Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board
A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.
1. A polyphenylene ether resin composition comprising:
a modified polyphenylene ether copolymer that is modified with a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of a polyphenylene ether copolymer;
a high-molecular-weight compound having a number-average molecular weight Mn ranging from 1000 to 10000, inclusive and having a glass transition temperature (Tg) of 20° C. or lower, the glass transition temperature being measured by differential scanning calorimetry; and
a crosslinking agent for the modified polyphenylene ether copolymer, the crosslinking agent including at least two carbon-carbon unsaturated double bonds per molecule, wherein:
the crosslinking agent includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate,
the high-molecular-weight compound includes a butadiene-styrene copolymer, and
the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound in a cured state of the polyphenylene ether resin composition.
2. The polyphenylene ether resin composition according to claim 1 , wherein the modified polyphenylene ether copolymer has a weight-average molecular weight ranging from 500 to 5000, inclusive, and
an average number of the substituent at a molecule chain end in the modified polyphenylene ether copolymer ranges from 1 to 3, inclusive.
3. The polyphenylene ether resin composition according to claim 1 , wherein the substituent at a molecular chain end of the modified polyphenylene ether copolymer is represented by following formula (1):
where
n represents an integer of 0 to 10, and
R 1 to R 3 independently represent a hydrogen atom or an alkyl group, wherein
Z represents either an arylene group or a carbonyl group when n equals 0, and
Z represents an arylene group when n is from 1 to 10.
4. The polyphenylene ether resin composition according to claim 1 , further comprising an inorganic filler.
5. The polyphenylene ether resin composition according to claim 4 , wherein the content ratio of the inorganic filler ranges from 40 parts by mass to 200 parts by mass, inclusive, relative to 100 parts by mass of a total of the modified polyphenylene ether copolymer, the high-molecular-weight compound, and the crosslinking agent.
6. The polyphenylene ether resin composition according to claim 1 , further comprising a reaction initiator.
7. The polyphenylene ether resin composition according to claim 1 , further comprising a flame retardant.
8. A prepreg comprising:
a resin layer including a half-cured product of the polyphenylene ether resin composition according to claim 1 ; and
a fibrous substrate provided in the resin layer.
9. A metal-clad laminate comprising:
a cured product of the prepreg according to claim 8 ; and
a metal foil provided on at least one surface of the cured product.
10. A printed wiring board comprising:
a cured product of the prepreg according to claim 8 ; and
a conductor pattern provided as a circuit on a surface of the cured product.