Electronic device including sheilding structure
The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.
1. An electronic device comprising:
a circuit board;
a first component disposed on the circuit board;
a shield can disposed to surround at least a part of the first component and including an opening; and
a nanofiber film disposed on the shield can to cover the opening,
wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction,
the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and
the second layer having a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.
2. The electronic device of claim 1 , the device further including: a heat diffusion member comprising heat diffusing material disposed on an upper position of the nanofiber film.
3. The electronic device of claim 2 , wherein the first layer is in contact with at least a part of the shield can, and
the heat diffusion member is disposed on an upper position of the third layer.
4. The electronic device of claim 1 , wherein the first layer includes a conductive filler.
5. The electronic device of claim 4 , wherein the conductive filler includes at least one of carbon-based or metal-based materials.
6. The electronic device of claim 1 , wherein the third layer is coated with an adhesive material.
7. The electronic device of claim 6 , wherein the adhesive material includes a pressure-sensitive adhesive (PSA).
8. The electronic device of claim 1 , the device further including: a filling member comprising a thermally conductive material disposed between the first component and the nanofiber film.
9. The electronic device of claim 1 , wherein the filling member is in a liquid state or a semi-solid state.
10. The electronic device of claim 1 , wherein an air permeability of the first layer or the third layer is less than an air permeability of the second layer.
11. The electronic device of claim 1 , wherein a thickness of the nanofiber of the first layer or the third layer is less than a thickness of the nanofiber of the second layer.
12. The electronic device of claim 1 , wherein the nanofiber film further includes: an auxiliary opening, and
the auxiliary opening is disposed to correspond to the opening.