Optical semiconductor element mounting package and optical semiconductor device using the same
An optical semiconductor element mounting package as well as an optical semiconductor device using the package are provided. The package has a recessed part served as an optical semiconductor element mounting region. The package includes a resin molding and at least two lead electrodes. The resin molding is composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part. The lead electrodes are disposed opposite to and spaced apart from each other, and at least a portion of main faces of the lead electrodes forms a part of the bottom face of the recessed part. The main face of the lead electrode and a side face of the lead electrode are built up to an angle, the side face of the lead electrode is non-linear, and there is no gap at a joint face between the resin molding and the lead electrodes.
1. An optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package comprises:
at least two lead electrodes disposed opposite to and spaced apart from each other, wherein portions of main faces of the lead electrodes form a part of a bottom face of the recessed part, and each of the lead electrodes in its entirety is not bent;
a resin molding composed of a thermosetting light-reflecting resin composition, wherein the resin molding comprises a first portion and a second portion, the first portion is configured to be in contact with the main faces of the lead electrodes and on the periphery of the lead electrodes to form a side wall continuously surrounding the recessed part, and the second portion is filled up a space between the lead electrodes so as to form the rest part of the bottom face of the recessed part; and
wherein in each of the lead electrodes, the main face of the lead electrode and a side face of the lead electrode are built up to an angle, both opposite sides of the lead electrodes are non-straight, and a rear face of the lead electrode is not in contact with the resin molding;
wherein the thermosetting light-reflecting resin composition comprises a white pigment with hollow inorganic particles having a particle size ranges from 0.1 μm to 50 μm;
wherein length directions of the lead electrodes and a length direction of the second portion of the resin molding are parallel to each other;
wherein the lead electrodes and the second portion of the resin molding form a bottom surface of the package, and the bottom surface of the package is a flat surface.
2. The optical semiconductor element mounting package according to claim 1 , wherein the second portion of the resin molding forms a straight line across the bottom face of the recessed part.
3. The optical semiconductor element mounting package according to claim 2 , wherein one of the lead electrodes has a larger surface area as compared with rest of the lead electrodes.
4. The optical semiconductor element mounting package according to claim 1 , wherein an outer face of the resin molding and at least one of outer faces of the lead electrodes are planar at an outer face of the package.
5. The optical semiconductor element mounting package according to claim 1 , wherein each one of the lead electrodes includes a metal film on at least a portion of surfaces of the lead electrodes so as to form part of the bottom face of the recessed part.
6. The optical semiconductor element mounting package according to claim 5 , wherein a material of the metal film is silver, Nickel, aluminum, gold, palladium, or an alloy comprising any combination thereof.
7. An optical semiconductor device, comprising:
the optical semiconductor element mounting package according to claim 1 ;
an optical semiconductor element mounted on the bottom face of the recessed part of the package; and
a transparent sealing resin layer that covers the optical semiconductor element in the recessed part.
8. The optical semiconductor device according to claim 7 , wherein the transparent sealing resin layer includes at least a fluorescent material.
9. An optical semiconductor device, comprising:
at least a positive lead electrode and at least a negative lead electrode disposed opposite to and spaced apart from each other, each of the lead electrodes having a top surface and a bottom surface, wherein each of the lead electrodes in its entirety is not bent;
a resin molding composed of a thermosetting epoxy resin composition configured to be in contact with the top surfaces of the lead electrodes and on the periphery of the top surfaces of the lead electrodes to form a molded part continuously surrounding a recessed part and filled up a space between the lead electrodes;
an optical semiconductor element disposed on the top surfaces of the lead electrodes and in the recessed part; and
a sealing member located in the recessed part and covering the optical semiconductor element;
wherein at least a portion of one of the lead electrodes has a thinner thickness as compared with rest portions of the one of the lead electrodes;
wherein portions of the top surfaces of the lead electrodes form a part of a bottom surface of the recessed part, and a rear surface of each of the lead electrodes is not in contact with the resin molding;
wherein the resin molding comprises a first portion and a second portion, the first portion is configured to be in contact with the top surfaces of the lead electrodes and on the periphery of the lead electrodes to form a side wall continuously surrounding the recessed part, and the second portion is filled up the space between the lead electrodes to form the rest part of the bottom face of the recessed part;
wherein the thermosetting light-reflecting resin composition comprises a white pigment with hollow inorganic particles having a particle size ranges from 0.1 μm to 50 μm;
wherein length directions of the lead electrodes and a length direction of the second portion of the resin molding are parallel to each other;
wherein the lead electrodes and the second portion of the resin molding form a bottom surface of the optical semiconductor element mounting package, and the bottom surface of the optical semiconductor element mounting package is a flat surface;
wherein the optical semiconductor element includes:
a first electrode formed at a bottom part of the optical semiconductor element and electrically connected to one of the positive and negative lead electrodes; and
a second electrode formed at the bottom part of the optical semiconductor element and electrically connected to the other one of the positive and negative lead electrodes.
10. The optical semiconductor device according to claim 9 , wherein one of the lead electrodes has a larger surface area as compared with rest of the lead electrodes.
11. The optical semiconductor device according to claim 9 , wherein there is no gap at a joint face between the molded part and the lead electrodes.
12. The optical semiconductor device according to claim 9 , wherein the thermosetting light-reflecting resin composition includes an inorganic filler, and the inorganic filler is at least a type selected from the group consisting of silica, alumina, magnesium oxide, antimony oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, and barium carbonate.
13. The optical semiconductor device according to claim 9 , wherein in at least one of the lead electrodes, an angle between the side wall of the lead electrode and the top surface of the lead electrode is within 90 degrees.
14. The optical semiconductor device according to claim 9 , wherein a top view of the recessed part is round shaped.