Vertical semiconductor device and method for fabricating the vertical semiconductor device
A vertical semiconductor device includes: a lower structure; a multi-layer stack structure including a source layer formed over the lower structure and gate electrodes formed over the source layer; a vertical structure penetrating the multi-layer stack structure and including a channel layer insulated from the source layer; a vertical source line spaced apart from the vertical structure to penetrate the multi-layer stack structure and contacting the source layer; and a horizontal source channel contact suitable for coupling the source layer and the channel layer and including a first conductive layer and a second conductive layer that include different dopants.
1. A vertical semiconductor device, comprising:
a lower stack including a source channel contact, wherein the source channel contact includes a first conductive layer and a second conductive layer;
an upper stack including a plurality of dielectric layers and a plurality of gate electrodes alternately stacked over the lower stack;
a channel layer penetrating the upper stack and extending in the lower stack, wherein the channel layer contact with the source channel contact; and
a barrier oxide formed on the first and second conductive layers of the source channel contact,
a vertical contact recess formed in the upper stack and extending to expose the barrier oxide; and
a sealing spacer formed on a side wall of the vertical contact recess and extending to cover the barrier oxide,
wherein the source channel contact includes a concave portion and a convex portion, the concave portion and the convex portion are directly contacted with the barrier oxide,
wherein the convex portion of the source channel contact has a peak, and the peak is provided by the second conductive layer, and
wherein the concave portion and the convex portion of the source channel contact are fully covered by the barrier oxide.
2. The vertical semiconductor device of claim 1 , wherein the first conductive layer is positioned between the channel layer and the second conductive layer, and the first conductive layer has a shape surrounding the second conductive layer.
3. The vertical semiconductor device of claim 1 , wherein the second conductive layer includes a material having a different wet etch rate than the first conductive layer.
4. The vertical semiconductor device of claim 1 , wherein the first conductive layer includes polysilicon containing a first dopant, and the second conductive layer includes polysilicon containing a second dopant, where the first dopant and the second dopant are different materials.
5. The vertical semiconductor device of claim 1 , wherein the second conductive layer includes carbon-doped polysilicon.
6. The vertical semiconductor device of claim 5 , wherein the first conductive layer includes phosphorus-doped polysilicon.
7. The vertical semiconductor device of claim 1 , wherein the second conductive layer has a thickness that is thinner than a thickness of the first conductive layer.
8. The vertical semiconductor device of claim 1 , wherein the barrier oxide includes silicon oxide.
9. The vertical semiconductor device of claim 1 , wherein the second conductive layer includes carbon-doped polysilicon, the first conductive layer includes phosphorus-doped polysilicon, and the barrier oxide includes silicon oxide.
10. The vertical semiconductor device of claim 1 , wherein the barrier oxide directly contacts the concave portion and the convex portion.
11. The vertical semiconductor device of claim 1 , wherein the second conductive layer includes a first end and a second end,
wherein the first end of the second conductive layer is laterally spaced from the channel layer by the first conductive layer, and
wherein the second end of the second conductive layer is fully covered by the barrier oxide.
12. The vertical semiconductor device of claim 1 , wherein the lower stack includes:
a lower source layer; and
an upper source layer over the lower source layer,
wherein the source channel contact is disposed between the lower source layer and the upper source layer.
13. The vertical semiconductor device of claim 1 , further comprising:
a vertical source line disposed in the vertical contact recess.
14. The vertical semiconductor device of claim 1 , further comprising:
a tunnel dielectric layer on the channel layer;
a charge storage layer on the tunnel dielectric layer; and
a blocking layer on the charge storage layer,
wherein the tunnel dielectric layer, the charge storage layer and the blocking layer are penetrating the upper stack and extending in the lower stack.