Two-phase immersion-type heat dissipation structure having sheet-like heat dissipation fins
A two-phase immersion-type heat dissipation structure having high density heat dissipation fins is provided. The two-phase immersion-type heat dissipation structure having high density heat dissipation fins includes a heat dissipation substrate, a plurality of sheet-like heat dissipation fins, and a reinforcement structure. A bottom surface of the heat dissipation substrate is in contact with a heating element immersed in a two-phase coolant. The plurality of sheet-like heat dissipation fins are integrally formed on an upper surface of the heat dissipation substrate and arranged in high density. An angle between at least one of the sheet-like heat dissipation fins and the upper surface of the heat dissipation substrate is from 60° to 120°. At least one of the sheet-like heat dissipation fins has a length from 50 mm to 120 mm, a width from 0.1 mm to 0.35 mm, and a height from 2 mm to 8 mm.
1. A two-phase immersion-type heat dissipation structure having sheet-like heat dissipation fins, comprising:
a heat dissipation substrate, wherein a bottom surface of the heat dissipation substrate is in contact with a heating element immersed in a two-phase coolant;
a plurality of sheet-like heat dissipation fins, wherein a length of at least one of the plurality of sheet-like heat dissipation fins is from 50 mm to 120 mm, a width of at least one of the plurality of sheet-like heat dissipation fins is from 0.1 mm to 0.35 mm, and a height of at least one of the plurality of sheet-like heat dissipation fins is from 2 mm to 8 mm; and
a reinforcement structure being bonded to the heat dissipation substrate, so that a portion of the reinforcement structure protrudes from an upper surface of the heat dissipation substrate by between 2 mm and 20 mm;
wherein at least two adjacent ones of the plurality of sheet-like heat dissipation fins that are in parallel arrangement are spaced apart from each other by a distance that is from 0.05 mm to 0.5 mm;
wherein the plurality of sheet-like heat dissipation fins are integrally formed on the upper surface of the heat dissipation substrate, wherein an angle between at least one of the plurality of sheet-like heat dissipation fins and the upper surface of the heat dissipation substrate is from 60 degrees to 120 degrees;
wherein a material of the reinforcement structure is different from a material of the heat dissipation substrate;
wherein a Young's modulus of the reinforcement structure is greater than a Young's modulus of the heat dissipation substrate;
wherein the reinforcement structure is a reinforcement outer frame, an outer periphery of the heat dissipation substrate has an outer protruding portion protruding therefrom, and the outer protruding portion is embedded into an inner periphery of the reinforcement outer frame.
2. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the length of at least one of the plurality of sheet-like heat dissipation fins is from 50 mm to 80 mm, the width of at least one of the plurality of sheet-like heat dissipation fins is from 0.1 mm to 0.3 mm, and the height of at least one of the plurality of sheet-like heat dissipation fins is from 3 mm to 6 mm, wherein at least two adjacent ones of the plurality of sheet-like heat dissipation fins that are in parallel arrangement are spaced apart from each other by the distance that is from 0.1 mm to 0.3 mm.
3. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the heat dissipation substrate is made of copper, copper alloy, or aluminum alloy.
4. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the reinforcement structure is bonded to the heat dissipation substrate by soldering, friction stir welding, gluing, diffusion bonding, or press-bonding.
5. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the reinforcement structure is made of aluminum alloy or stainless steel.
6. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein a surface of the reinforcement structure for being bonded with the heat dissipation substrate has a plating layer formed thereon for facilitating a soldering process.
7. The two-phase immersion-type heat dissipation structure according to claim 6 , wherein the plating layer is an electroless nickel plating layer.
8. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the reinforcement outer frame has two reinforcement side walls that are oppositely disposed, and at least one of the reinforcement side walls has at least one through hole that horizontally penetrates the reinforcement side wall.
9. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the reinforcement structure is a reinforcement inner frame and is bonded to the upper surface of the heat dissipation substrate, wherein at least a portion of the plurality of sheet-like heat dissipation fins are located in an opening formed by an inner periphery of the reinforcement inner frame, and another portion of the plurality of sheet-like heat dissipation fins are surroundingly arranged along an outer periphery of the reinforcement inner frame.