Substrate inspection apparatus, substrate inspection method, and recording medium

1. A substrate inspection apparatus configured to inspect a substrate having a target film formed on a surface thereof by using an image of the substrate, the substrate inspection apparatus comprising:

a holder configured to hold the substrate;

a first light source unit configured to emit visible light to the substrate held by the holder;

a second light source unit configured to emit ultraviolet light to the substrate held by the holder;

a first imaging sensor configured to perform capturing of a visible light image of the substrate by receiving reflected light from the substrate as a result of radiating the visible light;

a second imaging sensor configured to perform capturing of an ultraviolet light image of the substrate by receiving reflected light or scattered light from the substrate as a result of radiating the ultraviolet light; and

a controller configured to acquire the visible light image and the ultraviolet light image,

wherein the visible light image and the ultraviolet light image are images obtained by imaging a common region of the substrate, and

the controller controls the first imaging sensor and the second imaging sensor such that only the capturing of the visible light image is performed by the first imaging sensor when a film thickness of the target film formed on the surface of the substrate is equal to or larger than a first film thickness value.

2. The substrate inspection apparatus of claim 1 ,

wherein the visible light image and the ultraviolet light image are images obtained by imaging the common region of an entire surface of the substrate.

3. The substrate inspection apparatus of claim 1 ,

wherein the visible light image and the ultraviolet light image are images obtained by imaging the common region of a peripheral portion of the substrate.

4. A substrate inspection apparatus configured to inspect a substrate having a target film formed on a surface thereof by using an image of the substrate, the substrate inspection apparatus comprising:

a holder configured to hold the substrate;

a first light source unit configured to emit visible light to the substrate held by the holder;

a second light source unit configured to emit ultraviolet light to the substrate held by the holder;

a first imaging sensor configured to perform capturing of a visible light image of the substrate by receiving reflected light from the substrate as a result of radiating the visible light;

a second imaging sensor configured to perform capturing of an ultraviolet light image of the substrate by receiving reflected light or scattered light from the substrate as a result of radiating the ultraviolet light; and

a controller configured to acquire the visible light image and the ultraviolet light image,

wherein the visible light image and the ultraviolet light image are images obtained by imaging a common region of the substrate, and

the controller controls the first imaging sensor and the second imaging sensor such that only the capturing of the ultraviolet light image is performed by the second imaging sensor when a film thickness of the target film formed on the surface of the substrate is equal to or less than a second film thickness value.

5. The substrate inspection apparatus of claim 1 ,

A substrate inspection apparatus configured to inspect a substrate having a target film formed on a surface thereof by using an image of the substrate, the substrate inspection apparatus comprising:

a holder configured to hold the substrate;

a first light source unit configured to emit visible light to the substrate held by the holder;

a second light source unit configured to emit ultraviolet light to the substrate held by the holder;

a first imaging sensor configured to perform capturing of a visible light image of the substrate by receiving reflected light from the substrate as a result of radiating the visible light;

a second imaging sensor configured to perform capturing of an ultraviolet light image of the substrate by receiving reflected light or scattered light from the substrate as a result of radiating the ultraviolet light; and

a controller configured to acquire the visible light image and the ultraviolet light image,

wherein the visible light image and the ultraviolet light image are images obtained by imaging a common region of the substrate, and

the controller controls the first imaging sensor and the second imaging sensor such that both the capturing of the visible light image by the first imaging sensor and the capturing of the ultraviolet light image by the second imaging sensor are performed when a film thickness of the target film formed on the surface of the substrate falls between a third film thickness value and a fourth film thickness value.

6. The substrate inspection apparatus of claim 1 ,

wherein the controller determines, based on a formation sequence of the target film on the substrate, which one of the capturing of the visible light image by the first imaging sensor and the capturing of the ultraviolet light image by the second imaging sensor is to be performed, and controls the first imaging sensor and the second imaging sensor based on a determination result.

7. The substrate inspection apparatus of claim 1 ,

wherein the second imaging sensor is allowed to capture a bright field image and a dark field image as the ultraviolet light image, and

the controller acquires the bright field image and the dark field image as the ultraviolet light image from the second imaging sensor.