IP Library › Granted Patent US 12,255,069
Granted Patent B2
US 12,255,069 · App. 17/175,274 · Granted Mar 18, 2025

Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

Inventors: Yukitomo Hirochi (Toyama, JP); Takashi Nogami (Toyama, JP); Norichika Yamagishi (Toyama, JP); Yoshihiko Yanagisawa (Toyama, JP)
Assignee: Kokusai Electric Corporation
H01L21/268H01L21/67115H01L21/67253H05B6/68
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Quick Facts
Patent No.
US 12,255,069
App. No.
17/175,274
Granted
Mar 18, 2025
Kind
B2
Abstract

According to one aspect of the technique, there is provided a substrate processing apparatus including: a process housing including a process chamber in which a substrate is processed; a transfer housing provided adjacent to the process housing and having a transfer chamber wherein the substrate is transferred between the process chamber and the transfer chamber; a microwave generator configured to transmit a microwave to be supplied into the process chamber; a loading/unloading port connecting between the process chamber and the transfer chamber and through which the substrate is transferred; an opening/closing structure configured to open or close the loading/unloading port; and a detection sensor provided in the transfer chamber adjacent to the loading/unloading port and configured to detect the microwave leaking to the transfer chamber from the process chamber through the loading/unloading port while the opening/closing structure maintains the loading/unloading port closed.

Claims (39)

1. A substrate processing apparatus comprising:

a process housing comprising a process chamber in which a substrate is processed;

a transfer housing provided adjacent to the process housing and comprising a transfer chamber wherein the substrate is transferred between the process chamber and the transfer chamber;

a microwave generator configured to transmit a microwave to be supplied into the process chamber;

a loading/unloading port connecting between the process chamber and the transfer chamber and through which the substrate is transferred;

an opening/closing structure configured to open or close the loading/unloading port;

a plurality of detection sensors provided in the transfer chamber adjacent to the loading/unloading port and configured to detect the microwave leaking to the transfer chamber from the process chamber through the loading/unloading port while the opening/closing structure maintains the loading/unloading port closed; and

a controller configured to control the microwave generator to stop a transmission of the microwave when each time duration of the microwave being detected by two or more detection sensors among the plurality of detection sensors has reached a threshold time.

2. The substrate processing apparatus of claim 1 , wherein the plurality of detection sensors are provided on an inner wall of the transfer housing, wherein the loading/unloading port is provided on the inner wall.

3. The substrate processing apparatus of claim 1 , wherein the controller is further configured to control the microwave generator to stop a transmission of the microwave when a time duration of the microwave being detected by one of the detection sensors has reached a threshold time.

4. The substrate processing apparatus of claim 1 , wherein the microwave generator is arranged so as to face the loading/unloading port with the process chamber interposed therebetween.

5. The substrate processing apparatus of claim 1 , wherein a distance between one of the detection sensors and the loading/unloading port is equal to or less than half an opening width of the loading/unloading port.

6. The substrate processing apparatus of claim 1 , wherein the process chamber comprises a first process chamber and a second process chamber, and

wherein the detection sensors comprise:

a first detection sensor arranged at a position beyond reach of the microwave leaking from the second process chamber and configured to detect the microwave leaking from the first process chamber to the transfer chamber; and

a second detection sensor arranged at a position beyond reach of the microwave leaking from the first process chamber and configured to detect the microwave leaking from the second process chamber to the transfer chamber.

7. The substrate processing apparatus of claim 6 , wherein a plurality of detection sensors comprising the first detection sensor are arranged at positions beyond reach of the microwave leaking from the second process chamber and a plurality of detection sensors comprising the second detection sensor are arranged at positions beyond reach of the microwave leaking from the first process chamber.

8. A method of manufacturing a semiconductor device, comprising:

(a) loading a substrate into a process chamber of a substrate processing apparatus, wherein the substrate processing apparatus comprises:

a process housing comprising the process chamber in which the substrate is processed;

a transfer housing provided adjacent to the process housing and comprising a transfer chamber wherein the substrate is transferred between the process chamber and the transfer chamber;

a microwave generator configured to transmit a microwave to be supplied into the process chamber;

a loading/unloading port connecting between the process chamber and the transfer chamber and through which the substrate is transferred;

an opening/closing structure configured to open or close the loading/unloading port;

a plurality of detection sensors provided in the transfer chamber adjacent to the loading/unloading port and configured to detect the microwave leaking to the transfer chamber from the process chamber through the loading/unloading port while the opening/closing structure maintains the loading/unloading port closed; and

a controller configured to control the microwave generator to stop a transmission of the microwave when each time duration of the microwave being detected by two or more detection sensors among the plurality of detection sensors has reached a threshold time;

(b) processing the substrate by the microwave transmitted by the microwave generator; and

(c) detects the microwave leaking into the transfer chamber by the detection sensors.

9. A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform:

(a) loading a substrate into a process chamber of the substrate processing apparatus, wherein the substrate processing apparatus comprises:

a process housing comprising the process chamber in which the substrate is processed;

a transfer housing provided adjacent to the process housing and comprising a transfer chamber wherein the substrate is transferred between the process chamber and the transfer chamber;

a microwave generator configured to transmit a microwave to be supplied into the process chamber;

a loading/unloading port connecting between the process chamber and the transfer chamber and through which the substrate is transferred;

an opening/closing structure configured to open or close the loading/unloading port;

a plurality of detection sensors provided in the transfer chamber adjacent to the loading/unloading port and configured to detect the microwave leaking to the transfer chamber from the process chamber through the loading/unloading port while the opening/closing structure maintains the loading/unloading port closed; and

a controller configured to control the microwave generator to stop a transmission of the microwave when each time duration of the microwave being detected by two or more detection sensors among the plurality of detection sensors has reached a threshold time;

(b) processing the substrate by the microwave transmitted by the microwave generator; and

(c) detects the microwave leaking into the transfer chamber by the detection sensors.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2021
From: HIROCHI, YUKITOMO; NOGAMI, TAKASHI; YAMAGISHI, NORICHIKA; YANAGISAWA, YOSHIHIKO
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 055386/0913 →
Continuity (2)
Continuation PCTJP2018031197 · Aug 23, 2018
Related Publication 20210166945A1 · Jun 3, 2021
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