Granted Patent B2

US 12,269,950 · App. 18/530,510 · Granted Apr 8, 2025

Inventors: Keith Bruce (Midland, MI); Igor Chorvath (Midland, MI); Marc-Andre Courtemanche (Midland, MI); Jon V. Degroot, Jr. (Midland, MI); Sean Gaal (Midland, MI); Craig Gross (Midland, MI); James Keenihan (Midland, MI); Shawn Mealey (Midland, MI); Scott Miller (Midland, MI); Tom Parsons (Lake Jackson, TX); Andrew Schlader (Lake Jackson, TX); Cristina Serrat (Lake Jackson, TX); Lauren Tonge (Midland, MI)

Assignees: DOW SILICONES CORPORATION; DOW GLOBAL TECHNOLOGIES LLC

C08L83/04B29C48/022C08K3/26C08K3/34C08L27/06B29C48/88B29K2027/06B29K2083/00B29K2401/08C08K2003/265C08K5/005C08K5/0058C08K5/0066

Abstract

Claims (38)

1. A solid carrier component, comprising:

5 to 30 wt. % of (C) an organopolysiloxane having at least one silicon-bonded hydroxyl group and a viscosity of from 1,000 to 60,000 mPa·s at 25° C.;

0 to 90 wt. % of (B) a polymer selected from polyolefins, polyamides, polyesters, or combinations thereof;

>0 to 95 wt. % of (D) a compatibilizer comprising a functionalized polymer; and

0 to 75 wt. % of (A) a filler selected from a lignocellulosic filler, a mineral filler, a glass filler, a carbon filler, and combinations thereof;

and wherein the compatibilizer (D) comprises silane grafted polyethylene, maleic anhydride grafted polyethylene, and/or maleic anhydride grafted polypropylene.

2. The solid carrier component of claim 1 , being a solid at 25° C. and 1 atmosphere of pressure.

3. The solid carrier component of claim 1 , wherein the (B) polymer is present.

4. The solid carrier component of claim 1 , wherein the (C) organopolysiloxane has a viscosity of from 4,000 to 50,000 mPa·s at 25° C.

5. The solid carrier component of claim 1 , wherein the (C) organopolysiloxane has the following average unit formula:

[R 1 3-n (OH) n SiO 1/2 ] a′ [R 1 2-m (OH) m SiO 2/2 ] b′ [R 1 SiO 3/2 ] c′ [SiO 4/2 ] d′ ;

wherein each R 1 is an independently selected hydrocarbyl group; n is 0, 1, 2, or 3, m is 0, 1 or 2, with the proviso that n and m are not simultaneously 0; 0<a′<1; 0<b′<1; 0≤c′≤0.1; and 0≤d′≤0.1, with the proviso that a′+b′+c′+d′=1.

6. The solid carrier component of claim 1 , wherein the (C) organopolysiloxane has the following average unit formula (I) or (II):

[R 1 3-n (OH) n SiO 1/2 ] a″ [R 1 2-m (OH) m SiO 2/2 ] b″   (I)

wherein each R 1 is an independently selected hydrocarbyl group; n is 0, 1, 2, or 3, m is 0, 1 or 2, with the proviso that n and m are not simultaneously 0; 0<a″<1; 0<b″<1; with the proviso that a″+b″=1; or

R 1 3-x (OH) x SiO[SiR 1 2 O] c″ Si(OH) y R 1 3-y   (II)

wherein each R 1 is an independently selected hydrocarbyl group; x is 0, 1, 2, or 3, y is 0, 1, 2, or 3, with the proviso that x and y are not simultaneously 0; and c″ is from 60 to 1,200.

7. The solid carrier component of claim 1 , wherein the (C) organopolysiloxane is present in an amount of from 5 to 30 wt. % based on the total weight of the solid carrier component.

8. The solid carrier component of claim 1 , wherein component (D) is present in an amount of up to 80 wt. % based on the total weight of the solid carrier component.

9. The solid carrier component of claim 1 , wherein component (B) is present in an amount of from 5 to 90 wt. % based on the total weight of the solid carrier component.

10. The solid carrier component of claim 1 , wherein the solid carrier component comprises the (B) polymer in an amount of from 50 to 90 wt. %.

11. The solid carrier component of claim 10 , wherein the solid carrier component further comprises the (D) compatibilizer in an amount of from 5 to 30 wt. %.

12. A method of preparing the solid carrier component of claim 1 , said method comprising mixing component (D) with component (C), optionally along with component (A), and optionally along with component (B), to give the solid carrier component.

13. The method of claim 12 , wherein component (B) is present and the solid carrier component is formed while heating component (B).

14. The method of claim 12 carried out in an extruder.

15. A composition, comprising:

the solid carrier component of claim 1 ; and

one or more additives selected from (D) a compatibilizer, (E) a colorant, (F) a blowing agent, (G) a UV stabilizer, (H) an antioxidant, (I) a process aid, (J) a preservative, (K) a biocide, (L) a flame retardant, and (M) an impact modifier.

16. A solid carrier component, comprising:

5 to 30 wt. % of (C) an organopolysiloxane having at least one silicon-bonded hydroxyl group and a viscosity of from 1,000 to 60,000 mPa·s at 25° C.;

50 to 90 wt. % of (B) a polymer selected from polyolefins, polyamides, polyesters, or combinations thereof;

5 to 30 wt. % of (D) a compatibilizer comprising a functionalized polymer; and

0 to 75 wt. % of (A) a filler selected from a lignocellulosic filler, a mineral filler, a glass filler, a carbon filler, and combinations thereof.

17. A solid carrier component, comprising:

5 to 20 wt. % of (C) an organopolysiloxane having at least one silicon-bonded hydroxyl group and a viscosity of from 1,000 to 60,000 mPa·s at 25° C.;

5 to 60 wt. % of (B) a polymer selected from polyolefins, polyamides, polyesters, or combinations thereof;

0 to 90 wt. % of (D) a compatibilizer comprising a functionalized polymer; and

0 to 75 wt. % of (A) a filler selected from a lignocellulosic filler, a mineral filler, a glass filler, a carbon filler, and combinations thereof.

Assignments (2)

Continuity (5)

References Cited (160)