Circuit module and RFID tag
A circuit module is provide that includes a substrate including a first surface and a second surface that are opposite to each other, an IC mounted on the first surface of the substrate, a circuit disposed on the first surface and the second surface of the substrate with a conductor pattern obtained by heat curing of conductive paste, and connected between the IC and an external circuit, and a dummy conductor pattern obtained by heat curing of the conductive paste, disposed on at least one of the first surface and the second surface of the substrate, and configured to maintain a balance of the conductive paste on the first surface and the second surface of the substrate.
1. A circuit module comprising:
a substrate including a first surface and a second surface that oppose each other;
an integrated circuit (IC) disposed on the first surface of the substrate;
a circuit disposed on the first surface and the second surface of the substrate and having a conductor pattern obtained by heat curing of a conductive paste;
a dummy conductor pattern obtained by heat curing of the conductive paste; and
a terminal electrode that overlaps the dummy conductor pattern in a plan view of the first surface of the substrate,
wherein the dummy conductor pattern is independent of and not in contact with the conductor pattern, and
wherein the dummy conductor pattern is disposed on at least one of the first surface and the second surface of the substrate and is configured to maintain a balance of the conductive paste on the first surface and the second surface of the substrate.
2. The circuit module according to claim 1 , wherein the circuit is connected between the IC and an external circuit.
3. The circuit module according to claim 1 , wherein the dummy conductor pattern is connected to the terminal electrode through an interlayer connection conductor.
4. The circuit module according to claim 1 , wherein the dummy conductor pattern is a identification mark.
5. The circuit module according to claim 1 , wherein the dummy conductor pattern comprises a plurality of dummy conductor patterns disposed on the first surface of the substrate that face a pair of antenna side terminal electrodes disposed on the second surface of the substrate, respectively, so as to interpose the substrate therebetween.
6. The circuit module according to claim 5 , wherein the plurality of dummy conductor patterns are not connected to and independent of the pair of antenna side terminal electrodes.
7. The circuit module according to claim 1 , wherein the dummy conductor pattern configures the substrate to maintain a flat shape.
8. A circuit module comprising:
a substrate including a first surface and a second surface that oppose each other;
an integrated circuit (IC) disposed on the first surface of the substrate;
a circuit disposed on the first surface and the second surface of the substrate and having a conductor pattern formed from a conductive paste;
a dummy conductor pattern formed from the conductive paste; and
a terminal electrode that overlaps the dummy conductor pattern in a plan view of the first surface of the substrate,
wherein the dummy conductor pattern is independent of and not in contact with the conductor pattern, and
wherein the dummy conductor pattern is disposed on at least one of the first surface and the second surface of the substrate and is configured to balance the conductive paste on the first surface and the second surface of the substrate.
9. The circuit module according to claim 8 , wherein the circuit is connected between the IC and an external circuit.
10. The circuit module according to claim 8 , wherein the dummy conductor pattern is connected to the terminal electrode through an interlayer connection conductor.
11. The circuit module according to claim 8 , wherein the dummy conductor pattern is a identification mark.
12. The circuit module according to claim 8 , wherein the dummy conductor pattern comprises a plurality of dummy conductor patterns disposed on the first surface of the substrate that face a pair of antenna side terminal electrodes disposed on the second surface of the substrate, respectively, so as to interpose the substrate therebetween.
13. The circuit module according to claim 12 , wherein the plurality of dummy conductor patterns are not connected to and independent of the pair of antenna side terminal electrodes.
14. The circuit module according to claim 8 , wherein the dummy conductor pattern configures the substrate to maintain a flat shape.
15. An RFID tag comprising:
an antenna including two conductor patterns disposed on a flexible insulating film; and
a circuit module disposed on the insulating film, and connected to or combined with the antenna, the circuit module including:
a substrate including a first surface and a second surface that oppose each other;
an RFIC disposed on the first surface of the substrate;
an impedance matching circuit disposed on the first surface and the second surface of the substrate and having a conductor pattern obtained by heat curing of a conductive paste;
a dummy conductor pattern obtained by heat curing of the conductive paste; and
a terminal electrode that overlaps the dummy conductor pattern in a plan view of the first surface of the substrate,
wherein the impedance matching circuit is connected between the RFIC and an external circuit,
wherein the dummy conductor pattern is independent of and not in contact with the conductor pattern, and
wherein the dummy conductor pattern is disposed on at least one of the first surface and the second surface of the substrate and is configured to maintain a balance of the conductive paste on the first surface and the second surface of the substrate.
16. The RFID tag according to claim 15 , further comprising:
an interlayer connection conductor electrically connected to the dummy conductor pattern;
wherein the dummy conductor pattern is connected to the terminal electrode through the interlayer connection conductor.