IP Library › Granted Patent US 12,331,164
Granted Patent B2
US 12,331,164 · App. 17/726,742 · Granted Jun 17, 2025

Curable siloxane resin composition

Inventors: Byeong-Soo Bae (Daejeon, KR); Seung-Mo Kang (Daejeon, KR)
Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
C08G77/20C08G77/18C08G77/80C08L83/04
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,331,164
App. No.
17/726,742
Granted
Jun 17, 2025
Kind
B2
Abstract

Provided is a curable siloxane composition with low dielectric constant and low dielectric loss, in which organic alkoxy silane having a silicon-based asymmetric structure and organic alkoxy silane having a silicon-based symmetric structure are included. The curable siloxane composition has low dielectric constant and dielectric loss in a high frequency range, low water absorption, excellent workability, and high copper foil peel strength, and thus physical properties suitable for application to printed circuit boards for high-frequency communication electronic devices may be provided.

Claims (60)

1. A siloxane resin composition, comprising

first organic alkoxy silane having a silicon-based structure represented by the following Chemical Formula 1,

R 1 a R 2 b Si(OR 3 ) 2   [Chemical Formula 1]

wherein, in the above Chemical Formula 1,

R 1 comprises a linear or branched C 2-20 alkenyl group,

R 2 comprises H, a linear or branched C 1-20 alkyl group, a C 6-20 aryl group, or a C 2-20 alkenyl group,

R 3 comprises a linear or branched C 1-7 alkyl group, and

1≤a≤2, 0≤b≤1, and a+b=2,

second organic alkoxy silane having a silicon-based symmetric structure represented by the following Chemical Formula 2,

R 4 2 Si(OR 5 ) 2   [Chemical Formula 2]

wherein, in the above Chemical Formula 2,

R 4 comprises a C 6-20 aryl group, and

R 5 comprises a linear or branched C 1-7 alkyl group,

a siloxane resin prepared with the first organic alkoxy silane and the second organic alkoxy silane represented by the following Chemical Formula 3,

(R 1 a R 2 b SiO) x (R 4 2 SiO) y   [Chemical Formula 3]

wherein, in the above Chemical Formula 3,

1≤x, 1≤y, and x≤y, and

a radical polymerization initiator.

2. The siloxane resin composition of claim 1 , wherein:

the first organic alkoxy silane comprises one or more of vinylmethyldimethoxysilane, vinylmethyldiethoxysilane, vinylphenyldimethoxysilane, vinylphenyldiethoxysilane, divinyldimethoxysilane, divinyldiethoxysilane, allyldimethoxysilane, allylmethyldimethoxysilane, allylmethyldiethoxysilane, or dimethoxymethyl (4-vinylphenyl)silane.

3. The siloxane resin composition of claim 1 , wherein:

the second organic alkoxy silane comprises one or more of diphenyldimethoxysilane, diphenyldiethoxysilane, bis(4-methylphenyl)dimethoxysilane, bis(4-methylphenyl)diethoxysilane, bis(o-tolyl)dimethoxysilane, bis(o-tolyl)diethoxysilane, bis(m-tolyl)diethoxysilane, bis(m-tolyl)dimethoxysilane di(naphthalen-1-yl)dimethoxysilane, or di(naphthalen-1-yl)diethoxysilane.

4. The siloxane resin composition of claim 1 , further comprising:

third organic alkoxy silane having a silicon-based symmetric structure represented by the following Chemical Formula 4,

R 6 2 Si(OR 7 ) 2   [Chemical Formula 4]

wherein, in the above Chemical Formula 4,

R 6 comprises a linear, branched, or cyclic C 1-20 alkyl group, and

R 7 comprises a linear or branched C 1-7 alkyl group, and

a siloxane resin prepared with the first organic alkoxy silane, the second organic alkoxy silane, and the third organic alkoxy silane represented by the following Chemical Formula 5,

(R 1 a R 2 b SiO) x (R 4 2 SiO) y (R 6 2 SiO) z   [Chemical Formula 5]

wherein, in the above Chemical Formula 5,

1≤x, 1≤y, 1≤z, and x≤y+z.

5. The siloxane resin composition of claim 4 , wherein:

the third organic alkoxy silane comprises one or more of dimethyldimethoxysilane, dimethyldiethoxysilane, diisobutyldimethoxysilane, diisobutyldiethoxysilane, diisopropyldimethoxysilane, diisopropyldiethoxysilane, di-n-butyldimethoxysilane di-n-butyldiethoxysilane, di-n-propyldimethoxysilane, di-n-propyldiethoxysilane, dicyclopentyldimethoxysilane, or dicyclopentyldiethoxysilane.

6. The siloxane resin composition of claim 4 , wherein:

the sum of the molar content of the second organic alkoxy silane and the molar content of the third organic alkoxy silane is greater than the molar content of the first organic alkoxy silane, and the molar content of the second organic alkoxy silane is greater than the molar content of the third organic alkoxy silane.

7. The siloxane resin composition of claim 1 , further comprising:

a cross-linking agent.

8. The siloxane resin composition of claim 7 , wherein:

the cross-linking agent comprises at least one selected from the group consisting of vinyltetramethyldisiloxane, vinylpentamethyldisiloxane, 1,3-divinyl-1,3-diphenyl-1,3-dimethyldisiloxane, 1,3-divinyltetraphenyldisiloxane, 1,1,3,3-tetravinyldimethyldisiloxane, 1,3-divinyltetraethoxydisiloxane, 1,3-divinyltetrakis(trimethylsiloxy)disiloxane 1,3-divinyltetramethyldisiloxane, 1,3-diphenyltetrakis(dimethylsiloxy)disiloxane, hexamethyldisiloxane 1,5-divinyl-3,3-diphenyl-1,1,5,5-tetramethyltrisiloxane, 1,5-divinyl-3-phenylpentamethyltrisiloxane, 1,3,5-trivinyl-1,1,3,5,5-pentamethyltrisiloxane 2,4,6-trivinyl-2,4,6-trimethylcyclotrisiloxane, 2,4,6,8-tetravinyl-2,4,6,8-tetramethylcyclotetrasiloxane, octavinyl-T8-silsesquioxane, phenyltris(trimethylsiloxy)silane, phenyltris(dimethylsiloxy)silane, tris(trimethylsiloxy)silane, tris(vinyldimethylsiloxy)methylsilane, tris(vinyldimethylsiloxy)phenylsilane, tris(dimethylsiloxy)silane, divinylbenzene, p-divinylbenzene, vinyldimethylsilane, vinyltrimethylsilane, vinyltriethylsilane, vinyltriphenylsilane, vinyl-t-butyldimethylsilane, vinyl-di-n-octylmethylsilane, vinylphenylmethylsilane, vinylphenyldimethylsilane, divinyldimethylsilane, trivinylsilane, trivinylmethylsilane, tetravinylsilane, vinyldimethylmethoxysilane, vinylphenylmethylmethoxysilane, vinyldimethylethoxysilane, vinyldiphenylethoxysilane, vinylmethyldimethoxysilane, vinylmethyldiethoxysilane, vinylphenyldiethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyl triisopropoxysilane, vinyltri-t-butoxysilane, vinyltriisoprophenoxysilane, vinyltriphenoxysilane, vinyltris(2-methoxyethoxy)silane, vinyltris(methoxypropoxy)silane, trivinylmethoxysilane, trivinylethoxysilane, vinylmethylbis(trimethylsiloxy)silane, vinyltris(dimethylsiloxy)silane, vinyltris(trimethylsiloxy)silane, tetrakis(vinyldimethylsiloxy)silane, vinylmethyldiacetoxysilane, vinyltriacetoxysilane, 2-prophenyltrimethylsilane, (1-methoxyvinyl)trimethylsilane, 1,2-divinyltetramethyldisilane, 1,4-divinyltetramethyldisilylethane, 1,4-bis(vinyldimethylsilyl)benzene, 1-allyl-1,1,3,3-tetramethyldisiloxane, 1,3-diallyltetramethyldisiloxane and 1,3-diallyltetrakis(trimethylsiloxy)disiloxane, allyldimethylsilane, allyltrimethylsilane, allyltriisopropylsilane, allyltriphenylsilane, diallyldimethylsilane, diallyldiphenylsilane, triallylmethylsilane, tetraallylsilane, allyldimethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, allyltriphenoxysilane, allyltris(trimethylsiloxy)silane, 2,4,6,8-tetramethylcyclotetrasiloxane, octamethyl-T8-silsesquioxane, 1,1-bis(trimethylsilylmethyl)ethylene, 1,1-bis(trimethoxysilylmethyl)ethylene, methallyltrimethylsilane, diethoxymethylsilane, dimethoxymethylsilane, n-octadecylmethyldiethoxysilane, n-octadecyldimethylethoxysilane, n-octadecyldimethylmethoxysilane, n-octadecylmethyldimethoxysilane, n-octadecyldimethylsilane, n-octylmethyldiethoxysilane, n-octylmethyldimethoxysilane, n-octyldimethylmethoxysilane, n-octyldimethylethoxysilane, isobutylmethyldimethoxysilane, bis(trimethylsiloxy)methylmethoxysilane, tris(trimethylsilyl)silane, 1,2-diethoxytetramethyldisilane, phenyldimethylethoxysilane, n-propylmethyldimethoxysilane, n-propyldimethylmethoxysilane, methyltriethoxysilane, methyltrimethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, phenylmethyldimethoxysilane, phenylmethyldiethoxysilane, phenylethynetrimethylsilane, diphenylmethylethoxysilane, diphenylmethylmethoxysilane, diphenylmethylsilane, phenyldimethylsilane, 1,3-dimethyltetramethoxydisiloxane, tetrakis(dimethylsiloxy)silane, methyltris(methoxyethoxy)silane, ethyldimethylsilane, dimethylethoxysilane, tris(trimethylsiloxy)silane, tert-butyldimethylsilane, di-tert-butylmethylsilane, 1,1,2,2-tetramethyldisilane, 1,1,3,3,5,5-hexamethyltrisiloxane, 1,5-diethoxyhexamethyltrisiloxane, phenyltrimethylsilane, 1,4-bis(4-vinylphenoxy) butane, di-4-vinylbenzyl ether, divinyldiphenyl, divinylnaphthalene, 1-heptene, 1-octene, 1,4-pentadiene, 1,5-hexadiene, 1,6-heptadiene, 1,7-octadiene, 1,9-decadiene, and combinations thereof.

9. The siloxane resin composition of claim 1 , wherein:

the radical polymerization initiator comprises a peroxide radical polymerization initiator.

10. The siloxane resin composition of claim 9 , wherein:

the peroxide radical polymerization initiator comprises at least one selected from the group consisting of 2,3-dimethyl-2,3-diphenylbutane, tert-butyl-hydroperoxide, tert-amylhydroperoxide, cumylhydroperoxide, 1,1,3,3-tetramethylbutylhydroperoxide, isopropylcumylhydroperoxide, isopropylbenzene hydroperoxide, 2,5-dimethyl-2,5-di(tert-butylperoxy) hexyne-3,3,6,9-triethyl-3,6,9-trimethyl-1,4,7-triperoxonane, di(tert-butyl)-peroxide, 2,5-dimethyl-2,5-di(tert-butylperoxy) hexane, di(tert-butylperoxy-isopropyl)benzene, tert-butylcumylperoxide, di-(tert-amyl)-peroxide, dicumylperoxide, butyl4,4-di(tert-butylperoxy) valerate, tert-butylperoxybenzoate, 2,2-di(tert-butylperoxy) butane, tert-amylperoxy-benzoate, tert-butylperoxy-acetate, tert-butylperoxy-(2-ethylhexyl) carbonate, tert-butylperoxy isopropyl carbonate, tert-butylperoxy-3,5,5-trimethyl-hexanoate, 1,1-di(tert-butylperoxy)cyclohexane, tert-amylperoxyacetate, tert-amylperoxy-(2-ethylhexyl) carbonate, 1,1-di(tert-butylperoxy)-3,5,5-trimethylcyclohexane, 1,1-di(tert-amylpooxy)cyclohexane, tert-butyl-monoperoxy-malate, 1,1′-azodi(hexahydrobenzonitrile), tert-butylperoxy-isobutyrate, tert-butyl peroxydiethylacetate, tert-butylperoxy-2-ethylhexanoate, benzoyl peroxide, tert-amylperoxy-2-ethylhexanoate, di(3-methylbenzoyl) peroxide, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, ammonium peroxodisulfate, 2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy) hexane, 2,2′-azodi(2-methylbutyronitrile), 2,2′-azodi (isobutyronitrile), didecanoylperoxide, dilauroylperoxide, di(3,5,5-trimethylhexanoyl) peroxide, tert-amylperoxypivalrate, tert-butylperoxyneoheptanoate, 1,1,3,3-tetramethylbutyl peroxypivalate, tert-butylperoxypivalate, dicetylperoxydicarbonate, dimyristyl peroxydicarbonate, di(2-ethylhexyl)peroxydicarbonate, di(4-tert-butylcyclohexyl)peroxycarbonate, diisopropylperoxydicarbonate, tert-butylperoxyneodecanoate, di-sec-butylperoxydicarbonate, tert-amylperoxyneodecanoate, cumyl peroxyneoheptanoate, di(3-methoxybutyl)peroxydicarbonate, 1,1,3,3-tetramethylbutyl peroxyneodecanoate, cumylperoxyneodecanoate, diisobutyrylperoxide, and combinations thereof.

11. The siloxane resin composition of claim 1 , wherein:

a cured material of the siloxane resin composition has dielectric constant of 3.3 or less at a frequency of 10 GHz and dielectric loss of 0.005 or less at a frequency of 10 GHz.

12. The siloxane resin composition of claim 1 , wherein:

a cured material of the siloxane resin composition has hygroscopicity of 0.1% or less as measured based on ASTM D570 standard.

13. A siloxane resin manufacturing method, comprising:

preparing a mixture by mixing first organic alkoxy silane having a silicon-based asymmetric structure, second organic alkoxy silane having a silicon-based symmetric structure, third organic alkoxy silane having a silicon-based symmetric structure, and an acid or base catalyst;

carrying out a condensation reaction at 40° C. to 300° C. by agitating the mixture;

removing the acid or base catalyst; and

adding a peroxide radical polymerization initiator.

14. The siloxane resin manufacturing method of claim 13 , wherein:

the acid catalyst comprises one or more of hydrochloric acid, sulfuric acid, nitric acid, formic acid, acetic acid, toluenesulfonic acid, acetic acid, butyric acid, palmitic acid, oxalic acid, or tartaric acid.

15. The siloxane resin manufacturing method of claim 13 , wherein:

the base catalyst comprises one or more of an alkali metal compound, an alkaline-earth metal compound, a quaternary ammonium compound, ammonia, or an amine compound.

16. The siloxane resin manufacturing method of claim 13 , wherein:

the removing of the base catalyst comprises adding an organic solvent to dissolve siloxane and then separating the organic solvent, in which a siloxane resin is dissolved, from the base catalyst by a solvent extraction method.

17. A sheet, comprising a cured material for the siloxane resin composition according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 22, 2022
From: BAE, BYEONG-SOO; KANG, SEUNG-MO
To: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
Reel/Frame 059779/0634 →
Priority Claims (1)
KR 10-2021-0122305 · Sep 14, 2021 · national
Continuity (1)
Related Publication 20230078587A1 · Mar 16, 2023
References Cited (19)
US 4401500A · Hamada · 1983 [cited by examiner]
US 10299378B2 · Park · 2019 [cited by applicant]
US 10645806B2 · Chen et al. · 2020 [cited by applicant]
US 10765001B2 · Nakashima et al. · 2020 [cited by applicant]
US 11066548B2 · Umehara et al. · 2021 [cited by applicant]
US 20200115554A1 · Fukuda et al. · 2020 [cited by applicant]
CN 106947031 · 2017 [cited by applicant]
JP 2012111836A · 2012 [cited by examiner]
JP 2013053186 · 2013 [cited by applicant]
KR 1020110129587 · 2011 [cited by applicant]
KR 1020120058854 · 2012 [cited by applicant]
KR 1020160117052 · 2016 [cited by applicant]
KR 1020160117053 · 2016 [cited by applicant]
WO 2019221343 · 2019 [cited by applicant]
WO 2020138642 · 2020 [cited by applicant]
WO WO2021192100A1 · 2021 [cited by examiner]
Yong Ho Kim et al., “Thermally Stable Siloxane Hybrid Matrix with Low Dielectric Loss for Copper-Clad Laminates for High-Frequency Applications”, ACS Applied Materials & Interfaces 2016, 8, 13, 8335-8340, Mar. 16, 2016. [cited by applicant]
Xingrong Chen et al., “Cross-Linkable Fluorinated Polynorbornene with High Thermostability and Low Dielectric Constant at High Frequency”, ACS Applied Polymer Materials 2020, 2, 2, 768-774, Dec. 18, 2019. [cited by applicant]
Jiajia Wang et al., “A New Fluorinated Polysiloxane with Good Optical Properties and Low Dielectric Constant at High Frequency Based on Easily Available Tetraethoxysilane (TEOS)”, Macromolecules 2017, 50, 23, 9394-9402,… [cited by applicant]