Antimicrobial solid surfaces and treatments and processes for preparing the same
View Patent ↗Provided is an antimicrobial non-isotactic polymer based hard or semi-flexible surface in a thermoset and/or thermoplastic resin matrix wherein the active antimicrobial ingredient is copper oxide. Processes for preparing the same and applications thereof are also described.
1. A continuous pour process for the manufacture of a composite structural solid material comprising a thermoset resin and copper oxide particles substantially uniformly dispersed therein the process comprising the steps of:
mixing a filler with copper oxide until well blended to form a filler-copper oxide blend with a ratio of filler to copper oxide in a range of 20:1 to 1:2, wherein the filler comprises particles having a size range from about 12 to about 20 microns to maintain a substantially uniformly dispersed state of the filler-copper oxide blend throughout the continuous pour process;
stepwise, subsequently mixing said filler-copper oxide blend with a thermoset resin and optionally a pigment to form a copper oxide containing blended composition;
stepwise, subsequently mixing a catalyst with said copper oxide containing blended composition to form a polymerizable composite structural material;
distributing said polymerizable composite structural material in a mold; and
providing conditions for polymerization of said polymerizable composite structural material, thereby preparing a composite structural solid material wherein the copper oxide is present at a concentration ranging from 15% to 50% and wherein a portion of said copper oxide particles are surface exposed.
2. The process of claim 1 , wherein said catalyst is methyl ethyl ketone.
3. The process of claim 1 , wherein said thermoset resin comprises epoxy or polyester resins.
4. The process of claim 1 , wherein said filler material makes up to between 10 and 30% by weight of the total composition.
5. The process of claim 1 , wherein said copper oxide particles have a size ranging from about 5 to about 20 microns.
6. The process of claim 1 , wherein said copper oxide particles have a size ranging from about 5 to about 10 microns.
7. The process of claim 1 , further comprising the step of preparing a finished product incorporating said composite structural solid material.
8. The process of claim 1 , further comprising the step of casting said polymeric resin mixture containing copper oxide powder and catalyst into a sheet.
9. The process of claim 1 , further comprising the step of casting said polymeric resin mixture containing copper oxide powder and catalyst using a compression molding process.
10. The process of claim 1 , further comprising the step of casting said polymeric resin mixture containing copper oxide powder and catalyst using an extrusion process.
11. The process of claim 1 , further comprising the step of casting said polymeric resin mixture containing copper oxide powder and catalyst using an injection molding process.