Semiconductor structure and method for manufacturing the same
A semiconductor structure includes a first substrate, a plurality of first bonding pads disposed in the first dielectric layer, a plurality of second bonding pads disposed in the first dielectric layer, a second substrate, and a dielectric layer between the first substrate and the second substrate. The first bonding pads have a first width, and the second bonding pads have a second width greater than the first width. The second width is greater than the first width. The second bonding pads are arranged to form a frame pattern surrounding the first bonding pads. The first bonding pads and the second bonding pads are arranged to form a plurality of columns and a plurality of rows. Two of the second bonding pads are disposed at two opposite ends of each column and two opposite ends of each row.
1. A semiconductor structure comprising:
a first semiconductor die substrate;
a plurality of first bonding pads disposed over the first semiconductor die substrate and comprising a first width, wherein each of the first bonding pads has a first surface facing the first semiconductor die substrate and a second surface opposite to the first surface;
a plurality of second bonding pads disposed over the first semiconductor die substrate and comprising a second width greater than the first width, wherein the second bonding pads are arranged to form a frame pattern surrounding the first bonding pads, and each of the second bonding pads has a first surface facing the first semiconductor die substrate and a second surface opposite to the first surface with a width substantially equal to that of the first surface, and the second surface of at least one of the second bonding pad is flush with the second surface of at least one of the first bonding pad;
a second semiconductor die substrate;
a plurality of third bonding pads disposed over the second semiconductor die substrate, wherein each of the third bonding pads has a first surface and a second surface opposite to the first surface, and each of the bonding pads has a third width;
a plurality of fourth bonding pads disposed over the second semiconductor die substrate, wherein each of the fourth bonding pads has a fourth width greater than the third width; and
a dielectric structure between the first semiconductor die substrate and the second semiconductor die substrate, wherein the dielectric structure comprises a first dielectric layer and a second dielectric layer bonded to each other,
wherein the first dielectric layer has a first surface aligned with the first surfaces of the first bonding pads and the first surfaces of the second bonding pads, and the second dielectric layer has a second surface aligned with the second surfaces of the third bonding pads,
wherein the third bonding pads are in contact with the first bonding pads, and the fourth bonding pads are in contact with the second bonding pads,
wherein a difference between the second width and the first width is positively correlated with a size of the semiconductor structure comprising the first semiconductor die substrate, the first bonding pads and the second bonding pads,
wherein a thickness of the first dielectric layer is substantially equal to thicknesses of the first bonding pads and thicknesses of the second bonding pads, and a thickness of the second dielectric layer is substantially equal to thicknesses of the third bonding pads and thicknesses of the fourth bonding pads.
2. The semiconductor structure of claim 1 , wherein the first bonding pads and the second bonding pads are embedded in the dielectric structure.
3. The semiconductor structure of claim 1 , wherein the first surface of the first dielectric layer is in contact with the first semiconductor die substrate and the second surface of the second dielectric layer is in contact with the second semiconductor die substrate.
4. The semiconductor structure of claim 1 , wherein the first dielectric layer has a third surface facing the second semiconductor die substrate, and the second surfaces of the second bonding pads are entirely flush with the third surface of the first dielectric layer.
5. The semiconductor structure of claim 1 , wherein the third width of the third bonding pad is equal to the first width of the first bonding pads.
6. The semiconductor structure of claim 1 , wherein each of the third bonding pads is in physical contact with a portion of the one of the first bonding pads.
7. The semiconductor structure of claim 1 , wherein the difference between the second width and the first width is correlated negatively with a thickness of the semiconductor structure.
8. The semiconductor structure of claim 1 , wherein the fourth width of each fourth bonding pad is equal to the second width of each second bonding pad.
9. A semiconductor structure comprising:
a first semiconductor die substrate;
a first dielectric layer disposed over the first semiconductor die substrate;
a plurality of first bonding pads disposed over the first semiconductor die substrate and in the first dielectric layer;
a plurality of second bonding pads disposed over the first semiconductor die substrate and in the first dielectric layer, wherein a width of each second bonding pad is greater than a width of each first bonding pad;
a second semiconductor die substrate;
a second dielectric layer disposed over the second semiconductor die substrate and bonded to the first dielectric layer;
a plurality of third bonding pads disposed over the second semiconductor die substrate and in the second dielectric layer; and
a plurality of fourth bonding pads disposed over the second semiconductor die substrate and in the second dielectric layer, wherein a width of the fourth bonding pad is greater than a width of each third bonding pad,
wherein the first bonding pads are separated from each other in a first distance, and the second bonding pad is separated from its adjacent first bonding pad in a second distance, and the second distance is greater than the first distance,
wherein the third bonding pads are in physical contact with the first bonding pads, and the fourth bonding pads are in physical contact with the second bonding pads,
wherein a difference between the width of each second bonding pad and the width of each first bonding pad is correlated positively with a size of the semiconductor structure comprising the first semiconductor die substrate, the first bonding pads and the second bonding pads,
wherein a thickness of the first dielectric layer is substantially equal to thicknesses of the first bonding pads and thicknesses of the second bonding pads, and a thickness of the second dielectric layer is substantially equal to thicknesses of the third bonding pads and thicknesses of the fourth bonding pads,
wherein at least one of the second bonding pads has a bottom surface facing the second semiconductor die substrate, and the bottom surface of the second bonding pad is in contact with a top surface of one of the fourth bonding pads throughout a span of the bottom surface.
10. The semiconductor structure of claim 9 , wherein a top surface of the first dielectric layer is substantially aligned with top surfaces of the first bonding pads and top surfaces of the second bonding pads.
11. The semiconductor structure of claim 9 , wherein the difference between the width of each second bonding pad and the width of each first bonding pad is correlated negatively with a thickness of the semiconductor structure.
12. The semiconductor structure of claim 9 , wherein a top surface of the second dielectric layer is substantially aligned with top surfaces of the third bonding pads and top surfaces of the fourth bonding pads.
13. The semiconductor structure of claim 9 , wherein the width of each fourth bonding pad is equal to the width of each second bonding pad.
14. A semiconductor structure comprising:
a first semiconductor die substrate;
a second semiconductor die substrate; and
a bonding structure disposed between the first semiconductor die substrate and the second semiconductor die substrate, wherein the bonding structure comprises:
a dielectric structure comprising a first dielectric layer and a second dielectric layer bonded to each other;
a plurality of first bonding pads disposed in the first dielectric layer;
a plurality of second bonding pads disposed in the first dielectric layer; and
a plurality of third bonding pads and a plurality of fourth bonding pads disposed in the second dielectric layer, wherein each third bonding pad is in direct contact with and bonded to the first bonding pad, and each fourth bonding pad is in direct contact with and bonded to the second bonding pad,
wherein the second bonding pads are arranged to form a frame pattern surrounding the first bonding pads, a width of each first bonding pad is less than a width of each second bonding pad, and a width of each third bonding pad is less than a width of each fourth bonding pad,
wherein a difference between the width of each second bonding pad and the width of each first bonding pad is correlated positively with a size of the semiconductor structure comprising the first semiconductor die substrate, the first bonding pads and the second bonding pads,
wherein a thickness of the first dielectric layer is substantially equal to thicknesses of the first bonding pads and thicknesses of the second bonding pads, and a thickness of the second dielectric layer is substantially equal to thicknesses of the third bonding pads and thicknesses of the fourth bonding pads,
wherein at least one of the first bonding pads has an entire surface facing the second semiconductor die substrate, at least one of the second bonding pads has an entire surface facing the second semiconductor die substrate, and the entire surface of the first bonding pad is flush with the entire surface of the second bonding pad.
15. The semiconductor structure of claim 14 , wherein the width of the third bonding pad is equal to the width of each first bonding pad.
16. The semiconductor structure of claim 14 , wherein sidewalls of the second bonding pad and a portion of a bottom surface of the second bonding pad are in contact with the dielectric structure.
17. The semiconductor structure of claim 14 , wherein the first bonding pads are separated from each other in a first distance, and the second bonding pad is separated from its adjacent first bonding pad in a second distance, and the second distance is greater than the first distance.
18. The semiconductor structure of claim 17 , wherein the third bonding pads separated from each other in a third distance, and the third distance is equal to the first distance.
19. The semiconductor structure of claim 14 , wherein each of the first bonding pads has a first diameter and a second diameter perpendicular to the first diameter, each of the second bonding pads has a first diameter and a second diameter perpendicular to the first diameter, and the first diameter and the second diameter of the second bonding pad are greater than the first diameter and the second diameter of the first bonding pad.
20. The semiconductor structure of claim 14 , wherein the difference between the width of each second bonding pad and the width of each first bonding pad is correlated negatively with a thickness of the semiconductor structure.