Metallization structure
A metallization structure electrically connected to a conductive bump is provided. The metallization structure includes an oblong-shaped or elliptical-shaped redistribution pad, a conductive via disposed on the oblong-shaped or elliptical-shaped redistribution pad, and an under bump metallurgy covering the conductive via, wherein the conductive bump is disposed on the UBM. Furthermore, a package structure including the above-mentioned metallization structures is provided.
1. A metallization structure of a redistribution circuit structure electrically connected to a semiconductor die through a conductive bump, the semiconductor die being disposed on a die bonding area of the redistribution circuit structure, and the metallization structure comprising:
an oblong-shaped or elliptical-shaped redistribution pad;
a conductive via disposed on the oblong-shaped or elliptical-shaped redistribution pad; and
an under bump metallurgy (UBM) covering the conductive via, wherein the conductive bump is disposed on the UBM,
wherein the die bonding area of the redistribution circuit structure covered by the semiconductor die is categorized into quadrants I, II, II, and IV by Cartesian coordinate with a center of the die bonding area as origin, and
wherein a first orientation of the oblong-shaped or elliptical-shaped redistribution pads located on quadrant I is different from a second orientation of oblong-shaped or elliptical-shaped redistribution pads located on quadrant II.
2. The metallization structure of claim 1 , wherein a center of the oblong-shaped or elliptical-shaped redistribution pad is substantially aligned with a center of the UBM.
3. The metallization structure of claim 1 , wherein the UBM comprises a circle-shaped UBM, A1 is a diameter of circle-shaped UBM, B1 is a length of the oblong-shaped or elliptical-shaped redistribution pad in short axis, B2 is a length of the oblong-shaped or elliptical-shaped redistribution pad in long axis, C is a diameter of conductive via, and A1, B1, B2 and C satisfy the following inequality (1):
B 2> A 1≥ B 1> C (1).
4. The metallization structure of claim 3 , wherein A1 and C satisfy the following inequality (2):
6.4 ≥A 1 /C≥ 1.5 (2).
5. The metallization structure of claim 3 , wherein A1, B1, and B2 satisfy the following inequalities (3)˜(5):
1≥ B 1/ A 1≥0.6 (3);
3≥ B 2/ A 1>1 (4); and
3 ≥B 2 /B 1>1 (5).
6. The metallization structure of claim 1 , wherein the UBM comprises an octagon-shaped UBM, A2 is a distance between a pair of opposite sides of the octagon-shaped UBM, B1 is a length of the oblong-shaped or elliptical-shaped redistribution pad in short axis, B2 is a length of the oblong-shaped or elliptical-shaped redistribution pad in long axis, C is a diameter of conductive via, and A2, B1, B2 and C satisfy the following inequality (1):
B 2> A 2≥ B 1> C (1).
7. The metallization structure of claim 6 , wherein A2 and C satisfy the following inequality (2):
6.4 ≥A 1 /C≥ 1.5 (2).
8. The metallization structure of claim 6 , wherein A2, B1, and B2 satisfy the following inequalities (3)˜(5):
1≥ B 1/ A 1≥0.6 (3);
3≥ B 2/ A 1>1 (4); and
3 ≥B 2 /B 1>1 (5).
9. The metallization structure of claim 1 further comprising:
a first dielectric layer; and
a second dielectric layer disposed on the first dielectric layer and covering the oblong-shaped or elliptical-shaped redistribution pad, wherein the oblong-shaped or elliptical-shaped redistribution pad is disposed on the first dielectric layer, the conductive via is embedded in the second dielectric layer, and the UBM is disposed on the second dielectric layer.
10. A metallization structure of a redistribution circuit structure electrically connected to a semiconductor die, the semiconductor die being disposed on a die bonding area of the redistribution circuit structure, and the metallization structure comprising:
oblong-shaped or elliptical-shaped conductive pads;
a dielectric layer covering the oblong-shaped or elliptical-shaped conductive pads;
conductive vias penetrating through the dielectric layer and in contact with the oblong-shaped or elliptical-shaped conductive pads; and
under bump metallurgies (UBMs) disposed on the dielectric layer and in contact with the conductive vias,
wherein the die bonding area of the redistribution circuit structure covered by the semiconductor die is categorized into quadrants I, II, II, and IV by Cartesian coordinate with a center of the die bonding area as origin,
wherein an included angle between long axis of each of the oblong-shaped or elliptical-shaped conductive pads located in quadrant I and quadrant III and x-axis of Cartesian coordinate is between 0° and 90°, and
wherein an included angle between long axis of each of the oblong-shaped or elliptical-shaped conductive pads located in quadrant II and quadrant IV and x-axis of Cartesian coordinate is between 90° and 180°.
11. The metallization structure of claim 10 , wherein long axis of each of the oblong-shaped or elliptical-shaped conductive pads located on x-axis of Cartesian coordinate is substantially parallel with x-axis.
12. The metallization structure of claim 10 , wherein long axis of each of the oblong-shaped or elliptical-shaped conductive pads located on y-axis of Cartesian coordinate is substantially parallel with y-axis.
13. The metallization structure of claim 10 further comprising:
a central conductive pad located at the center; and
a central UBM, wherein the central conductive pad is smaller than the central UBM.
14. The metallization structure of claim 10 , wherein long axes of the oblong-shaped or elliptical-shaped conductive pads extend to pass through the center of the die bonding area.
15. A metallization structure of a redistribution circuit structure electrically connected to a semiconductor die, the semiconductor die being disposed on a die bonding area of the redistribution circuit structure, and the metallization structure comprising:
oblong-shaped or elliptical-shaped conductive pads;
a dielectric layer covering the oblong-shaped or elliptical-shaped conductive pads;
conductive vias penetrating through the dielectric layer and in contact with the oblong-shaped or elliptical-shaped conductive pads; and
under bump metallurgies (UBMs) disposed on the dielectric layer and in contact with the conductive vias,
wherein the die bonding area of the redistribution circuit structure covered by the semiconductor die is categorized into quadrants I, II, II, and IV by Cartesian coordinate with a center of the die bonding area as origin, and
an included angle between long axis of each of the oblong-shaped or elliptical-shaped conductive pads located in quadrant I and quadrant III and x-axis of Cartesian coordinate is between 0° and 90°,
an included angle between long axis of each of the oblong-shaped or elliptical-shaped conductive pads located in quadrant II and quadrant IV and x-axis of Cartesian coordinate is between 90° and 180°,
third conductive bumps disposed on the redistribution circuit structure, the third conductive bumps and the second conductive bumps being respectively disposed at opposite surfaces of the redistribution circuit structure, and the oblong-shaped or elliptical-shaped conductive pad is not physically in contact with the third conductive bumps.
16. The metallization structure of claim 15 , wherein long axes of the oblong-shaped or elliptical-shaped conductive pads extend to pass through the center of the die bonding area.
17. The metallization structure of claim 15 , wherein the UBMs comprises circle-shaped UBMs, A1 is a diameter of circle-shaped UBMs, B1 is a length of the oblong-shaped or elliptical-shaped conductive pads in short axis, B2 is a length of the oblong-shaped or elliptical-shaped conductive pads in long axis, C is a diameter of conductive vias, and A1, B1, B2 and C satisfy the following inequality (1):
B 2> A 1≥ B 1> C (1).
18. The metallization structure of claim 17 , wherein A1 and C satisfy the following inequality (2):
6.4 ≥A 1 /C≥ 1.5 (2).
19. The metallization structure of claim 17 , wherein A1, B1, and B2 satisfy the following inequalities (3)˜(5):
1≥ B 1/ A 1≥0.6 (3);
3≥ B 2/ A 1>1 (4); and
3 ≥B 2 /B 1>1 (5).
20. The metallization structure of claim 15 , wherein the UBMs comprise octagon-shaped UBMs, A2 is a distance between a pair of opposite sides of the octagon-shaped UBMs, B1 is a length of the oblong-shaped or elliptical-shaped conductive pads in short axis, B2 is a length of the oblong-shaped or elliptical-shaped conductive pads in long axis, C is a diameter of conductive vias, and A2, B1, B2 and C satisfy the following inequality (1):
B 2> A 1≥ B 1> C (1).