Semiconductor device
A semiconductor device includes a fin type pattern extending in a first direction on a substrate, a first gate electrode extending in a second direction intersecting the first direction on the fin type pattern, a source/drain region on a side wall of the first gate electrode and in the fin type pattern, a separation structure extending in the first direction on the substrate, the separation structure including a first trench and being spaced apart from the fin type pattern and separating the first gate electrode, an interlayer insulating layer on a side wall of the separation structure and covering the source/drain region, the interlayer insulating layer including a second trench having a lower surface lower than a lower surface of the first trench, and a contact connected to the source/drain region and filling the first trench and the second trench.
1. A semiconductor device, comprising:
a first fin type pattern extending in a first direction on a substrate;
a second fin type pattern extending in the first direction on the substrate, the first fin type pattern and the second fin type pattern being spaced apart from each other along a second direction intersecting with the first direction;
a first gate electrode extending in the second direction on the first fin type pattern;
a second gate electrode extending in the second direction on the second fin type pattern, the first gate electrode and the second gate electrode being arranged along the second direction;
a third gate electrode extending in the second direction on the first fin type pattern, the first gate electrode and the third gate electrode being spaced apart from each other along the first direction;
a fourth gate electrode extending in the second direction on the second fin type pattern, the third gate electrode and the fourth gate electrode being arranged along the second direction;
a first source/drain region on the first fin type pattern between the first gate electrode and the third gate electrode;
a second source/drain region on the second fin type pattern between the second gate electrode and the fourth gate electrode;
a separation structure extending in the first direction between the first fin type pattern and the second fin type pattern, the first gate electrode and the second gate electrode are separated by the separation structure, and the third gate electrode and the fourth gate electrode are separated by the separation structure; and
a contact extending in the second direction on the separation structure, the contact connecting the first source/drain region and the second source/drain region.
2. The semiconductor device as claimed in claim 1 , wherein the contact includes a first part on the first source/drain region, a second part on the second source/drain region, and a third part on the separation structure, and
wherein a lower surface of the third part is different from a lower surface of the first part and a lower surface of the second part.
3. The semiconductor device as claimed in claim 1 , further comprising a field insulating layer on the substrate between the first fin type pattern and the second fin type pattern,
wherein a lower surface the separation structure is lower than an upper surface of the field insulating layer.
4. The semiconductor device as claimed in claim 1 , wherein a lower surface of the separation structure is lower than an upper surface of the substrate.
5. The semiconductor device as claimed in claim 1 , further comprising:
a first gate dielectric layer interposed between the first fin type pattern and the first gate electrode; and
a second gate dielectric layer interposed between the second fin type pattern and the second gate electrode,
wherein the separation structure is in contact with the first gate electrode, the second gate electrode, the first gate dielectric layer and the second gate dielectric layer.
6. The semiconductor device as claimed in claim 5 , wherein the first gate dielectric layer and the second gate dielectric layer do not extend along side walls of the separation structure.
7. The semiconductor device as claimed in claim 1 , wherein the separation structure includes a first separation part separating the first gate electrode and the second gate electrode, a second separation part separating the third gate electrode and the fourth gate electrode, and a connection part overlapping the contact, and
wherein an upper surface of the connection part is lower than an upper surface of the first separation part and an upper surface of the second separation part.
8. The semiconductor device as claimed in claim 1 , wherein the separation structure includes silicon nitride.
9. The semiconductor device as claimed in claim 1 , further comprising:
a first capping pattern extending in the second direction on an upper surface of the first gate electrode; and
a second capping pattern extending in the second direction on an upper surface of the second gate electrode,
wherein the first capping pattern and the second capping pattern are separated by the separation structure.
10. A semiconductor device, comprising:
a first fin type pattern extending in a first direction on a substrate;
a second fin type pattern extending in the first direction on the substrate, the first fin type pattern and the second fin type pattern being spaced apart from each other along a second direction intersecting with the first direction;
a first gate electrode extending in the second direction on the first fin type pattern;
a second gate electrode extending in the second direction on the second fin type pattern, the first gate electrode and the second gate electrode being arranged along the second direction;
a third gate electrode extending in the second direction on the first fin type pattern, the first gate electrode and the third gate electrode being spaced apart from each other along the first direction;
a fourth gate electrode extending in the second direction on the second fin type pattern, the third gate electrode and the fourth gate electrode being arranged along the second direction;
a first source/drain region on the first fin type pattern between the first gate electrode and the third gate electrode;
a second source/drain region on the second fin type pattern between the second gate electrode and the fourth gate electrode;
a separation structure extending in the first direction between the first fin type pattern and the second fin type pattern, the first gate electrode and the second gate electrode are separated by the separation structure, and the third gate electrode and the fourth gate electrode are separated by the separation structure; and
a contact extending in the second direction to connect the first source/drain region and the second source/drain region,
wherein the contact includes a first part on the first source/drain region, a second part on the second source/drain region, and a third part on the separation structure, and
wherein a lower surface of the third part is different from a lower surface of the first part and a lower surface of the second part.
11. The semiconductor device as claimed in claim 10 , wherein the lower surface of the first part is in contact with the first source/drain region,
wherein the lower surface of the second part is in contact with the second source/drain region, and
wherein the lower surface of the third part is in contact with the separation structure.
12. The semiconductor device as claimed in claim 10 , further comprising a field insulating layer on the substrate between the first fin type pattern and the second fin type pattern,
wherein a lower surface the separation structure is lower than an upper surface of the field insulating layer.
13. The semiconductor device as claimed in claim 10 , wherein a lower surface of the separation structure is lower than an upper surface of the substrate.
14. The semiconductor device as claimed in claim 10 , further comprising:
a first gate dielectric layer interposed between the first fin type pattern and the first gate electrode; and
a second gate dielectric layer interposed between the second fin type pattern and the second gate electrode,
wherein the separation structure is in contact with the first gate electrode, the second gate electrode, the first gate dielectric layer and the second gate dielectric layer.
15. The semiconductor device as claimed in claim 14 , wherein the first gate dielectric layer and the second gate dielectric layer do not extend along side walls of the separation structure.
16. The semiconductor device as claimed in claim 10 , wherein the separation structure includes a first separation part separating the first gate electrode and the second gate electrode, a second separation part separating the third gate electrode and the fourth gate electrode, and a connection part overlapping the contact, and
wherein an upper surface of the connection part is lower than an upper surface of the first separation part and an upper surface of the second separation part.
17. The semiconductor device as claimed in claim 10 , wherein the separation structure includes silicon nitride.
18. The semiconductor device as claimed in claim 10 , further comprising:
a first capping pattern extending in the second direction on an upper surface of the first gate electrode; and
a second capping pattern extending in the second direction on an upper surface of the second gate electrode,
wherein the first capping pattern and the second capping pattern are separated by the separation structure.