Electronic components for soft, flexible circuitry layers and methods therefor
A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.
1. An electronic element, comprising:
a first piece of conductive mesh;
a second piece of conductive mesh, wherein at least one of the first piece of conductive mesh or the second piece of conductive mesh includes:
at least one high-pitch circuitry trace component;
a lighting component of a circuitry that includes the at least one of the first piece of conductive mesh or the second piece of conductive mesh; and
an interfacing component electrically connected to the at least one high-pitch circuitry trace component, the interfacing component including:
at least one low-pitch circuitry trace component; and
circuitry for transitioning between the at least one high-pitch circuitry trace component and the at least one low-pitch circuitry trace component;
wherein deformation of the first piece of conductive mesh relative to the second piece of conductive mesh is operative to control the lighting component.
2. The electronic element of claim 1 , wherein the lighting component is formed on the circuitry using a desired pattern.
3. The electronic element of claim 1 , wherein deformation of the first piece of the conductive mesh is operative to adjusting a pattern of the lighting component.
4. The electronic element of claim 1 , wherein the conductive mesh is deformed via contact of a user's hand.
5. The electronic element of claim 1 , wherein an overmold is formed over at least a portion of the interfacing component, the overmold being formed of urethane or polymer.
6. The electronic element of claim 5 , wherein the interfacing component further includes a connector configured to be detachably connected to an external device.
7. The electronic element of claim 1 , further comprising a printed LED.
8. The electronic element of claim 1 , further comprising an insulating material.
9. The electronic element of claim 1 , further comprising a control element configured to provide a lighting algorithm to turn on and off different lighting panels of the electronic element.
10. The electronic element of claim 1 , further comprising one or more fuse mount pads configured to protect the electronic element when the lighting component overheats.
11. An electronic element, comprising:
a first piece of conductive mesh including a capacitive touch portion, the first piece of conductive mesh configured to be in electrical connection with a lighting component; and
a second piece of conductive mesh;
wherein, when a portion of the first piece of conductive mesh has a first position relative to a portion of the second piece of conductive mesh, the lighting component is in a first electrical state and, when the portion of the first piece of conductive mesh has a second position, different from the first position, relative to the portion of the second piece of conductive mesh, the lighting component is in a second electrical state, different from the first state, and wherein at least one of the first piece of conductive mesh or the second piece of conductive mesh includes at least one high-pitch circuitry trace component.
12. The electronic element of claim 11 , wherein the first electronic state and the second electronic state are different settings of the lighting component.
13. The electronic element of claim 11 , wherein the first electrical state is an off state, and wherein the second electrical state is an on state.
14. The electronic element of claim 11 , further comprising an insulating material disposed between the first piece of conductive mesh and the second piece of conductive mesh.
15. The electronic element of claim 11 , wherein the at least one of the first piece of conductive mesh or the second piece of conductive mesh is electrically connected to an interfacing component.
16. The electronic element of claim 15 , wherein the interfacing component includes circuitry for transitioning between the at least one high-pitch circuitry trace component and at least one low-pitch circuitry trace component of the interfacing component.
17. A method for manufacturing a flexible circuitry layer, comprising:
providing a first piece of conductive mesh including at least one high-pitch circuitry trace component, the first piece of conductive mesh configured to be in electrical connection with a lighting component;
providing a second piece of conductive mesh, wherein deformation of the first piece of conductive mesh relative to the second piece of conductive mesh is operative to control the lighting component;
connecting the at least one high-pitch circuitry trace component to a terminal of an interfacing component, the interfacing component including at least one low-pitch circuitry trace component;
applying an insulating layer to the high-pitch circuitry trace component; and
applying an encapsulation layer to the interfacing component.
18. The method of claim 17 , wherein the encapsulation layer is formed from urethane or polymer.
19. The method of claim 17 , wherein connecting the at least one high-pitch circuitry trace component to the terminal of the interfacing component includes attaching by applying a conductive epoxy.
20. The method of claim 17 , wherein the at least one high-pitch circuitry trace component is formed by a subtractive manufacturing technique.