Light-emitting device and manufacturing method thereof
This disclosure discloses a method of manufacturing a light-emitting device includes steps of providing a first substrate with a plurality of first light-emitting elements and adhesive units arranged thereon, providing a second substrate with a first group of second light-emitting elements and a second group of second light-emitting elements arranged thereon, and connecting the a second group of second light-emitting elements and the adhesive units. The first light-emitting elements and the first group of second light-emitting elements are partially or wholly overlapped with each other during connecting the second group of second light-emitting elements and the adhesive units.
1. A method of manufacturing a light-emitting device, comprising:
providing a first substrate comprising a first connecting pad, a second connecting pad, and a third connecting pad arranged between the first connecting pad and the second connecting pad without being interposed by any other connecting pad thereamong;
providing a second substrate, a first light-emitting element, a second light-emitting element, and a third light-emitting element arranged on the second substrate, and the third light-emitting element arranged between the first light-emitting element and the second light-emitting element; and
connecting the third light-emitting element to the third connecting pad;
wherein, the third connecting pad is separated from the first connecting pad by a first distance, the third connecting pad is separated from the second connecting pad by a second distance which is different from the first distance,
wherein, before the connecting step, the first substrate further comprises a fifth light-emitting element connected to the first connecting pad, and a sixth light-emitting element connected to the second connecting pad,
wherein, in the connecting step, the first light-emitting element is overlapped with the first connecting pad.
2. The method of claim 1 , wherein the step of providing the second substrate further comprises providing a fourth light-emitting element arranged on the second substrate and between the second light-emitting element and the third light-emitting element.
3. The method of claim 2 , wherein, in the connecting step, the fourth light-emitting element is not overlapped with any connecting pad.
4. The method of claim 2 , wherein, after the connecting step, the fourth light-emitting element remains on the second substrate.
5. The method of claim 1 , wherein the second distance is greater than a width of the second light-emitting element.
6. The method of claim 1 , wherein, in the connecting step, the first light-emitting element is overlapped with the fifth light-emitting element, and the sixth light-emitting element is overlapped with the second light-emitting element.
7. The method of claim 1 , wherein the fifth light-emitting element and the sixth light-emitting element are configured to emit two lights with two different wavelengths.
8. The method of claim 1 , wherein the third light-emitting element, the fifth light-emitting element, and the sixth light-emitting element are configured to emit three lights with three different wavelengths.
9. The method of claim 1 , wherein the step of providing the second substrate further comprises providing an intermediate layer between the third light-emitting element and the second substrate.
10. The method of claim 9 , wherein the intermediate layer is connected to the third light-emitting element.
11. The method of claim 9 , wherein, the step of connecting the third light-emitting element further comprises forming a first protrusion in the intermediate layer to push the third light-emitting element away from the second substrate.
12. The method of claim 11 , wherein the first protrusion is formed by applying laser to the intermediate layer.
13. The method of claim 11 , wherein the step of connecting the third light-emitting element further comprises forming a second protrusion in the intermediate layer, and the first protrusion and the second protrusion are configured to collectively push the third light-emitting element to the first substrate.
14. The method of claim 9 , wherein the intermediate layer comprises a bubble layer and an adhesive structure, and the bubble layer is arranged between the second substrate and the adhesive structure.
15. The method of claim 14 , wherein the step of connecting the third light-emitting element further comprises heating the bubble layer to form a first protrusion.
16. The method of claim 1 , wherein the step of providing the first substrate further comprises forming an adhesive unit on the third connecting pad.