hexagon or octagon in plan view.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 4, 2021
From: NISHIDE, NOBUHIKO
To: SCREEN HOLDINGS CO., LTD.
Reel/Frame 058015/0104 →
Priority Claims (1)
JP 2017-081911 · Apr 18, 2017 · national
Continuity (2)
Continuation 15954237 · Apr 16, 2018
Related Publication 20220051915A1 · Feb 17, 2022
References Cited (43)
US 6897911B2 · Yamaguchi · 2005 [cited by applicant]
US 6905983B2 · Itani · 2005 [cited by applicant]
US 7509035B2 · Ranish et al. · 2009 [cited by applicant]
US 8138451B2 · Gat et al. · 2012 [cited by applicant]
US 20020195437A1 · Kusuda · 2002 [cited by applicant]
US 20030080104A1 · Kusuda · 2003 [cited by applicant]
US 20040108519A1 · Itani · 2004 [cited by applicant]
US 20060291832A1 · Ito · 2006 [cited by applicant]
US 20090097245A1 · Hsu et al. · 2009 [cited by applicant]
US 20100139165A1 · Oyama · 2010 [cited by applicant]
US 20130294756A1 · Lim et al. · 2013 [cited by applicant]
US 20140341551A1 · Ranish · 2014 [cited by applicant]
US 20180301360A1 · Nishide · 2018 [cited by applicant]
JP 60161616A · 1985 [cited by applicant]
JP 63002318A · 1988 [cited by applicant]
JP 63260018A · 1988 [cited by applicant]
JP 2000349038A · 2000 [cited by applicant]
JP 2002064069A · 2002 [cited by applicant]
JP 2002110580A · 2002 [cited by applicant]
JP 2003031517A · 2003 [cited by applicant]
JP 2004186495A · 2004 [cited by applicant]
JP 2004349389 · 2004 [cited by examiner]
JP 2004319754 · 2004 [cited by examiner]
JP 2006278802A · 2006 [cited by applicant]
JP 2009123807A · 2009 [cited by applicant]
JP 4866020B2 · 2012 [cited by applicant]
TW I297512B · 2008 [cited by applicant]
TW 200834185A · 2008 [cited by applicant]
TW 200844513A · 2008 [cited by applicant]
TW I712088B · 2020 [cited by applicant]
Korean Notification of Reason for Refusal issued in corresponding Korean Patent Application No. 10-2018-0043985, dated Aug. 3, 2019, with English translation. [cited by applicant]
Korean Notification of Reason for Refusal issued in corresponding Korean Patent Application No. 10-2018-0043985, dated Jan. 14, 2020, with English translation. [cited by applicant]
Japanese Office Action issued in corresponding Japanese Patent Application No. 2017-081911, dated Oct. 27, 2020, with English translation. [cited by applicant]
Decision of Refusal issued in corresponding Taiwanese Patent Application No. 107112869, dated Apr. 25, 2019, with English Translation of the Japanese Translation of the Taiwanese Decision of Refusal. [cited by applicant]
Taiwanese Office Action issued in corresponding Taiwanese Patent Application No. 107112869, dated Apr. 16, 2020, with English Translation of the Japanese Translation of the Taiwanese Office Action. [cited by applicant]
Korean Decision to Grant a Patent issued in corresponding Korean Patent Application No. 10-2018-0043985, dated May 12, 2020, with English translation. [cited by applicant]
Taiwanese Office Action issued in corresponding Taiwanese Patent Application No. 109123131, dated Mar. 31, 2021, with English Translation of the Japanese Translation of the Taiwanese Office Action. [cited by applicant]
U.S. PTO Non-Final Office issued in related parent U.S. Appl. No. 15/954,237, dated Jan. 27, 2020. [cited by applicant]
U.S. PTO Final Office issued in related parent U.S. Appl. No. 15/954,237, dated Sep. 18, 2020. [cited by applicant]
U.S. PTO Non-Final Office issued in related parent U.S. Appl. No. 15/954,237, dated Mar. 19, 2021. [cited by applicant]
U.S. PTO Final Office issued in related parent U.S. Appl. No. 15/954,237, dated Aug. 3, 2021. [cited by applicant]
Parent U.S. Appl. No. 15/954,237, filed Apr. 16, 2018. [cited by applicant]
Taiwanese Office Action issued in corresponding Taiwanese Patent Application No. 107112869, dated Dec. 11, 2018, with English Translation of the Japanese Translation of the Taiwanese Office Action. [cited by applicant]