Conformal and smooth titanium nitride layers and methods of forming the same
The disclosed technology generally relates to forming a thin film comprising titanium nitride (TiN), and more particularly to forming by a cyclical vapor deposition process the thin film comprising (TiN). In one aspect, a method of forming a thin film comprising titanium nitride (TiN) by a cyclical vapor deposition process comprises forming on a semiconductor substrate a TiN thin film by exposing the semiconductor substrate to one or more cyclical vapor deposition cycles each comprising an exposure to a Ti precursor at a Ti precursor flow rate and an exposure to a NH 3 precursor at a NH 3 precursor flow rate, after forming the TiN film, subjecting the semiconductor substrate, without further deposition of the TiN thin film, to a post-deposition exposure of NH 3 at a second NH 3 flow rate.
1. A method of depositing a thin film comprising titanium nitride (TiN) by cyclical vapor deposition, the method comprising:
forming on a semiconductor substrate a TiN thin film without aid of plasma by exposing the semiconductor substrate to one or more cyclical vapor deposition cycles each comprising an exposure to a Ti precursor and an exposure to ammonia (NH 3 ) at a first NH 3 flow rate, the Ti precursor being exposed to the semiconductor substrate in the absence of NH 3 ; and
after forming the TiN thin film, subjecting the semiconductor substrate, without deposition of an additional TiN thin film on the TiN thin film, to a post-deposition exposure to NH 3 at a second NH 3 flow rate,
wherein the second NH 3 flow rate is lower than the first NH 3 flow rate by at least a factor of two.
2. The method of claim 1 , wherein the method is carried out in a thin film deposition system wherein, relative to a reference TiN thin film deposited in a same thin film deposition system using a reference method that is the same as the method of claim 1 except for subjecting the semiconductor substrate to the post-deposition exposure to NH 3 , a number of particles on or embedded in the TiN thin film having a size greater than 0.1 μm is reduced by 50% or more.
3. The method of claim 1 , wherein forming the TiN thin film and subjecting the semiconductor substrate to the post-deposition exposure are performed at a same semiconductor substrate temperature.
4. The method of claim 1 , wherein the first NH 3 flow rate is 1000-3000 sccm, and the second NH 3 flow rate is 200-1000 sccm.
5. The method of claim 1 , wherein a ratio of the first NH 3 flow rate to a Ti precursor flow rate is 3 to 100.
6. The method of claim 1 , wherein the exposure to the Ti precursor is performed at a Ti precursor flow rate of 100 sccm-5000 sccm that is lower than the first NH 3 flow rate.
7. The method of claim 1 , wherein a duration of each of the one or more cyclical vapor deposition cycles is less than 2.0 sec.
8. The method of claim 1 , wherein a flow rate ratio of the first NH 3 flow rate to a Ti precursor flow rate exceeds 3.
9. The method of claim 8 , wherein the exposure to NH 3 in each of the one or more cyclical vapor deposition cycles is performed for a duration of 0.1 to 0.6 sec.
10. A method of depositing a thin film comprising titanium nitride (TiN) by cyclical vapor deposition, the method comprising:
forming on a semiconductor substrate a TiN thin film without aid of plasma by exposing the semiconductor substrate to one or more cyclical vapor deposition cycles each comprising an exposure to a Ti precursor and an exposure to ammonia (NH 3 ) for a first NH 3 exposure duration, the Ti precursor being exposed to the semiconductor substrate in the absence of NH 3 ; and
after forming the TiN thin film, subjecting the semiconductor substrate, without deposition of an additional TiN thin film on the TiN thin film, to a post-deposition exposure to NH 3 for a second NH 3 exposure duration,
wherein the second NH 3 exposure duration is greater than the first NH 3 exposure duration by at least a factor of five.
11. The method of claim 10 , wherein the method is carried out in a thin film deposition system wherein, relative to a reference TiN thin film deposited in a same thin film deposition system using reference a method that is the same as the method of claim 10 except for subjecting the semiconductor substrate to the post-deposition exposure to NH 3 , a number of particles on or embedded in the TiN thin film having a size greater than 0.1 μm is reduced by 50% or more.
12. The method of claim 10 , wherein forming the TiN thin film and subjecting the TiN thin film to the post-deposition exposure are performed at a same semiconductor substrate temperature.
13. The method of claim 10 , wherein the first NH 3 exposure duration is 0.1-0.6 sec., and the second NH 3 exposure duration exceeds 1 sec.
14. The method of claim 10 , wherein a flow rate ratio in each of the one or more cyclical vapor deposition cycles of a first NH 3 flow rate to a Ti precursor flow rate exceeds 3.
15. The method of claim 14 , wherein the exposure to NH 3 in each of the one or more cyclical vapor deposition cycles is performed for a duration of 0.1 to 0.6 sec.
16. A method of depositing a thin film comprising titanium nitride (TiN) by cyclical vapor deposition process, the method comprising:
subjecting a thin film deposition chamber without a substrate disposed therein to a pre-deposition chamber purge with ammonia (NH 3 ) at a first NH 3 purge flow rate;
transferring a semiconductor substrate into the thin film deposition chamber; and
forming on the semiconductor substrate a TiN thin film without aid of plasma by exposing the semiconductor substrate to one or more cyclical vapor deposition cycles each comprising an exposure to a Ti precursor and an exposure to NH 3 , the Ti precursor being exposed to the semiconductor substrate in the absence of NH 3 .
17. The method of claim 16 , wherein the method is carried out in a thin film deposition system, wherein, relative to a reference TiN thin film deposited in a same thin film deposition system using reference method that is the same as the method of claim 16 except for subjecting the thin film deposition chamber to the pre-deposition chamber purge, a number of particles on or embedded in the TiN thin film having a size greater than about 0.1 μm is reduced by 50% or more.
18. The method of claim 16 , wherein the first NH 3 purge flow rate exceeds 200 sccm.
19. The method of claim 16 , wherein the pre-deposition chamber purge is performed for a duration exceeding 1 sec.
20. The method of claim 16 , wherein the method is carried out in a process station of a thin film deposition system, wherein the thin film deposition system comprises a plurality of process stations each configured to carry out the method.
21. The method of claim 16 , wherein forming the TiN thin film comprises exposing the semiconductor substrate to NH 3 at a second NH 3 flow rate of 500-10,000 sccm.
22. The method of claim 16 , wherein the one or more cyclical vapor deposition cycles comprises the exposure to the Ti precursor at a Ti precursor flow rate and the exposure to ammonia (NH 3 ) at a second NH 3 flow rate such that a flow rate ratio of the second NH 3 flow rate to the Ti precursor flow rate is 3 to 100.
23. The method of claim 22 , wherein forming the TiN thin film comprises exposing the semiconductor substrate to the Ti precursor at the Ti precursor flow rate of 100 sccm-5000 sccm and lower than the second NH 3 flow rate.
24. The method of claim 16 , wherein a duration of each of the one or more cyclical vapor deposition cycles is less than 2.0 sec.