System and method for detecting a defect in a specimen
The present disclosure generally relates to a system and a method for detecting a defect in a specimen. More particularly, the present disclosure relates to a lithography exposure system and a method for detecting a dispensing error in a wafer The present disclosure provides a system for detecting a defect in a specimen having a lithography exposure tool including a measurement unit and a stage, the measurement unit is configured to obtain topography data of the specimen placed on the stage by illumination of a surface of the specimen with an optical signal, and a processor configured to generate a statistical data from the topography data and produce a defect notification if the statistical data is outside of a control limit.
1. A system for detecting a defect in a specimen comprising:
a lithography exposure tool including a measurement unit, the measurement unit is configured to obtain topography data of the specimen by illumination of a surface of the specimen with an optical signal; and
a processor configured to generate a statistical data from the topography data and produce a defect notification if the statistical data is outside of a control limit, wherein the generation of the statistical data from the topography data comprises a subtraction of the topography data of the specimen from a reference topography data to obtain a residual data, and a processing of the residual data using a high-pass filter to obtain a filtered data.
2. The system of claim 1 , wherein the topography data includes leveling data of the specimen.
3. The system of claim 1 , wherein the statistical data is a root mean square error.
4. The system of claim 1 , wherein the defect is a photoresist dispensing error.
5. The system of claim 4 , wherein the specimen includes a substrate and a photoresist layer dispensed on the substrate.
6. The system of claim 5 , further comprising a dispensing system adapted to dispense the photoresist layer on the substrate.
7. The system of claim 6 , further comprising a storage medium coupled to the measurement unit and the processor, the storage medium is configured to store the topography data of the specimen.
8. The system of claim 7 , wherein the storage medium is also configured to store a reference topography data.
9. The system of claim 8 , wherein the reference topography data is a statistical mean from topography data of a plurality of reference specimens.
10. The system of claim 8 , wherein the reference topography data is a topography data of a single reference specimen.
11. The system of claim 7 , wherein the measurement unit includes an illumination system configured to direct an optical signal towards the surface of the specimen and a detection system configured to detect an optical signal propagating from the surface of the specimen.
12. A system for detecting a photoresist dispensing error comprising:
a dispensing system adapted to dispense a photoresist layer on a substrate;
a lithography exposure tool including a measurement unit, the measurement unit is configured to obtain topography data of the photoresist layer by illumination of a surface of the photoresist layer with an optical signal; and
a processor configured to generate a statistical data from the topography data and produce the photoresist dispensing error notification if the statistical data is outside of a control limit, wherein the generation of the statistical data from the topography data comprises a subtraction of the topography data of the specimen from a reference topography data to obtain a residual data, and a processing of the residual data using a high-pass filter to obtain a filtered data.
13. A method for detecting a defect in a specimen, the method comprising:
obtaining topography data of the specimen by illuminating of a surface of the specimen with an optical signal;
generating a statistical data from the topography data, wherein the generating of the statistical data from the topography data comprises subtracting the topography data of the specimen from a reference topography data to obtain a residual data, and processing the residual data using a high-pass filter to obtain a filtered data; and
producing a defect notification if the statistical data is outside of a control limit.
14. The method of claim 13 , wherein the processing of the residual data using the high-pass filter comprises:
blurring the residual data to obtain a blurred data; and
subtracting the blurred data from the residual data to obtain the filtered data.
15. The method of claim 13 , wherein the generating of the statistical data from the topography data further comprises performing a statistical analysis on the filtered data to obtain the statistical data.
16. The method of claim 13 , wherein the topography data includes leveling data of the specimen.
17. The method of claim 13 , wherein the reference topography data is a statistical mean obtained from topography data of a plurality of reference specimen.
18. The method of claim 13 , wherein the reference topography data is a topography data of a single reference specimen.