Methods and apparatus to reduce stress on lasers in optical transceivers
Methods and apparatus to reduce stress on lasers in optical transceivers are disclosed. An apparatus comprising a printed circuit board (PCB) having a first side and a second side opposite the first side; and a first stiffener attached to the first side of the PCB; and a photonic integrated circuit (PIC) attached to the first stiffener. The first stiffener is between the PIC and the PCB. The apparatus also includes a second stiffener attached to the second side of the PCB.
1. An apparatus comprising:
a printed circuit board (PCB) having a first side and a second side opposite the first side;
a first stiffener attached to the first side of the PCB;
a photonic integrated circuit (PIC) attached to the first stiffener, the first stiffener between the PIC and the PCB; and
a second stiffener attached to the second side of the PCB.
2. The apparatus of claim 1 , wherein the second stiffener is in alignment with the first stiffener and the PIC.
3. The apparatus of claim 1 , wherein a full length of an edge of the second stiffener is in alignment with an edge of the first stiffener in a direction normal to the first side of the PCB.
4. The apparatus of claim 1 , wherein more than half of a full perimeter of the second stiffener is in alignment with a perimeter of the first stiffener in a direction normal to the first side of the PCB.
5. The apparatus of claim 1 , wherein the second stiffener has a same thickness as the first stiffener.
6. The apparatus of claim 1 , wherein the second stiffener is a same size as the first stiffener.
7. The apparatus of claim 1 , wherein the second stiffener is smaller than the PIC.
8. The apparatus of claim 7 , wherein the PIC includes one or more laser channels, the one or more laser channels circumscribed by a first area, the second stiffener larger than the first area.
9. The apparatus of claim 1 , wherein the first and second stiffeners are ceramic stiffeners.
10. The apparatus of claim 1 , wherein the first stiffener is attached to the PCB with a first epoxy and the PIC is attached to the first stiffener with a second epoxy, the second epoxy different than the first epoxy.
11. The apparatus of claim 10 , wherein the first epoxy has a higher modulus of elasticity than the second epoxy.
12. An optical transceiver assembly comprising:
a photonic integrated circuit (PIC);
a first means for reducing stress in the PIC, the first stress reducing means to couple the PIC to a printed circuit board (PCB); and
a second means for reducing stress in the PIC, the first and second stress reducing means attached to opposite sides of the PCB.
13. The optical transceiver assembly of claim 12 , wherein the PIC is in stacked alignment with both the first and second stress reducing means.
14. The optical transceiver assembly of claim 12 , wherein the first stress reducing means covers a first area of the PCB, and the second stress reducing means covers a second area of the PCB.
15. The optical transceiver assembly of claim 14 , wherein at least a portion of a perimeter of the second area is aligned with a perimeter of the first area in a direction normal to the opposite sides of the PCB.
16. The optical transceiver assembly of claim 14 , wherein the second area is smaller than the first area.
17. The optical transceiver assembly of claim 14 , wherein the PIC includes one or more laser channels, and the second stress reducing means is positioned such that a perimeter of a projection of the second area onto to the PCB would completely surround a projection of the one or more laser channels.
18. The optical transceiver assembly of claim 12 , wherein the second stress reducing means is attached to the PCB with a first epoxy and the PIC is attached to the first stress reducing means with a second epoxy, the second epoxy different than the first epoxy.
19. The optical transceiver assembly of claim 18 , wherein the first epoxy has a higher modulus of elasticity than the second epoxy.
20. A method of assembling an optical transceiver assembly, the method comprising:
attaching a first stiffener to a first side of a printed circuit board (PCB);
attaching a second stiffener to a second side of the PCB, the first stiffener opposite the second stiffener; and
attaching a photonic integrated circuit (PIC) to the first stiffener.
21. The method of claim 20 , wherein the attaching of the second stiffener to the PCB occurs before the attaching of the first stiffener to the PCB.
22. The method of claim 21 , wherein the attaching of the first stiffener to the PCB occurs before the attaching of the PIC to the first stiffener.
23. The method of claim 20 , wherein the attaching of the first stiffener to the PCB employs a first epoxy and the attaching of the PIC to the first stiffener employs a second epoxy, the second epoxy having a lower modulus of elasticity than the first epoxy.
24. The method of claim 20 , wherein the PIC includes one or more laser channels, and the method further includes positioning the second stiffener to align, in a direction normal to a mounting surface of the PCB, with a portion of the PIC containing the one or more laser channels.
25. The method of claim 20 , further including positioning the second stiffener so that a full length of at least two edges of the second stiffener align with edges of the first stiffener.