Semiconductor package
A semiconductor package may include at least one first rewiring structure, the at least one first rewiring structure including a plurality of first insulating layers vertically stacked and a plurality of first rewiring patterns included in the plurality of first insulating layers, at least one semiconductor chip on the at least one first rewiring structure, and at least one molding layer covering the at least one semiconductor chip, wherein each of the plurality of first rewiring patterns includes, a first conductive pattern, the first conductive pattern including a curved upper surface, and a first seed pattern covering a side surface and a lower surface of the first conductive pattern, and each of the first seed patterns of the plurality of first rewiring patterns having a same shape.
1. A semiconductor package comprising:
at least one first rewiring structure, the at least one first rewiring structure including a plurality of first insulating layers vertically stacked and a plurality of first patterned rewiring layers included in the plurality of first insulating layers;
at least one semiconductor chip on the at least one first rewiring structure; and
at least one molding layer covering the at least one semiconductor chip,
wherein each of the plurality of first patterned rewiring layers includes,
a first patterned conductive layer, the first patterned conductive layer including a curved upper surface, and
a first patterned seed layer covering a side surface and a lower surface of the first patterned conductive layer and having a conformal shape.
2. The semiconductor package of claim 1 , wherein
the curved upper surface of the first patterned conductive layer is concave.
3. The semiconductor package of claim 1 , wherein
the curved upper surface of the first patterned conductive layer has a decreasing height towards a midpoint of the first patterned conductive layer.
4. The semiconductor package of claim 1 , wherein each of the plurality of first patterned rewiring layers includes:
a first trace portion horizontally extending; and
a first via portion vertically extending from the first trace portion, the first via portion including a curved lower surface.
5. The semiconductor package of claim 4 , wherein
the curved lower surface of the first via portion is convex.
6. The semiconductor package of claim 1 , further comprising:
at least one intermediate connection structure, the at least one intermediate connection structure located horizontal to the at least one semiconductor chip,
the intermediate connection structure including,
at least one insulating layer, and
a plurality of through-silicon vias (TSVs) connected to corresponding first patterned rewiring layers from among the plurality of first patterned rewiring layers through the insulating layer.
7. The semiconductor package of claim 6 , further comprising:
at least one second rewiring structure including a plurality of second insulating layers vertically stacked and a plurality of second patterned rewiring layers included in the plurality of second insulating layers, wherein the intermediate connection structure is between the second rewiring structure and the first rewiring structure.
8. The semiconductor package of claim 7 , wherein each of the plurality of second patterned rewiring layers includes:
at least one second patterned conductive layer; and
at least one second patterned seed layer covering a side surface and a lower surface of the at least one second patterned conductive layer, each of the at least one second patterned seed layer having a same shape, and the at least one second patterned seed layer including a concave upper surface.
9. The semiconductor package of claim 8 , wherein
the concave upper surface of the second patterned conductive layer having a decreasing height toward a midpoint of the second patterned conductive layer.
10. The semiconductor package of claim 7 , wherein each of the plurality of second patterned rewiring layers includes:
a horizontal second trace portion; and
a second via portion, the second via portion extended vertically from the horizontal second trace portion, the second via portion including a convex lower surface.
11. A semiconductor package comprising:
at least one first rewiring structure including a plurality of first insulating layers stacked in a first direction and a plurality of first patterned rewiring layers included in the plurality of first insulating layers;
at least one semiconductor chip on the at least one first rewiring structure; and
at least one second rewiring structure apart from the first rewiring structure in the first direction with the at least one semiconductor chip therebetween, the at least one second rewiring structure including a plurality of second insulating layers stacked in the first direction and a plurality of second patterned rewiring layers included in the plurality of second insulating layers, and
each of the plurality of second patterned rewiring layers includes,
at least one second patterned conductive layer, and
at least one second patterned seed layer covering a side surface and a lower surface of the second patterned conductive layer and having a conformal shape.
12. The semiconductor package of claim 11 , wherein
the curved upper surface of the second patterned conductive layer has a decreasing height toward a midpoint of the second patterned conductive layer.
13. The semiconductor package of claim 11 , wherein each of the plurality of second patterned rewiring layers includes:
at least one horizontal second trace portion; and
at least one second via portion extended vertically from the horizontal second trace portion, the second via portion including a convex lower surface.
14. The semiconductor package of claim 11 , further comprising:
at least one insulating layer between the at least one first rewiring structure and the at least one second rewiring structure, the at least one insulating layer horizontal to the at least one semiconductor chip; and
a plurality of through-silicon vias (TSVs) configured to provide an electrical connection between the plurality of first and second rewiring structures through the plurality of insulating layers.
15. The semiconductor package of claim 11 , further comprising:
at least one molding layer covering the at least one semiconductor chip and the at least one first rewiring structure; and
a plurality of conductive posts connected to the plurality of first patterned rewiring layers and the plurality of second patterned rewiring layers through the at least one molding layer.
16. A semiconductor package comprising:
a plurality of first through third insulating layers sequentially stacked in a first direction;
a plurality of first patterned rewiring layers, each of the plurality of first patterned rewiring layers including a first via portion and a first trace portion, the first via portion arranged through the first insulating layer in the first direction, and the first trace portion on the respective first insulating layer;
a plurality of second patterned rewiring layers, the plurality of second patterned rewiring layers each including a second via portion and a second trace portion, the second via portion arranged through the second insulating layer in the first direction, and the second trace portion on the respective second insulating layer;
a plurality of third patterned rewiring layers each including a third via portion connected to the second trace portion through the third insulating layer, and a third trace portion on the third insulating layer; and
at least one semiconductor chip electrically connected to at least one of the plurality of third patterned rewiring layers, wherein
each of the first patterned rewiring layers includes,
a first patterned conductive layer, the first patterned conductive layer including a concave upper surface, and
a first patterned seed layer covering a side surface and a lower surface of the first patterned conductive layer and having a conformal shape,
each of the second patterned rewiring layers includes,
a second patterned conductive layer, the second patterned conductive layer including a concave upper surface, and
a second patterned seed layer covering a side surface and a lower surface of the second patterned conductive layer, each of the second patterned seed layers having a same shape, and
each of the third patterned rewiring layers includes,
a third patterned conductive layer, the third patterned conductive layer including a concave upper surface, and
a third patterned seed layer covering a side surface and a lower surface of the third patterned conductive layer, each of the third patterned seed layers having a same shape.
17. The semiconductor package of claim 16 , wherein
the second via portion of each of the second patterned rewiring layers includes a concave curved lower surface; and
the third via portion of each of the third patterned rewiring layers includes a concave curved lower surface.
18. The semiconductor package of claim 16 , wherein
the upper surface of each of the first through third patterned conductive layers is further recessed toward a respective center thereof.
19. The semiconductor package of claim 16 , wherein
the first via portion of each of the first patterned rewiring layers includes a flat lower surface.
20. The semiconductor package of claim 16 , further comprising:
at least one intermediate connection structure horizontal to the at least one semiconductor chip, and
the at least one intermediate connection structure includes,
an insulating layer and
a plurality of through-silicon vias (TSVs) connected to corresponding third patterned rewiring layers from among the plurality of third patterned rewiring layers through the insulating layer.