Substrate supporting plate, thin film deposition apparatus including the same, and thin film deposition method
A substrate supporting plate that may prevent deposition on a rear surface of a substrate and may easily unload the substrate. The substrate supporting plate may include a substrate mounting portion and a peripheral portion surrounding the substrate mounting portion. An edge portion of a top surface of the substrate mounting portion may be anodized. A central portion of the top surface of the substrate mounting portion may not be anodized.
1. A method comprising:
mounting a target substrate to be processed on a mounting portion of a substrate supporting plate, the substrate supporting plate comprising a top surface, the top surface comprising a non-anodized central portion and an anodized edge portion about the non-anodized central portion, wherein the anodized edge portion is configured to overlap at least a portion of the target substrate when the target substrate is placed on the substrate supporting plate;
attaching the target substrate to the substrate supporting plate using charges accumulated on the target substrate while processing the target substrate; and
unloading the target substrate.
2. The method of claim 1 , wherein the processing the target substrate comprises a deposition process.
3. The method of claim 2 , wherein the deposition process comprises a plasma-enhanced deposition process.
4. The method of claim 2 , wherein the deposition process comprises a plasma-enhanced atomic layer deposition process.
5. The method of claim 1 , comprising:
supplying a first gas;
removing the first gas by supplying a purge gas;
supplying a second gas; and
removing the second gas by supplying the purge gas.
6. The method of claim 5 , comprising a step of forming a plasma during the step of supplying the second gas.
7. The method of claim 5 , wherein one or more of the first gas or the second gas comprises a reactive gas.
8. The method of claim 5 , wherein the steps of removing the first gas and supplying the second gas are performed at a same time.
9. The method of claim 5 , wherein the steps of removing the first gas and supplying the second gas are repeated a number of times.
10. The method of claim 1 , wherein the non-anodized central portion exposes a metallic surface configured to face the target substrate.
11. The method of claim 10 , wherein the metallic surface exists as the non-anodized central portion and an insulating layer is formed on the edge portion and is not formed on the central portion of the top surface to allow the target substrate to be detached after a process ends.
12. The method of claim 11 , wherein a thickness of the insulating layer is from about 10 μm to about 100 μm.
13. The method of claim 1 , wherein the supporting plate comprises a peripheral portion surrounding the mounting portion.
14. The method of claim 13 , wherein the supporting plate comprises an inclined surface between a surface of the mounting portion and a surface of the peripheral portion.
15. The method of claim 1 , wherein the non-anodized central portion and the edge together are sized to accommodate the target substrate such that an area of the non-anodized central portion is less than an area of the target substrate.
16. The method of claim 1 , further comprising moving a pin through the substrate supporting plate.
17. The method of claim 1 , further comprising injecting a gas by a gas channel and a gas injection device onto the target substrate on the substrate supporting plate, wherein at least a part of the injected gas is externally discharged through a gas flow control device.
18. The method of claim 1 , wherein the anodized edge portion comprises a thickness ranging from about 10 μm to about 100 μm.
19. The method of claim 1 , wherein the anodized edge portion comprises an aluminum oxide layer having a thickness of about 15 μm to about 45 μm.
20. A method for mitigating deposition on a rear surface of a substrate comprising the method of claim 1 .