Dimension measurement apparatus, semiconductor manufacturing apparatus, and semiconductor device manufacturing system
A dimension measurement apparatus that automatically corrects a deviation of a contour without operator determination. The dimension measurement apparatus includes: a model learning unit that obtains a learning cross-sectional image and learning labels attached to different regions of the learning cross-sectional image and generates a deep learning model for image region division using the learning cross-sectional image and the learning labels; a model estimation unit that applies the model to a newly input target image and labels each independent region; a contour correction unit that detects a contour of each region using the target image and the labels, sets a representative point on the contour of the region, moves each representative point according to a movement rule, and repeats movement of the representative point until contour correction is complete; and a dimension measurement unit that measures a dimension of a device cross-sectional structure using the corrected contour.
1. A dimension measurement apparatus for measuring a dimension of a measurement target of etching profile using a cross-sectional Scanning Electron Microscope (SEM) image, comprising:
a central processing unit configured to
repeat a movement of a contour of the measurement target until a predetermined requirement is satisfied based on a predetermined point on the contour, the predetermined requirement being a requirement for correcting a deviation of a contour estimated by using machine learning;
measure a cross-sectional dimension of the measurement target using the repeatedly moved contour; and
perform movement of the contour based on a selected movement rule, wherein
the movement rule causes a direction of the movement of the contour to be in a first direction when a brightness profile has a center of gravity pixel with a first brightness, and to be in a second direction different from the first direction when the brightness profile has the center of gravity pixel with a second brightness.
2. The dimension measurement apparatus according to claim 1 , wherein movement of the contour is performed after a contour is estimated by machine learning.
3. The dimension measurement apparatus according to claim 2 , wherein
the cross-sectional dimension of a measurement target of etching profile is measured by using a contour estimated by machine learning using the repeatedly moved contour as learning data.
4. The dimension measurement apparatus according to claim 1 , wherein
the cross-sectional dimension of a measurement target of etching profile is measured by using a contour estimated by machine learning using the repeatedly moved contour as learning data.
5. The dimension measurement apparatus according to claim 1 , wherein
a center of gravity of the contour is obtained using each predetermined point,
the movement rule is selected based on a brightness profile obtained based on a positional relationship between the predetermined point to be moved and the center of gravity, and a straight line passing through the predetermined point to be moved and the center of gravity, and
the movement rule is a criterion for moving the predetermined point.
6. The dimension measurement apparatus according to claim 5 , wherein
a movement direction of the predetermined point is determined by the selected movement rule.
7. The dimension measurement apparatus according to claim 6 , wherein
the brightness profile is obtained in advance and is most similar to the obtained brightness profile, and
the predetermined point is moved based on the movement rule corresponding to the brightness profile obtained in advance.
8. The dimension measurement apparatus according to claim 5 , wherein
a movement distance of the predetermined point is determined by the selected movement rule.
9. The dimension measurement apparatus according to claim 8 , wherein
the brightness profile is obtained in advance and is most similar to the obtained brightness profile, and
the predetermined point is moved based on the movement rule corresponding to the brightness profile obtained in advance.
10. The dimension measurement apparatus according to claim 1 , wherein
the contour is obtained from each region of the measurement target of etching profile after being divided.
11. The dimension measurement apparatus according to claim 1 , wherein
when there is a first region having a complicated shape of the measurement target of etching profile after the measurement target of etching profile is divided, the first region is divided into a second region having a plurality of simple shapes of the measurement target of etching profile.
12. The dimension measurement apparatus according to claim 11 , wherein
a contour of the first region is divided based on a position of the simple shape estimated by inputting an image of the measurement target of etching profile into a model generated by using a learning image and position information of the simple shape.
13. A semiconductor manufacturing apparatus that manufactures a semiconductor device, the semiconductor manufacturing apparatus comprising:
a dimension measurement apparatus configured to
measure a dimension of a measurement target of etching profile using an image;
repeat movement of a contour of the measurement target of etching profile until a predetermined requirement is satisfied based on a predetermined point on the contour, the predetermined requirement being a requirement for correcting a deviation of a contour estimated by using machine learning;
measure a dimension of the measurement target of etching profile using the repeatedly moved contour; and
perform a movement of the contour based on a selected movement rule, wherein
the movement rule causes a direction of the movement of the contour to be in a first direction when a brightness profile has a center of gravity pixel with a first brightness, and to be in a second direction different from the first direction when the brightness profile has the center of gravity pixel with a second brightness.
14. A semiconductor device manufacturing system, comprising:
processor that executes programmed instructions which, when executed by the processor, cause the processor to perform operations for dimension measurement processing of measuring a dimension of a measurement target of etching profile using a cross-sectional Scanning Electron Microscope (SEM) image, comprising:
a step of repeating movement of a contour of the measurement target of etching profile until a predetermined requirement is satisfied based on a predetermined point on the contour, the predetermined requirement being a requirement for correcting a deviation of a contour estimated by using machine learning; and
a step of measuring a dimension of the measurement target of etching profile using the repeatedly moved contour, wherein
the predetermined requirement is a requirement for correcting a deviation of a contour estimated by using machine learning; and
a step of performing a movement of the contour based on a selected movement rule, wherein
the movement rule causes a direction of the movement of the contour to be in a first direction when a brightness profile has a center of gravity pixel with a first brightness, and to be in a second direction different from the first direction when the brightness profile has the center of gravity pixel with a second brightness.